• Proceedings of the KWS Conference
• /
• v.43
• /
• pp.43-45
• /
• 2004

Brazing between cemented carbides and steel for tool investigated by copper alloy brazing filler. Copper alloy filler was high liquidus temperature($990^{\circ}C$), therefor the shank(steel) occurred softening. Because brazing sample was necessary to heat treatment after brazing process. This experiment, influence of austenite time and purge temperature on heat treatment were investigated. As a result, these treatments obtained to high deflective strength In case of austenite time was short and purge temperature was low. Especially, nitride precipitated brazing layers was strongly influenced by the deflective strength.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.8 no.5
• /
• pp.462-468
• /
• 1984

The variation of thermal diffusivity with respect to rolling reduction is experimentally determined by flash technique. Copper alloy is used as an experimental and specimens are cut from the slab produced by rolling process with different percent reduction in thickness along the rolling direction and with 30.deg. 60.deg. and 90.deg. angle to the rolling direction. It is found that thermal diffusivity is slightly decreased as rolling reduction increased, and it has tendency that thermal diffusivity is increased slightly as its angle approached to 90.deg. at same rolling reduction.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.3 no.1
• /
• pp.90-94
• /
• 2004

Generally, a hydraulic cylinder block which is one of a vehicle parts that plays Important role in excavator power transmission, has copper alloy separation phenomenon by sliding motion between metals in high pressure condition. In this paper, to solve this problem, the interfacial reaction layer of Fe-Cu With SCM440 and copper alloy is studied through the melting method. As the result of this study, it is found that the interfacial reaction layer of $1{\mu}m$ created in the interface of Fe-Cu which has very strong physical bonding. It has been also confirmed that the melting method can improve life of the hydraulic cylinder block.

• Journal of Hydrogen and New Energy
• /
• v.4 no.2
• /
• pp.23-28
• /
• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• Journal of Korea Foundry Society
• /
• v.33 no.6
• /
• pp.248-253
• /
• 2013

To add alloying elements into a pure copper melt, the wire-feeding efficiency of cored (alloy containing) wire was evaluated using a commercial, computational fluid-dynamics program. The model design was based on an industrial-scale production line. The variables calculated included wire feed rate, melt temperature, wire diameter, melt flow rate and wire temperature. Efficiency was evaluated after a series of calculations based on the penetration depth of the alloy-wire into the molten copper bath. Of the five variables investigated, the wire feed rate and wire diameter were the most influential factors affecting the feeding efficiency of the cored-wire.

• Transactions on Electrical and Electronic Materials
• /
• v.2 no.3
• /
• pp.28-32
• /
• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• Journal of Korea Foundry Society
• /
• v.43 no.6
• /
• pp.294-301
• /
• 2023

The effects of Cu on feeding and macro-porosity characteristics were investigated in hypo- (A356 and 319) and hypereutectic (391) aluminum-silicon alloys. T-section and Tatur tests showed that the feeding and macro-porosity characteristics were significantly different between the hypo- and hypereutectic alloys. The hole and the pipe in the T-section and the Tatur casting in hypereutectic alloy showed a rough and irregular shape due to the faceted growth of the primary silicon, while the results of the hypoeutectic alloys exhibited a rather smooth surface. However, the addition of Cu did not strongly affect the macro-feeding behavior. It is known that copper segregates and interferes the feeding process in the last stage of solidification, possibly leading to form more amount of micro shrinkage porosity by the addition of Cu. The macro porosity formation mechanism and feeding properties were discussed upon T-section and Tatur tests together with an alloying addition.

• Journal of the Korean Electrochemical Society
• /
• v.10 no.2
• /
• pp.94-103
• /
• 2007

The transition of interconnection metal from aluminum alloy to copper has been introduced to meet the requirements of high speed, ultra-large scale integration, and high reliability of the semiconductor device. Since copper, which has low electrical resistivity and high resistance to degradation, has different electrical and material characteristics compared to aluminum alloy, new related materials and processes are needed to successfully fabricate the copper interconnection. In this review, some important factors of multilevel copper damascene process have been surveyed such as diffusion barrier, seed layer, organic additives for bottom-up electro/electroless deposition, chemical mechanical polishing, and capping layer to introduce the related issues and recent research trends on them.

• Applied Microscopy
• /
• v.36 no.2
• /
• pp.47-55
• /
• 2006

In this paper a transmission electron microscope (TEM) observation of fine Cu precipitates distributed randomly in Al-2.5Cu-1.5Mg wt.% alloy is first reported. This new observation happened to occur when an ion milling was peformed to remove oxides on the specimen, particularly, aged 100 hours at $150^{\circ}C$. Meanwhile the oxides were identified to be $Cu_2O$ particles. For this work involved with analysis of diffraction rings, the formulation of the electron diffraction rings pattern for powder particles was made. Finally the significance of this unexpected ion milling effort on the alloy was discussed

• Journal of the Korean Chemical Society
• /
• v.56 no.4
• /
• pp.406-415
• /
• 2012

The corrosion inhibition of copper-nickel alloy by Ethylenediamine (EDA) and Diethylenetriamine (DETA) in 1.5M HCl has been investigated by weight loss technique at different temperatures. Maximum value of inhibitor efficiency was 75% at $35^{\circ}C$ and 0.2 M inhibitor concentration EDA, while the lower value was 4% at $35^{\circ}C$ and 0.01 M inhibitor concentration DETA. Two mathematical models were used to represent the corrosion rate data, second order polynomial model and exponential model respectively. Nonlinear regression analysis showed that the first model was better than the second model with high correlation coefficient. The reactivity of studied inhibitors was analyzed through theoretical calculations based on density functional theory (DFT). The results showed that the reactive sites were located on the nitrogen (N1, N2 and N4) atoms.