• Journal of Welding and Joining
• /
• 제7권3호
• /
• pp.36-43
• /
• 1989

The furnace brazing in a Ar of copper to martensitic stainless steel(13.5Cr) using Cu-(5~8%)P-(0~8%)Sn powders was investigated. Shear strength, wettability, reacted layer, defect ratio at the stainless steel interface was evaluated. As Sn was added to the Cu-P powders, defect ratio and P content at the stainless steel interface decreased. And also as Sn was added, defect form at the stainless steel interface changed from the continuous layer to the discrete type, and shear strength of the brazed joint increased.

• 한국분말재료학회지
• /
• 제9권4호
• /
• pp.227-234
• /
• 2002

For the austenitic stainless steel (304L) manufactured by metal injection molding(MIM), the effects of copper content and sintering temperature on the mechanical properties, antibacterial activities, corrosion resistance, and electric resistances were investigated. The specimens were prepared by injection molding of the premixed powders of water-atomized 304 L and Cu with poly-acetyl binders. The green compacts were prepared with various copper contents from 0 to 10 wt.% Cu, which were debound thermally at 873 K for 7.2 ks in $N_2$gas atmosphere and subsequently sintered at various temperatures from 1323 K to 1623 K for 7.2 ks in Ar gas atmosphere. The relative density and tensile strength of the sintered compacts showed the minimum values at 5 and 8 wt.% Cu, respectively. Both the relative density and the tensile strength of the specimen with 10 wt.% Cu sintered at 1373 K showed the highest values, higher than those of copper-free specimen. Antibacterial activities investigated by the plastic film contact printing method for bacilli and the quantitative analysis of copper ion dissolved in water increased as the increase of the copper content to stainless steels. It was also verified by the measurement of pitting potential that the copper addition in 304 L could improve the corrosion resistance. Furthermore the electric conductivity increased with the increase of copper content.

• 한국세라믹학회지
• /
• 제11권1호
• /
• pp.3-9
• /
• 1974

The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

• 한국응용과학기술학회지
• /
• 제31권1호
• /
• pp.66-73
• /
• 2014

전형적인 3-전극 시스템의 순환전압전류법을 사용하여 알킬기를 가진 에탄올아민 용액 중에서 스테인리스에 대한 전류-전압 곡선을 측정하였다. 스테인리스는 작업 전극으로, Ag/AgCl 전극은 기준 전극으로, 그리고 백금선은 상대 전극으로 각각 사용하였다. N-에틸에탄올아민과 N,N-디메틸에탄올아민 용액에서의 스테인리스의 C-V특성은 순환전압전류법으로부터 산화전류에 기인한 비가역 공정으로 나타났다. 부식억제제의 확산계수의 효과는 각각 농도 증가에 따라 감소하였다. 금속의 SEM 이미지로부터 0.5 N의 전해질에서 부식억제제인 N,N-디에틸에탄올아민 ($1.0{\times}10^{-3}M$)을 첨가한 경우, 구리와 니켈에서 부식억제 효과가 향상되었다.

• 한국주조공학회지
• /
• 제39권6호
• /
• pp.103-109
• /
• 2019

Cu-added SKD11 was manufactured through the casting process and the effects of Cu addition with different contents (0, 1, 2 and 3 wt%) and aging treatment on microstructure, mechanical characteristics such as tensile strength and hardness, and thermal conductivity were investigated. The microstructure was analyzed by FE-SEM and XRD, the mechanical characteristics by Rockwell hardness tester and Tensile tester, and the thermal conductivity by Laser flash. As a result, SKD11 containing Cu had higher hardness than as-received SKD11. The hardness of as-cast SKD11 containing 1 wt% Cu was 42.4 HRC, whereas the hardness of asreceived SKD11 cast alloy was 19.5 HRC, indicating that the hardness was greatly improved when Cu was added. In the case of tensile strength, Cu-added SKD11 cast alloy had lower tensile strength than as-received SKD11, and the tensile strength tended to increase as Cu content increased. After heat treatment, however, tensile strength of as-received SKD11 was significantly increased, whereas in the case of Cu-added SKD11, as the Cu contents increased, the tensile strength increased less and even reduced at 3 wt% Cu. The thermal conductivity of Cu-added SKD11 cast alloy was about 13 W m^-1 K^-1, which was lower than that of the asreceived SKD11 cast alloy (28 W m^-1 K^-1). After the heat treatment, however, the thermal conductivity of as-received SKD11 was reduced, while the thermal conductivity of the SKD11 added with Cu was increased. Thermal conductivity was generally larger with less Cu content, and this tendency became more pronounced after heat treatment.