• 한국재료학회지
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• 제23권7호
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• pp.392-398
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• 2013

A two-pass differential speed rolling(DSR) was applied to a deoxidized low-phosphorous copper alloy sheet in order to form a homogeneous microstructure. Copper alloy with a thickness of 3 mm was rolled to 75 % reduction by two-pass rolling at $150^{\circ}C$ without lubrication at a differential speed ratio of 2.0:1. In order to introduce uniform shear strain into the copper alloy sheet, the second rolling was performed after turning the sample by $180^{\circ}$ on the transverse direction axis. Conventional rolling(CR), in which the rotating speeds of the upper roll and lower roll are identical to each other, was also performed by two-pass rolling under a total rolling reduction of 75 %, for comparison. The shear strain introduced by the conventional rolling showed positive values at positions of the upper roll side and negative values at positions of the lower roll side. However, samples processed by the DSR showed zero or positive values at all positions. {100}//ND texture was primarily developed near the surface and center of thickness for the CR, while {110}//ND texture was primarily developed for the DSR. The difference in misorientation distribution of grain boundary between the upper roll side surface and center regions was very small in the CR, while it was large in the DSR. The grain size was smallest in the upper roll side region for both the CR and the DSR. The hardness showed homogeneous distribution in the thickness direction in both CR and DSR. The average hardness was larger in CR than in DSR.

• 한국세라믹학회지
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• 제13권2호
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• pp.8-16
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• 1976

The conductive transparent film is prepared by spraying thin salt solution. In stannic chloride solution as a base solution, various dopants such as Al, Co, Cu and Ni were dissolved respectively as a chloride state and then the films were made by spraying solutions on hot glass plates. The properties of them were compared with those of the stannic salt single component film. The films doped with copper oxide and nickle oxide were improved by decreasing their sheet resistivity and temperature coefficient of resistivity. In comparison with the sheet resistivity and temperature coefficient of resistivity of stannic oxide single component film, being 2.5 K ohm/$\textrm{cm}^2$ and -1650ppm/$^{\circ}C$ respectively, its values of the film containing 15 mol % of copper oxide and formed at 40$0^{\circ}C$ were 2.5K ohm/$\textrm{cm}^2$ and -920ppm/$^{\circ}C$ respectively. The film containing 15 mol % of nickel oxide and formed at 50$0^{\circ}C$ has shown its sheet resistivity and temperature coefficient 0.7 K ohm/$\textrm{cm}^2$ and -940ppm/$^{\circ}C$ respectively.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.344-345
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• 2015

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.

• 한국표면공학회지
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• 제51권4호
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• pp.191-196
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• 2018

The self-annealing which leads evolution of microstructure in copper electroplating layers at room temperature occurs after forming deposition layer. During the process, crystal orientation, size and sheet resistance of plating layer change. Lastly, it causes the change of physical and mechanical characteristics such as a tensile strength of plating layer. In this study, the variation of incorporated impurities, microstructure and sheet resistance of copper plating layer formed by electroplating are measured with and without inorganic additives during the self-annealing. In case of absence of inorganic additives, the copper layer presents strong total intensity of incorporated impurities. During the self-annealing, such width of reduction was significant. Moreover, microstructure and crystal size are increased while the tensile strength is decreased noticeably. On the other hand, in the presence of inorganic additives, there is no observable distinction in the copper plating layer. According to the observation on movements of the incorporated impurities in electrodeposition copper layer, within 12 hours the impurities are continuously shifted from inside of the plating layer to its surface after as-deposited electroplating. Within 24 hours, except for the small portion of surface layer, it is considered that most of the microstructure is transformed.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.61-66
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• 2018

본 연구에서는 DRAM 제조 집적공정의 금속배선으로 사용하는 구리의 자기 열처리(self-annealing) 후 박막 특성 변화에 대한 연구를 진행하였다. 구리를 증착하고 상온에서 시간이 경과하면 구리가 성장하여 결정체 크기 변화가 생기는데 이를 자기 열처리라고 부른다. 구리 금속의 증착은 전기 도금법(electroplating)을 사용하였다. 구리 도금액으로 유기 첨가물이 다른 두 가지 시료인 기준 도금액과 평가 도금액 두 용액에 대해 평가 하였다. 자기 열처리 시간이 경과함에 따라 시간에 대해 면 저항 값의 변화가 없는 영역과 이후 급격하게 떨어지는 구간으로 나누어지고 최종적으로 포화면 저항 값을 보인다. 최종적인 면 저항 값은 초기 값 대비 20% 개선 효과를 보인다. 평가 전해액의 자기 열처리 효과가 기준 용액 대비 더 빠른 시간 안에 이루어졌는데 이는 유기 첨가물의 차이 때문이다. 개선의 효과 분석으로 TEM 장비를 이용하여 결정체 변화를 관찰하였고 자기 열처리 공정에 의해 효과적인 결정체 성장이 이루어졌음을 발견했다. 또한 단면 TEM 측정 결과 자기 열처리 된 시료는 전류 방향으로의 결정체 경계면 숫자가 줄어드는 bamboo 구조를 보인다. 열적 열하 특성(thermal excursion characteristics) 측정 결과 고온 열처리 대비 자기 열처리 시료가 hillock 특성이 보이지 않고 이는 박막의 신뢰성 특성을 향상 시킨다. Electron backscattered diffraction (EBSD) 측정 결과 결정체가 $2{\mu}m$까지 성장한 결정체를 관찰하였고 스트레스에 의한 void를 억제하는데 유리한 (100) 면 비중이 증가하는 방향으로 결정체 성장이 이루어짐을 알 수 있다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.179-179
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• 2013

Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

• Journal of Power Electronics
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• 제4권1호
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• pp.12-17
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• 2004

In this paper, a practical implementation to reduce leakage flux of a high-frequency inverter based non-contact type power transformer composed of EE-shape ferrite cores is presented for key technology of the next generation medical use X-ray CT scanner system. Design consideration for the unique structure of the non-contact power transformer with 900mm in diameter is also introduced. The complete non-contact transformer is actually arranged by several blocks of the magnetic circuit assembled by using 10 small EE shape cores with 120mm in length. It is experimentally and analytically discussed from a reduced leakage flux viewpoint related to its inductively coupling coefficient. A practical method to lower the leakage flux is described based on effective Copper-Sheet- Treatment placed on EE shape ferrite cores of magnetic circuit.

• 소성∙가공
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• 제26권3호
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• pp.168-173
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• 2017

A new sheet metal forming process, called flexibly reconfigurable roll forming (FRRF), is expected to resolve the economical limitation of the existing 3D curved sheet metal forming processes. The height-controllable guides and a couple of flexible rollers are utilized as the forming tool. Recently, as the 3D curved sheet metal is increasingly demanded in various fields, the application of FRRF to diverse materials is necessary. In addition, the formability comparison of several materials is needed. Therefore, in this study, we investigated the applicability of FRRF for different materials such as aluminum, magnesium, and copper alloys, and also the formability of these materials was compared using FRRF. The numerical simulation was conducted using ABAQUS, the commercial software, and the experiments were carried out using an FRRF apparatus to validate the simulation results. Finally, the applicability of FRRF for the chosen materials and the formability of these materials on FRRF process were confirmed by comparing the simulation and experimental results.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 제4회 영호남학술대회 논문집
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• pp.47-51
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• 2002

ECT(eddy currentign testing) is very effective technique to detect a flaw within a conductor. Co-based amorphous wire was used as a sensor head. The wire has almost 0 magneto-striction and high permeability. An uniform magnetic field was applied to 1mm thick copper plate and $25{\mu}m$ thick aluminum sheet conductor using spiral typed coil The size of the coil has $40mm{\times}40mm$ outer width and $8mm{\times}8mm$ inner width. The copper plate and aluminum sheet has 0.5mm and 0.1mm wide gap, respectively. The frequency range of applied field was 100kHz-600kHz. The induced voltage difference of 2.5mV was obtained in the maximum voltage and minimum one measured across the gap of the 1mm thick conductor. In the case of aluminum sheet, 0.4mV was obtained. From this results, the effectiveness of Co-based amorphous wire was confirmed in the ECT technique.

• 한국재료학회지
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• 제21권1호
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• pp.15-20
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• 2011

The effects of conventional rolling (CR) and differential speed rolling (DSR) on the microstructure and mechanical properties of a copper alloy sheet were investigated in detail. A copper alloy with thickness of 3 mm was rolled to a 50% reduction at ambient temperature without lubrication with a differential speed ratio of 2:1; sample was then annealed for 0.5h at various temperatures from 100 to $800^{\circ}C$. Conventional rolling, in which the rolling speed of the upper and lower rolls is identical, was performed under the same rolling conditions. The shear strain introduced by the CR showed positive values at positions on the upper roll side and negative values at positions on the lower roll side. However, the shear strain showed a zero or positive value at all positions for the samples rolled by the DSR. The microstrucure and mechanical properties of the as-rolled copper alloy did not show very significant differences between the CR and DSR for the microstructure and mechanical properties. However, those properties showed very significant differences in the case of the annealed samples. The effects of rolling method on the microstructure and mechanical properties of the as-rolled and subsequently annealed materials are discussed in terms of the shear strain.