• 한국표면공학회지
• /
• 제56권3호
• /
• pp.192-200
• /
• 2023

Graphene, a two-dimensional material, has shown great potential in a variety of applications including microelectronics, optoelectronics, and graphene-based batteries due to its excellent electronic conductivity. However, the production of large-area, high-quality graphene remains a challenge. In this study, we investigated graphene growth on electrolytic copper foil using thermochemical vapor deposition (TCVD) to achieve a similar level of quality to the cold-rolled copper substrate at a lower cost. The combined effects of pre-annealing time, graphenized temperature, and partial pressure of hydrogen on graphene coverage and domain size were analyzed and correlated with the roughness and crystallographic texture of the copper substrate. Our results show that controlling the crystallographic texture of copper substrates through annealing is an effective way to improve graphene growth properties, which will potentially lead to more efficient and cost-effective graphene production. At a hydrogen partial pressure that is disadvantageous in graphene growth, electrolytic copper had an average size of 8.039 ㎛², whereas rolled copper had a size of 19.092 ㎛², which was a large difference of 42.1% compared to rolled copper. However, at the proper hydrogen partial pressure, electrolytic copper had an average size of 30.279 ㎛² and rolled copper had a size of 32.378 ㎛², showing a much smaller difference of 93.5% than before. This observation suggests this potentially leads the way for more efficient and cost-effective graphene production.

• Corrosion Science and Technology
• /
• 제20권5호
• /
• pp.249-255
• /
• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• 폴리머
• /
• 제27권3호
• /
• pp.235-241
• /
• 2003

항균 활성이 없는 폴리아크릴로나이트릴계 활성 탄소 섬유에 항균 활성을 부여하기 위해 반응성이 큰 전이금속인 구리를 전해도금 방식으로 도입시켜, 활성 탄소 섬유의 항균 활성 및 기공 특성에 미치는 영향을 고찰해 보았다. 항균 활성 시험은 병원성 제균으로서 그람 양성균인 황색 포도상 구균 (Staphylococcus aureus)과 비병원성의 그람 음성균인 대장균 (Klebsiella pnemoniae)을 대상으로 그 효과를 측정하였으며, 활성 탄소 섬유의 기공 특성은 BET식, Boer의 t-plot, 그리고 H-K식을 이용하여 확인하였다. 도입되는 구리의 양이 많아질수록 활성 탄소 섬유의 비표면적, 총 기공 부피, 미세기공 부피 등이 감소되는 것이 관찰되었으며, 반면 항균 활성은 S. aureus 및 K. pnemoniae에서 증가되었다.

• 공업화학
• /
• 제9권7호
• /
• pp.956-960
• /
• 1998

Cu와 Zn의 몰비가 1/2, 1/1, 2/1인 촉매를 제조하여 메탄올 수증기 개질반응의 활성을 측정하고, 가장 좋은 활성을 보이는 Cu/Zn의 몰비가 2/1인 촉매를 선정하여 $TiO_2$의 첨가량을 달리하여, 메탄올 수증기 개질반응에 대한 활성을 측정하였다. 반응의 압력은 상압, 온도는 $250^{\circ}C$, 수증기/메탄올 몰비 1.5, 접촉시간 0.1 g-cat.hr/mL-feed의 조건에서 활성을 비교한 결과, $TiO_2$의 첨가량이 3 mol%인 촉매의 경우 최대 전화율을 보였고, 전범위에서 수소로의 선택도는 매우 높았다. 촉매의 특성 분석결과 촉매의 비표면적보다는 $N_2O$흡착, 분해방법에 의한 금속구리의 비표면적의 영향이 더욱 큼을 알 수 있었고, 적정 $TiO_2$의 첨가로 금속구리의 비표면적을 높일 수 있었다. XRD, XPS분석결과 반응중에 아연의 산화상태는 달라지지 않으나, 구리는 대부분이 0가와 1가의 상태로 존재함을 확인하였다.

• 한국표면공학회지
• /
• 제54권5호
• /
• pp.207-212
• /
• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2001년도 제4회 압출 및 인발가공 심포지엄
• /
• pp.55-62
• /
• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

• 한국재료학회지
• /
• 제16권2호
• /
• pp.111-115
• /
• 2006

High-finned tubes have good thermal conductivity and have better cooling efficiency than plain tubes or low-fined tubes due to bigger air contact area. During high-fined tubes are manufactured by roll forming, the main technique is illustrated to optimizing primary material(copper pipe), optimized die matrix designing technique for roll forming, control manufacturing speed to develop productivity etc. In this study, a roll forming system was developed in oder to produce high-finned tube. Also a multi-step roll forming die was designed & built to produce high-finned tube that has over 10 mm fin height. And then, roll forming test using copper pipe was performed to produce high-finned tube. Roll forming process for producing highfinned tube was optimized by analyzing and adjusting misrostructure, hardness, and surface roughness of roll formed high-fined tube.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2012년도 춘계학술발표대회
• /
• pp.58.1-58.1
• /
• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.621-622
• /
• 2005

Copper is widely used in electric wire, cable, conductor in electric devices. As the demand for electric power is increasing rapidly, electric power devices are getting amazingly bigger and complicated. The using of light-weight conductor can reduce the size and making cost of the electric devices. In high-frequency application, Electric current the current in a conductor tends to shift to the surface of the conductor, resulting in an uneven current distribution in the inner conductor. In the extreme case the current may essentially concentrate in the "skin" of the inner conductor as a surface current. In high frequency application, therefore, inner area of copper conductor may replace with aluminum conductor, which reduces the weight of conductor. This paper describes the manufacture and evaluation of composite conductors made of copper and aluminum.

• 대한안전경영과학회지
• /
• 제19권4호
• /
• pp.317-322
• /
• 2017

When the heat flux on the heating surface following changing heat condition in the boiling heat transfer system exceeds critical heat flux, the critical heat flux phenomenon is going over to immediately the film boiling area and then it is occurred the physical destruction phenomenon of various heat transfer systems. In order to maximize the safe operation and performance of the heat transfer system, it is essential to improve the CHF(Critical Heat Flux) of the system. Therefore, we have analysis the effect of improving CHF and characteristics of heat transfer following the nanoparticle coating thickness. As the results, copper nanocoating time are increased to CHF, and in case of nano-coatings are increased spray-deposited coating times more than in the fure water; copper nanopowder is increased up to 6.40%. The boiling heat transfer coefficients of the pure water are increased up to 5.79% respectively. Also, the contact angle is decreased and surface roughness is increased when nano-coating time is increasingly going up.