• Transactions of Materials Processing
• /
• 제27권1호
• /
• pp.37-47
• /
• 2018

In this paper, a double spot welding process, utilizing electric resistance heating dies, is suggested for the spot welding of dissimilar metal plates for drawing and concurrent spot welding. This double welding process has two heating methods for the fusion welding at the interfacial zone between steel and aluminum plates, such as heating method by thermal conduction of electric resistance by welding current induced to heating dies, and heating method by electric resistance between contacted surfaces of two plates by welding current induced to copper electrode. This double welding process has welding variables such as each current induced in heating dies and in copper electrode, outer diameters of heating dies, and edge shape of copper electrode. Experiments for current conditions in welding process should be demanded in order to get successful welding strength. It was known that the welding strength could be reached to the value demanded on industry fields under such welding conditions as heating dies of outer ring dia.12mm contacted on steel plate, as heating dies of outer ring dia. 14mm contacted on aluminum plate, and as copper electrode of dia. 6.0mm, and as 3 times continuous heating method by $1^{st}$ current of 11 kA(9cycle), $2^{nd}$ current 11 kA(60cycle), $3^{rd}$ current 7 kA(60cycle) applied in steel heating dies and copper electrodes, flat edge of copper electrode, for double spot welding process of dissimilar metal plates of steel and aluminum of 1.0 mm thickness.

• Transactions of the Korean hydrogen and new energy society
• /
• 제3권2호
• /
• pp.9-15
• /
• 1992

Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

• KIEE International Transactions on Electrophysics and Applications
• /
• 제5C권6호
• /
• pp.233-241
• /
• 2005

The present model of a SF6 arc accounts for the copper vapour contamination from the electrodes inside a Laval nozzle of a circuit breaker. Steady state simulations have been done for the arc with electrode gap of 60mm and DC electric current of 500A, 1000A and 1500A for both cases with and without copper contamination. The effects of electrode polarity are considered for the arc current of 1000A. It was found out that evaporation of copper from the anode results in a cooling of the arc in a region close to the electrodes. The electrical potential across the electrodes is not sensitive to the presence of copper vapour, typically less than $4\%$ difference. Transient analysis has been done in order to obtain the arc properties at current zero. The arc current is increased linearly from -1000 to 0A when the upstream electrode is cathode with constant dI/dt of $27.0A/{\mu}s$ (or decreased linearly from 1000 to 0A when upstream electrode is anode). It has been predicted that the presence of copper vapour reduces the interruption capability of the breaker.

• Transactions of the Korean hydrogen and new energy society
• /
• 제6권2호
• /
• pp.65-73
• /
• 1995

Negative electrode was prepared by mixing $Ti_{0.7}Zr_{0.3}Cr_{0.3}Mn_{0.3}V_{0.6}Ni_{0.8}$ alloy powder with copper or nickel powder and pressing in the air. The cycled electrodes were analyzed with SEM, potentiostat and electrochemical impedance spectroscopy. It was found that the Cu-compacted electrode showed better low temperature dischargeability and higher rate capability than Ni-compacted electrode. From SEM analysis of the cycled electrode compacted with copper powder, it was observed that the surface of MH particles was covered with copper grains and whisker precipitated from electrolyte after dissolution during cell test. It is found that the improved electrode characteristics are attributed to the copper layer on MH particles deposited by dissolution and precipitation(DP) process.

• Journal of the Korean Chemical Society
• /
• 제57권3호
• /
• pp.322-328
• /
• 2013

Copper iodide was employed as a modifier for preparation of a new carbon ceramic electrode. For the first time, the catalytic oxidation of amoxicillin (AMX) was demonstrated by cyclic voltammetry, chronoamperometry and amperometry methods at the surface of this modified carbon ceramic electrode. The copper iodide modified sol-gel derived carbon ceramic (CIM-SGD-CC) electrode has very high catalytic ability for electrooxidation of amoxicillin. The catalytic oxidation peak current was linearly dependent on the amoxicillin concentration and the linearity range obtained was 100 to 1000 ${\mu}mol\;L^{-1}$ with a detection limit of 0.53 ${\mu}mol\;L^{-1}$. The diffusion coefficient ($D=(1.67{\pm}0.102){\times}10^{-3}\;cm^2\;s^{-1}$), and the kinetic parameter such as the electron transfer coefficient (${\alpha}$) and exchange current density ($j_0$) for the modified electrode were calculated. The advantages of the modified CCE are its good stability and reproducibility of surface renewal by simple polishing, excellent catalytic activity and simplicity of preparation.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 한국정밀공학회 2012년도 추계학술대회 논문집
• /
• pp.355-356
• /
• 2012

