• Korean Journal of Materials Research
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• v.31 no.10
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• pp.569-575
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• 2021

The reactivity evaluation of copper is performed using ethylenediamine, aminoethanol, and piperidine to apply organic chelators to copper etching. It is revealed that piperidine, which is a ring-type chelator, has the lowest reactivity on copper and copper oxide and ethylenediamine, which is a chain-type chelator, has the highest reactivity via inductively coupled plasma-mass spectroscopy (ICP-MS). Furthermore, it is confirmed that the stable complex of copper-ethylenediamine can be formed during the reaction between copper and ethylenediamine using nuclear magnetic resonance (NMR) and radio-thin layer chromatography. As a final evaluation, the copper reactivity is evaluated by wet etching using each solution. Scanning electron micrographs reveal that the degree of copper reaction in ethylenediamine is stronger than that in any other chelator. This result is in good agreement with the evaluation results obtained by ICP-MS and NMR. It is concluded that ethylenediamine is a prospective etch gas for the dry etching of the copper.

• Journal of the Korean Chemical Society
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• v.50 no.1
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• pp.89-93
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• 2006

• Bulletin of the Korean Chemical Society
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• v.31 no.9
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• pp.2701-2704
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• 2010

This work shows that both L2 and L3 bearing two and four N-$(CH_2)_2OCH_3$ groups, respectively, can be prepared selectively by the reaction of $L^1$ with 1-bromo-2-methoxyethane. The di-N-substituted macrocycle $L^2$ readily forms its copper(II) and nickel(II) complexes. The N-$(CH_2)_2OCH_3$ groups in $[CuL^2]^{2+}$ are coordinated to the metal ion, whereas those in $[NiL^2]^{2+}$ are not involved in coordination. Interestingly, $L^3$ reacts with $Cu^{2+}$ ion to form $[Cu(HL^3)]^{3+}$, in which one tertiary amino group is not involved in coordination.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.58.1-58.1
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• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• Bulletin of the Korean Chemical Society
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• v.15 no.12
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• pp.1118-1121
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• 1994

Reactions of alkaline metal carbonates with sulfur are investigated in detail. The evolution of CO and a trace of $SO_2$ were observed in the course of reaction with major component of polysulfides. Some evidences that the reaction proceeds with breaking of terminal sulfur-sulfur bond in the sulfur polymer, and forming CO, $SO_2$ and polysulfide are presented. Polysulfides have the role of keeping free sulfur and allow it to react with other chemicals to rather high temperatures.plexes, whereas the binuclear and mononuclear complexes of Mn$^{2+}$ and Co$^{2+}$

• Journal of Korean Society on Water Environment
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• v.22 no.4
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• pp.626-631
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• 2006

The adsorption features of copper ion have been investigated by taking the barley residue which occurring from the beer production process as an adsorbent. Under the experimental conditions, adsorption equilibrium of copper ion was attained within 30 minutes after the adsorption started and the adsorption reaction was observed to be first order. As the temperature increased, the adsorbed amount of copper ion at equilibrium was also increased, which indicated that the adsorption reaction was endothermic. Based on the experimental results which obtained by varying the temperatures, several thermodynamic parameters for copper adsorption reaction were estimated. Regarding the electrokinetic behavior of barley residue, its electrokinetic potential was observed to be positive below pH 5 and turned into negative above this pH. In the pH range from 1.5 to 4, copper adsorption was found to be increased, which was well explained by the electrokinetic behavior of barley residue in the pH range. When nitrilotriacetic acid, which is a complexing agent, was coexisted with copper ion, equilibrium adsorption of copper ion was decreased and this was presumed to be due to the formation of metal complex. In addition, the adsorbed amount of copper ion was examined to be increased when $KNO_3$ was coexisted, however, it approached a saturated value above a certain concentration of $KNO_3$.

• Bulletin of the Korean Chemical Society
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• v.30 no.10
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• pp.2467-2470
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• 2009

• Bulletin of the Korean Chemical Society
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• v.29 no.11
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• pp.2299-2302
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• 2008

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.511-514
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• 2008

• Bulletin of the Korean Chemical Society
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• v.33 no.7
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• pp.2381-2384
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• 2012