• Bulletin of the Korean Chemical Society
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• 제34권9호
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• pp.2645-2649
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• 2013

We have developed a one-step synthesis of benzofurans from o-iodophenol and various terminal alkynes, by using Pd catalyst supported on nano-sized carbon balls (NCB) under copper- and ligand free conditions. This recyclable catalyst could be reused more than 5 times in the same heteroannulation reaction. The results have demonstrated that diverse 2-substituted benzofurans with tolerant functional groups can be prepared simply and conveniently under these conditions.

• Bulletin of the Korean Chemical Society
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• 제23권1호
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• pp.157-159
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• 2002

• Bulletin of the Korean Chemical Society
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• 제33권5호
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• pp.1785-1787
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• 2012

• Bulletin of the Korean Chemical Society
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• 제33권2호
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• pp.689-691
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• 2012

• 한국재료학회지
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• 제21권5호
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• 한국세라믹학회지
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• 제37권3호
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• pp.263-270
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• 2000

The Pt/copper oxide/n-Si electrodes were fabricated by depositing copper oxide thin film of 500${\AA}$ and very thin Pt layer on the n-type (100) Si substrate. hotoelectrochemical properties and stability profiles of the electrodes were investigated as a function of deposition time of Pt layer. As the deposition time of Pt layer increased up to 10 seconds, the photocurrent and quantum efficiency were increased and then decreased with further depositing time. The better cell stability was observed for the electrode with longer deposition time. The improvements in above photoelectrochemical properties indicate that Pt layer acts as a catalyst layer at electrode/electrolyte interface as well as a protective layer. The decreasing tendency of the photocurrent and efficiency for the electrode with Pt layer deposited above 20 seconds was explained as an increases in probbility of electron-hole pair recombination and also the absorbing photon loss at electrode surface due to the excessive thickness of Pt layer. The results were confirmed by impedance spectroscopy, mutiple cycle voltammograms and microstructural analyses.

• Korean Chemical Engineering Research
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• 제44권4호
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• pp.363-368
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• 2006

$C_9$-알데히드를 수소화하여 $C_9$-알콜을 제조하는 공정에 사용하기 위한 최적의 촉매를 선정하고, $C_9$-알콜의 수율을 극대화하기 위한 운전 조건을 확립하기 위한 실험을 수행하였다. 구리 전구체로 acetate를 사용하고 침전제로 $Na_2CO_3$를 사용하여 제조한 $CuO/ZnO/Al_2O_3$(60:30:10 wt％) 촉매의 표면적 및 구리 비표면적이 가장 우수하였으며 $C_9$-알데히드 수소화 반응에서도 가장 우수한 성능을 보였다. 최적화된 촉매를 장착한 trickle bed 반응기를 사용하여 $175^{\circ}C$, 800 psi, $WHSV=3hr^{-1}$의 조건에서 94.1 wt％의 $C_9$-알콜 수율을 얻었다. 알데히드의 수소화 반응에 사용되는 다른 촉매들과 비교한 결과 Ni/kieselghur 촉매와 유사한 성능을 보였으며 $Cu-Ni-Cr-Na/Al_2O_3$ 촉매 및 $Ni-Mo/Al_2O_3$ 촉매의 경우보다 우수한 성능을 보이는 것을 확인하였다. 장기 촉매 테스트를 통해서 촉매의 안정성을 확인한 결과 약 72시간 이후에는 고비점 부산물의 생성량 증가로 인하여 $C_9$-알콜의 수율이 약간씩 감소하였다.

• Korean Chemical Engineering Research
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• 제45권1호
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• pp.12-16
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• 2007

Copper-Zinc Oxide를 촉매로 사용하는 메탄올 자열 개질 반응기의 온도제어 연구를 하였다. 반응기 hot-spot에서 1 cm 벗어난 지점의 반응기 내부 온도를 피제어변수로, 공기 유량을 조작변수로 사용하였다. 일차 시간 지연 모델을 얻었으며, 이로부터 IMC-PI 법을 적용하여 제어기 값을 구할 수 있었다. 이 제어기로 100시간 이상 개질 반응기 내부의 온도를 ${\pm}5^{\circ}C$ 내에서 제어할 수 있었다. 촉매활성의 저하로 인한 hot-spot 지점의 변화를 조사하여, 적응 제어의 설계에 이용할 수 있게 하였다.

• 공업화학
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• 제20권2호
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• pp.201-207
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• 2009

Dodecanol 합성을 위한 methyl dodecanoate의 수소화반응을 위하여 copper chromite를 세라믹법, 공침법 및 개량된 공침법으로 합성하였다. 입자의 형상은 SEM 및 XRD로 확인하였으며 수소화 반응후 얻어진 생성물은 GC, GC/MSD 및 NMR로 분석하였다. 합성된 입자는 (1) 3.2에서 $7.0{\mu}m$ 크기의 구형형태(세라믹법), (2) 50에서 500 nm 크기의 구형이 혼재한 판형태(공침법) 및 (3) 작고 균일한 구형형태(개량된 공침법)를 보였다. 입자의 크기를 제어하기 위하여 PEG, Span 80 및 polyacrylate등 다양한 분산제 용액에서 copper chromite를 합성하였다. PEG (Mw = 4000) 수용액에서 합성한 입자가 30~50 nm 크기로 가장 작고 균일하였으며, $280^{\circ}C$ 및 100 atm에서 촉매의 반응성을 테스트한 결과, dodecanol의 수율은 79.9%로 얻어졌다. 수소화반응에서 촉매의 반응성은 촉매의 크기가 작고 균일할수록 높아지는 경향을 보였다. 최적화된 반응조건인 $280^{\circ}C$ 및 240 atm에서 dodecanol의 수율은 95.5%였다.

• 한국표면공학회지
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• 제47권6호
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• pp.275-281
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• 2014

An ultrasound-assisted Sn-Ag-Pd activation method for electroless copper plating was presented in this study. With this activation process, it was shown that the fine catalyst particles were homogeneously distributed with high density on the entire specimen. In addition, it was observed that incubation period occurred during the electroless plating step was decreased owing to the absorption of Ag which holds high catalytic activity. Resulting from the refinement and high densification of catalyst, the defect-free gap-fill was achieved within the 20x nm trench.