• Bulletin of the Korean Chemical Society
• /
• 제35권1호
• /
• pp.147-150
• /
• 2014

Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at $110^{\circ}C$ to $150^{\circ}C$ to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of $1.88{\mu}{\Omega}{\cdot}cm$ of copper film was obtained at $150^{\circ}C$ in gaseous formic acid condition. The long-term resistivity shows to increase from $1.88{\mu}{\Omega}{\cdot}cm$ to $2.61{\mu}{\Omega}{\cdot}cm$ after one month.

• Bulletin of the Korean Chemical Society
• /
• 제26권6호
• /
• pp.882-886
• /
• 2005

Copper(II) ion-selective PVC membrane electrode based on 2-mercaptobenzoxazole as a new ionophore and o-nitrophenyl octyl ether (o-NPOE) as plasticizer is proposed. This electrode revealed good selectivity for $Cu^{2+}$ over a wide variety of other metal ions. Effects of experimental parameters such as membrane composition, nature and amount of plasticizer, and concentration of internal solution on the potential response of $Cu^{2+}$ sensor were investigated. The electrode exhibits good response for $Cu^{2+}$ in a wide linear range of 5.0 ${\times}$ 10−.6-1.6 ${\times}$ $10^{-2}$ mol/L with a slope of 29.2 ${\pm}$ 2.0 mV/decade. The response time of the sensor is less than 10 s, and the detection limit is 2.0 ${\times}$ $10^{-6}$ mol/L. The electrode response was stable in pH range of 4-6. The lifetime of the electrode was about 2 months. The electrode revealed comparatively good selectivities with respect to many alkali, alkaline earth, and transition metal ions.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• 제15권3호
• /
• pp.28-35
• /
• 2016

Forging operations are non-stationary processes occurring because of indirect pressure, generally, under conditions of three-dimensional stress and deformation. Furthermore, due to friction and the constraints of die geometry, deformation is not homogeneous. Material flow and deformation are largely determined by the shape of the tools. It is well known that net-shape forging can improve the mechanical strength of the final product as well as reduce material waste. Oxygen-free copper that is used for electrical and electronic components has excellent electrical and thermal conductivity. Oxygen-free copper parts have a low productivity in cutting process. Thus, the forging process is performed in order to improve the low productivity in cutting process. The forging of oxygen-free copper for electrode body parts was modeled using finite element simulation and forging experiments that were conducted for producing electrode body parts at room temperature. In order to reduce the cost of cutting products, the forging was performed in a closed cavity to obtain near-net or net-shape parts.

• Journal of Sensor Science and Technology
• /
• 제32권6호
• /
• pp.352-356
• /
• 2023

The integration of bioelectronic devices with the skin is a promising strategy for personalized healthcare monitoring and diagnostics. On-skin bioelectrodes hold great potential for the real-time tracking of physiological parameters. However, persistent challenges of stability and reliability have instigated exploration beyond conventional noble metals. This study focuses on the ionic passivation and oxidation dynamics of copper-based on-skin thin-film bioelectrodes. Through parylene chemical vapor deposition, we harness a controlled thin film of parylene insulation to counter the intrinsic susceptibility of copper to oxidation in the ionic environment. The results represent the relationship among the parylene insulation thickness, copper oxidation, and electrode impedance over temporal intervals. Comparative analyses indicate that the short-term stability of the copper electrode is comparable to that of the gold electrode. Therefore, we propose a cost-effective strategy for fabricating copper-based on-skin bioelectrodes by introducing enhanced ionic stability within a discernible operational timeframe. This study enriches our understanding of on-skin bioelectronics and affordable material choices for practical use in wearable healthcare devices.