• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2003년도 하계학술대회 논문집 C
• /
• pp.1463-1465
• /
• 2003

In this paper, we studied on the growing characteristics of dendrite structure of melted wire deteriorated by over current. Electric wire was melted by Jolue's heat. By using HSIS(High Speed Imaging System), we found out a lot of melted parts of wire were dispersed and radiated. Electric wire had narrow melted areas in case of short fusing time. A lot of very small dots generated around the grain of copper cross-section and they were changed into dendrite structure. Dendrite structure appeared at the values lower than 2.5[A/sec]. In case of very short fusing time, fusing current was calculated by empirical formula. The Preece equation was not enough to analyze a variety of characteristics of melted wire because it did not consider melting time, atmosphere, etc.

• 공업화학
• /
• 제2권3호
• /
• pp.193-198
• /
• 1991

후막 구리도체는 귀금속계 도체에 비하여 가격이 저렴하고 전기전도도, 납땜성, 땜납 침식저항, 와이어 본딩성등의 양호한 성질 때문에 매우 중요성을 갖는다. 그러나 우수한 후막 구리도체를 형성하는 것은 구리가 높은 온도에서 쉽게 산화하는 성질로 인해 상당히 복잡하다. 양호한 구리후막을 얻기 위하여 하이브리드 마이크로회로업계는 질소분위기, 반응성분위기 또는 공기분위기를 사용한다. 이 글에서는 후막 구리도체의 소성공정과 세종류의 소성분위기에 대하여 종합적으로 고찰하였다.

• Corrosion Science and Technology
• /
• 제16권5호
• /
• pp.227-234
• /
• 2017

Reference electrodes are generally implemented for the purpose of monitoring the cathodic protection potentials of buried or immersed metallic structures. In the market, many types of reference electrodes are available for this purpose, such as saturated calomel, silver/silver chloride and copper/copper sulfate. These electrodes contain a porous ceramic junction plate situated in the cylindrical body bottom to permit ionic flux between the internal electrolyte (of the reference electrode) and the external electrolyte. In this work, the copper/copper sulfate reference electrode was modified by replacing the porous ceramic junction plate for a metallic platinum wire. The main purpose of this modification was to avoid the ion copper transport from coming from the inner reference electrode solution into the surrounding electrolyte, and to mitigate the copper plating on the coupon surfaces. Lab tests were performed in order to compare the performance of the two mentioned reference electrodes. We verified that the experimental errors associated with the measurements conducted with developed reference electrode would be negligible, as the platinum surface area exposed to the surrounding electrolyte and/or to the reference electrolyte are maintained as small as possible.

• 대한금속재료학회지
• /
• 제56권12호
• /
• pp.861-869
• /
• 2018

To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at $200^{\circ}C$, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at $400^{\circ}C$, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at $900^{\circ}C$ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at $900^{\circ}C$, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at $200^{\circ}C$, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.

• Transactions on Electrical and Electronic Materials
• /
• 제14권1호
• /
• pp.20-23
• /
• 2013

When applying superconducting wire to power machines, an investigation needs to be carried out on the characteristics of wire phase changes in connection with the insulating layer. This study examined trends in the increase of the wire's resistance and the characteristics of its recovery from quenching by a current-applied cycle at temperatures of 90 K, 180 K, and 250 K. The procedure was conducted based on the thickness and presence (or absence) of the insulating wire layers. To achieve this, YBCO thin-film wires with the same critical temperatures were prepared with copper and stainless steel stabilizing layers. At levels (-one, three, and five-), with superior performance, polyimide pressure-sensitive adhesive tape was attached to the wires at a very low temperature. The eight prepared test samples were wound around the linear frames. The wire's voltage and current created from the phase change characteristics were measured at the wire's prescribed temperature, using the four-point probe method. The wire's resistance and recovery characteristics were examined for each cycle at temperatures of 90 K, 180 K, and 250 K.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
• /
• pp.537-542
• /
• 2000

Wire deflection, surface roughness and roundness were observed on changing discharge time for electrical discharge machining(EDM) of STD-11 in various conditions of thickness. The wire deflection was decreased as increasing discharge time and wire tension. The deflection is the smallest at the speed of wire of 10.6m/min and the water specific resistivity of 5k$\Omega$.cm. The deflection is found to be decreased as increasing dwell time. But if the water pressure is high, it is found not to be changed after the vibration of 4sec. The component of copper(Cu) and zinc(Zn), which is the main material of wire electrode, is observed for rough wire-cutting EDM of STD-11. This phenomena is found to be similar in spite of the change of EDM energy level. But it will be improved by changing the material and the shape of wire. The roundness of middle is found to be worse than that of upper and it is increased as the thickness of material is increased.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.609-612
• /
• 2001

To investigate the magnetic field distribution of power line, we used amorphous wire sensor. And we discuss extremely low frequency magnetic field distribution dependent upon arrangement of power line and shielding pipe made from iron or alumimum materials by both measurement and FEM(Finite Element Method) analysis. Appling current of single phase 60 [Hz] 15 [A] is supplied to copper wire coated enamel resign. As the results, we confirmed that linear characteristics of amorphous wire sensor is very excellent and measurement value agrees with FEM calculation. Magnetic field distribution due to shielding materials is changed by permeability and conductivity.

• 전기학회논문지P
• /
• 제57권3호
• /
• pp.332-337
• /
• 2008

We analyzed carbonization pattern and crystal structure of polyvinyl chloride wire by thermal stress. Copper that is oxidized at normal temperature is a reddish brown. If under the thermal stress range of 500 to 700 [$^{\circ}C$], carbonization and exfoliation occurrence. Section structure of electric wire is same as arrangement of particle in metallograph analysis. But, as thermal stress increases, size of particle is enlarged. Electric wire displays elongation structure in SEM image analysis and elongation structure collapses when receive thermal stress at 300 [$^{\circ}C$]. In EDX analysis, we get the spectra of CuL, CuK, OK, and ClK. FT-IR analysis was shown new spectra with in range of $1,440{\sim}1,430\;[cm^{-1}]$, 1,340 [$cm^{-1}$], 1,240 [$cm^{-1}$].

• 마이크로전자및패키징학회지
• /
• 제26권4호
• /
• pp.7-13
• /
• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• Transactions on Electrical and Electronic Materials
• /
• 제17권4호
• /
• pp.231-234
• /
• 2016

The AC insulation breakdown voltage was investigated for seven types of winding coils made of polyamideimide (PAI), flexural PAI (nanosilica 5 wt%) and anti-corona PAI (nanosilica 15 wt%) wires with various winding coil diameters of φ5, φ15 and φ25 mm. The winding coil was made of enameled wire with an enamel thickness of 30~50 μm, and the rectangular copper wire had a thickness of 0.77~ to 0.83 mm and width of 1.17~ to 1.23 mm, respectively. The insulation breakdown voltages of the original PAI coils with diameters of φ5, φ15 and φ25 mm were 7.30, 6.58, and 5.95 kV, respectively, and those values decreased as the winding coil diameter increased, regardless of the wire types.