• Aerospace Engineering and Technology
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• v.9 no.2
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• pp.90-97
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• 2010

A study about the fatigue life of copper alloy which is used in inner jacket of regenerative cooling chamber of liquid rocket engine has been performed. Mechanical properties of the material and fatigue life have been taken from tensile tests and low-cycle fatigue tests at room temperature and several elevated temperatures. Original universal slopes method, modified universal slopes method, Mitchell's method, Baumel and Seeger's method, and Ong's method have been used for predicting the fatigue data. It was found that the novel life prediction method should be developed for the copper alloys since almost all data have not been predicted well with the widely used methods.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.

• Corrosion Science and Technology
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• v.4 no.1
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• pp.19-22
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• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.

• Journal of the Korean Society of Safety
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• v.34 no.3
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• pp.15-20
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• 2019

As industry is progressing and standards of living are improved, the demand of electrical energy is expected to grow 8-9% annually. Therefore, the importance of electrical fire prevention technology with the ability of the power supply is being emphasized. According to the statistics of fire in Korea, fire occurred about 45,000 cases annually, and electrical fire possessed about 20%. The electrical fire by poor contact has increased gradually, can be connected as great fire to secondarily induce short circuit and earth fault. Then analysis of heating causes of electrical connections between copper and copper alloy is needed. Also, detection and analysis algorithm of oxide at copper alloy are necessary. In this research, in order to understand the characteristics of oxide growth with rising resistance and heating, it is demonstrated that the oxide at electrical connections can cause fire due to arcing.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.432-436
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• 2009

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

• Journal of the Korean Applied Science and Technology
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• v.25 no.2
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• pp.168-174
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• 2008

This study is focused on the antimicrobial activity of cyanobacteria Microcystis aeruginosa by the reduction and oxidation reaction of copper and zinc alloy metal fiber filter. Cu/Zn ion is easily makes radicals with molecular hydroperoxide. Especially, hydroperoxide radical shows strong toxicity to the strains. Plasma membrane causes conformational change when hydroperoxide radical binds to plasma membrane. Elution of copper ion from copper and zinc alloy metal fiber is detected in the cyanobacteria solution as 0.5 ppm, and that of zinc ion is 0 ppm respectively. Zinc ion is figured to form a hydroxide in the cyanobacteria solution and precipitated to form a sludge. The concentration of chlorophyll-a in the cyanobacteria solution was proved to be the index of antimicrobial level of Microcystis aeruginosa.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1934-1937
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• 1999

A copper-tungsten sintered alloy(Cu-W) has been friction-welded to a tough pitch copper (Cu) in order to investigate friction weldability. The tensile strength of the friction welded joint was increased up to 87% of the Cu base metal under the condition of friction time 1.0 see, friction pressure 40MPa and upset pressure 100MPa, upset time 5.0 sec. And it is related to upset pressure rather than friction time. Mixed layer was formed in the Cu adjacent weld interface and W particles which were included in mixed layer could induce fracture in the Cu adjacent to the weld interface. Thickness of mixed layer was reduced as upset pressure increase.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.45-54
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• 1992

An applicability microencapsulation, using electroless copper plating, of hydrogen storage alloy powder as an anode material for nickel-hydrogen secondary batteries was investigated. Alloys employed were $LaNi_{4.7}Al_{0.3}$ and $MmNi_{4.5}Al_{0.5}$(Mm=mischmetal) which have an appropriate equilibrium pressure and capacity. The microencapsulation of the alloy powder was found to accelerate initial activation of electrodes and to increase capacity which is about 285mAh/g for $LaNi_{4.7}Al_{0.3}$. In addition, other charge and discharge characteristics, such as polarization and flatness of charge and discharge potential, were improved due to the role of copper layer as a microcurrent collector and an oxidation barrier of the alloy powder. $MmNi_{4.5}Al_{0.5}$ alloy showed lower capacity than $LaNi_{4.7}Al_{0.3}$ because of higher equilibrium pressure. Cyclic characteristics of both alloys were somewhat poor because of mainly shedding and partial oxidation of alloy powder during the cycling. However, it was considered that the microencapsulation method is effective to improve the performances of the hydrogen storage alloy electrodes.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.1
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• pp.143-179
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• 1989

To observe the bonding behavior of palladium-based alloys to porcelain; 1. Pd-Co binary alloy with the higher cobalt content, 2. Pd-Co binary alloy with the lower cobalt content, 3. Pd-Ag-Sn ternary alloy, 4. Pd-Ag binary alloy, 5. Pd-Cu-Au ternary alloy and 6. Pd-Cu binary alloy were made as 6 groups of experimental alloys. Each group of alloy was divided into 4 sub-groups such as one sub-group that was not degassed and three sub-groups that degassed for 5 minutes, 10 minutes and 15 minutes. On each specimen, weight changes after degassing, morphological changes of oxide layer by changing the degassing time, compositional changes at metal-ceramic interface and bond strength of metal-ceramic measured with planar shear test were observed and compared. The results of the present study allow the following conclusions to be drawn: 1. The alloy showing the greatest bond strength was Pd-Cu alloy without gold and bond strength was decreased by alloying gold to them. 2. Although Pd-Co alloy showed the most prominent oxidation behavior, bond strength of them to porcelain was not greatly high by the formation of porosities at metal-ceramic interfaces. 3. Likewise tin, cobalt formed the peaks on line profiles at metal-ceramic interface, however copper did not exhibit such peaks on line profiles. 4. Mainly, oxide layer on Pd-Co alloy was composed with cobalt, and for Pd-Co alloy with higher cobalt content the rise of bond strength was not significant by increased degassing time. 5. On Pd-Ag alloy not containing tin, during degassing for 15 minutes silver content was increased at metal-ceramic interface. 6. As an oxidized element, tin formed the oxide layers that widen their area by increasing the degassing time, while cobalt and copper showed the morphological changes of particle or crystal on oxide layer.