• Journal of the Korean institute of surface engineering
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• v.57 no.4
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• pp.274-284
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• 2024

In this study, copper foil was electroplated under high current density conditions. We used Polyethylene Glycol (PEG), known for its thermal stability and low decomposition rate, as an inhibitor to form a stable and smooth copper layer on the titanium cathode. The electrolyte was composed of 50 g/L CuSO₄ and 100 g/L H₂SO₄, MPSA as an accelerator, JGB as a leveler, and PEG as a suppressor, and HCl was added as chloride ions for improving plating efficiency. The copper foil electroplated in the electrolyte added PEG which induced to inhibit the growth of rough crystals. As a result, the surface roughness value was reduced, and a uniform surface was formed over a large area. Moreover, the addition of PEG led to priority growth to the (111) plane and the formation of polygonal crystals through horizontal and vertical growth of crystals onto the cathode. In addition, the grains became fine when more than 30 ppm of PEG was added. As the microcrystalline structure changed, mechanical and electrical properties were altered. With the addition of PEG, the tensile strength increased due to grain refinement, and the elongation was improved due to the uniform surface. However, as the amount of PEG added increased, the corrosion rate and resistivity increased due to grain refinement. Finally, it was possible to manufacture a copper foil with excellent electrical and mechanical properties and the best surface properties when electroplating was carried out under the condition of additives with Cl-20 ppm, MPSA 10 ppm, JGB 5 ppm, and PEG 10 ppm.

• Journal of the Mineralogical Society of Korea
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• v.17 no.1
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• pp.1-9
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• 2004

Copper(II) sorbed on kaolinite (KGa-lb) was studied using electron paramagnetic resonance (EPR) and extended X-ray absorption fine structure (EXAFS) spectroscopy. The sorbed copper(II) had an isotropic EPR signal with $g_{iso}\;=\;2.19$ at room temperature. At 77 K, the isotropic signal converted to an axially symmetric anisotropic signal with $g_{\$\mid$}\;=\;2.40,\;g_{\bot}\;=\;2.08,\;and\;A_{\$\mid$}\;=\;131\;G$. These EPR results suggest that the sorbed copper(II) forms an outer-sphere surface complex with a tetragonally distorted $CuO_{6}$ octahedral structure on the kaolinite. In the sorption measurement, the amount of sorbed copper increased with increasing pH of the solution. However, the intensity of the isotropic EPR line was not directly proportional to the amount of sorbed copper. This discrepancy was resolved by assuming the formation of a surface precipitate at higher pH that is invisible by EPR. The EXAFS data confirmed the existence of the surface precipitate. The best fit for the EXAFS of the sorbed copper showed that each copper on the kaolinite had 6.8 copper neighbors located $3.08\;{\AA}$ from it, in addition to the first shell oxygen neighbors, including 4 equatorial O at $1.96\;{\AA}$ and 2 axial O at $2.31\;{\AA}$. This work shows that the local environment of the copper sorbed on the kaolinite changes as a function of pH and surface loading, and that the EPR and EXAFS are useful in studying such changes.

• Corrosion Science and Technology
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• v.13 no.1
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• pp.6-14
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• 2014

Copper metal is widely used in tubes installed in sprinkler water services because of its excellent corrosion resistance. Copper corrosion is considered to be insignificant in water system and the incident of copper pipeline failure is relatively low. However, pitting corrosion is a major problem with all copper tubes. In this study, leaked sprinkler copper tubes were collected from three different locations and examined on the causes of pitting corrosion of copper tubes in sprinkler water plumbing systems. Electrochemical tests such as potentiodynamic polarization, as well as surface and chemical analyses were performed. Results show that pitting corrosion of copper tubes were found as Type I pitting that the carbon film formed on the copper tubes have a harmful effects, causing the pinhole failure in the pipe and resulting in leakage of water. The contermeasures on Type I pitting corrosion of copper tubes were proposed.

• Corrosion Science and Technology
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• v.6 no.4
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• pp.198-205
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• 2007

The initial stages of electrochemical oxidative CuI film formation on Cu(111), as studied by means of Cyclic Voltammetry (CV), in-situ Scanning Tunneling Microscopy (STM) and ex-situ Synchrotron X-ray Photoemission Spectroscopy (SXPS), indicate a significant acceleration of copper oxidation in the presence of iodide anions in the electrolyte. A surface confined supersaturation with mobile CuI monomers first leads to the formation of a 2D-CuI film via nucleation and growth of a Cu/I-bilayer on-top of a pre-adsorbed iodide monolayer. Structurally, this 2D-CuI film is closely related to the (111) plane of crystalline CuI (zinc blende type). Interestingly, this film causes no significant passivation of the copper surface. In an advanced stage of copper dissolution a transition from the 2D- to a 3D-CuI growth mode can be observed.

• Advances in nano research
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• v.9 no.2
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• pp.113-122
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• 2020

Surface-Enhanced Raman Scattering (SERS) spectroscopy is a multifaceted surface sensitive methodology which exploits spectroscopy-based analysis for various applications. This technique is based on the massive amplification of Raman signals which were feeble previously in order to use them for appropriate identification at qualitative and quantitative in chemical as well as biological systems. This novel powerful technique can be utilized to identify pathogens such as bacteria and viruses. As far as SERS is concerned, one of the most studied problems has been functionalization of SERS active substrate. Metal colloids and nanostructures or microstructures synthesized using noble metals such as Au, Ag and Cu are considered to be SERS active. Silver and gold are extensively used as SERS active substrates due to chemical inertness and stability in air compare to copper. However, use of Cu as a suitable alternative has been taken into account as it is cheap. Herein, we have synthesized air-stable copper microstructures/nanostructures by chemical, electrochemical and microwave-assisted methods. In this paper, we have also discussed the use of as synthesized copper micro/nanostructures as inexpensive yet effective SERS active substrates for the fast identification of micro-organisms like Staphylococcus aureus and Escherichia coli.

• Journal of the Korean Applied Science and Technology
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• v.31 no.2
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• pp.176-182
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• 2014

Using alkali treatment solution, neutrality treatment solution and acid treatment solution, the surface corrosion layer of copper plates and bronze plates that have been artificially corroded using HCl, $H_2SO_4$ and $HNO_3$ solutions were removed. In the case of alkali treatment solution, only air oxidation in the form of black tenorite and white cuproous chloride remained without being removed. In the case of using a neutrality treatment solution, a anhydrous type layer of reddish brown cupric chloride remained without being removed, together with this black and white corrosion substance. In the case of using an acid treatment solution, this red corrosion substance also remained, but all of the oxide was removed on the surface of the specimen that was treated by alternatively using alkali treatment solution and acid treatment solution. In the case of this treatment solution with the order of alkali-acid, oxidation no longer proceeded only through the distilled water cleaning process after treatment, thereby showing that oxidation from the cleaning solution no longer proceeded.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.103-110
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• 1993

Abstract It has been attempted to make the copper-graphite composites by deposition of copper on the surface of graphite through the hydrogen reduction of copper chlorides. Both KISH and natural graphites of less than 325 mesh were used as substrates and the hydrogen reduction also was conducted in the range of 350-50$0^{\circ}C$. The distribution of copper on the surface of graphite was found to increase with the decrease of reduction temperature. In addition. the partial pressure of hydrogen played an important role in the overall rate of reduction which was substantially dominated by the chemical reaction on the surface of each particle. It was concluded that the reduction temperature should be maintained as low as possible to accomplish the well distribution of copper in the composites.

• Applied Chemistry for Engineering
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• v.35 no.2
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• pp.96-99
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• 2024

A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.619-620
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.291-292
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• 2010