• International Journal of Advanced Culture Technology
• /
• v.3 no.1
• /
• pp.145-152
• /
• 2015

The article aims to apply a friction stir spot welding for producing the lap joint between AA5052 aluminum alloy and C11000 copper alloy. The dimension of the materials was 100 mm in length, 30 mm in width and 1.0 mm in thickness. The copper plate was set overlap the aluminum plate by 30 mm. The welding parameter was the rotating speed of 2500-4000 rpm, the pin inserting rate of 2-8 mm/min and the holding time of 6 sec. The mechanical properties test and the microstructure investigation were performed to evaluate the lap joint quality. The summarized results are as follows. The friction stir spot welding could produce effectively the lap joint between AA5052 and C11000 copper. Increase of the rotating speed and holding time directly affected to decrease the tensile shear strength of the lap joint. The optimized welding parameters in this study that indicated the tensile shear strength of 864 N was the rotating speed of 3500 rpm, the pin inserting rate of 6 mm/min and the holding time of 4sec. The experimental results also showed that the hardness of the weld metal was lower than that of the base materials.

• Journal of Korean Society for Atmospheric Environment
• /
• v.25 no.4
• /
• pp.255-263
• /
• 2009

The antifungal activity of silver, copper, and titania nanoparticles against fungal spores was investigated. Cladosporium cladosporioides spores were aerosolized and sampled on a solid agar plate using an Anderson impactor. The solid agar plate contained different concentration of nanoparticles ranging from 0 to $500{\mu}g/mL$. Silver and copper nanoparticles were shown to be an effective antifungal agent, while titania nanoparticles were not. Antifungal activity of these effective nanoparticles appeared at $300{\mu}g/mL$ concentration.

• Journal of Industrial Technology
• /
• v.20 no.B
• /
• pp.77-86
• /
• 2000

In order to observe the pattern forming of copper plate and chemical corrosion reaction, a study on the effect of the process parameters on the formation of micro-pattern by a photochemical etching of copper plate was carried out. The results are as follows : 1) Etching rate increases as the concentration of etchant increases under the regular condition of the temperature by the increasing of diffusion rate to surface. 2) Etching rate increases as the temperature of etchant increases by the fast acting of the material delivery of diffusion to surface under the regular condition of concentration. 3) It was found that etching speed increases as the material delivery of convection rising increased when the aeration speed of etchant increases. This result was from the fact acted by the material delivery of convection rising rather than material delivery of diffusion to the surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.65-68
• /
• 1999

A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

• Proceedings of the KIEE Conference
• /
• 2009.07a
• /
• pp.2067_2068
• /
• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of computational fluids engineering
• /
• v.17 no.3
• /
• pp.99-107
• /
• 2012

In this paper, the shock waves in compressible solids and liquids are simulated using a six-equation diffuse interface multiphase flow model that is extended to the Cochran and Chan equation of state. A pressure relaxation method based on a volume fraction function and a pressure-correction equation are newly implemented to the six-equation model. The developed code has been validated by a shock tube problem with liquid nitromethane and an impact problem of a copper plate on a solid explosive. In addition, a new problem, an impact of a copper plate on liquid nitromethane, has been solved. The present code well shows the wave structures in compressible solids and liquids without any numerical oscillations and overshoots. After the impact of a solid copper plate on liquid, two shock waves (one propagates into liquid and the other into solid) are generated and a material interface moves to the impacting direction. The computational results show that the shock velocity inside the liquid linearly increases with the impact velocity.

• Proceedings of the KSME Conference
• /
• 2004.04a
• /
• pp.1358-1363
• /
• 2004

The objective of this work is to propose calibration facility in which a thin film type heat flux sensor can be calibrated under convective flow condition by using a small wind tunnel with the constant temperature plate condition. A small wind tunnel has been built to produce a boundary layer shear flow above a constant temperature copper plate. 12-independent copper blocks, thin film heaters, insulators and temperature controllers were used to keep the temperature of flat plate constant at a specified temperature. Three commercial thin film-type heat flux sensors were tested. Convective calibrations of these gages were performed over the available heat flux range of $1.4{\sim}2.5kW/m^2$. The uncertainty in the heat flux measurements in the convective-type heat flux calibration facility was ${\pm}2.07%$. Non-dimensional sensitivity is proposed to compare the sensitivity calibrated by manufacturer and that of experiment conducted in this study.

• Journal of the Korean Solar Energy Society
• /
• v.26 no.3
• /
• pp.9-16
• /
• 2006

A solar collector surface coated with a low emission material is still imported from other developed countries expensively. Thus it is very significant to develop a new coating method with a cheap alternative coating material instead of the imported high-cost collector surface. A thermal spray method was adopted to coat a cheap Titania on a copper plate. Generally, a new coating on the copper plate was conducted successfully by selecting a proper ratio of carbon and acetylene. By measuring an absorption rate of solar and heat emission rate, all the plate types gained a high absorption rate of 98% approximately, more or less, but all of the types still have a high emission. Finally it was clear that more research is needed to advance the coated-plate to subdue the high emission from the hot plate surface and the higher the Titania's proportion is, the lower the emission is on the surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.11a
• /
• pp.380-383
• /
• 2003

The purpose of this study is to develope prototype EPID system and improve image quality of radiation therapy field imaging system using CCD camera. For this research we used Linac(Clinac 4/100), Copper metal plate, $Gd_2O_2S_2$ phosphor and CCD camera(Photronic). In this study we find best thickness of buil-up metal plate and acquired projection image of humanoid head phantom. Also we enhanced raw image data using superposition and histogram stretching method. Through the thickness optimized of metal plate and image processing, we confirmed of an improved image quality of an EPID system using CCD camera. As result, highest quality image was acquired at 1mm thickness of Copper metal plate and improved image quality by image processing methods.

• Corrosion Science and Technology
• /
• v.16 no.5
• /
• pp.247-256
• /
• 2017

The feasibility of using hydrazine for inhibiting pitting corrosion in copper sprinkler tubes was investigated by examining microscopical and structural evolution of corrosion by-products with SEM, EDS, and XRD. Hydrazine removed dissolved oxygen and reduced CuO and $Cu_2O$ as well. The stable phase was changed from CuO to $Cu_2O$ or Cu depending on hydrazine concentration. Hydrazine concentration of 500 ppm could convert all CuO corrosion by-products to $Cu_2O$. In a tightly sealed acryl tube filled with aqueous solution of 500 ppm hydrazine, octahedral $Cu_2O$ particles were formed while plate-like structures with high concentration of Cu, O, N and C were formed near a corrosion pit. The inside structure of a corrosion pit was not altered by hydrazine aqueous solution. Uniform corrosion of copper was almost completely stopped in aqueous solution of 500 ppm hydrazine. Corrosion potential of a copper plate was linearly dependent on log (hydrazine concentration). The concept of stopping pitting corrosion reaction by suppressing oxygen reduction reaction could be verified by applying this method to a reasonable number of real sprinkler systems before full-scale application.