• 한국결정성장학회지
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• 제30권5호
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• pp.208-213
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• 2020

본 연구에서는 유한요소 해석과 PQRSM 알고리즘 기반의 최적설계 기법을 활용하여 IGZO 산화물 타겟과 구리백플레이트가 서로 접합되어 있는 타겟 모듈에서 IGZO 산화물의 열변형을 최소화할 수 있는 방법에 대해 고찰했다. 3차원 유한요소 해석 결과 고온에서 IGZO와 구리 백플레이트의 접합 이후 냉각될 때 IGZO 산화물의 열변형은 최대 0.161 mm로 예측되었다. 유한요소 해석을 연동한 최적설계기법을 적용하기 위해 타겟 모듈을 냉각할 때 사용하는 하부받침대와 상부고정대의 위치를 설계변수화하여 목적함수인 IGZO의 열변형이 최소화되도록 최적설계를 수행했고, 그 결과 IGZO 산화물의 열변형을 최대 42 % 감소시킬 수 있었다. 이는 타겟을 구성하는 주재료와 구조 변경 없이 공정 중에 사용되는 부재료의 위치 변경만으로도 산화물의 열변형을 감소시킬 수 있어 산업계에 유용할 것으로 사료된다.

• Journal of Advanced Marine Engineering and Technology
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• 제19권3호
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• pp.50-61
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• 1995

In recent years, many ceramic researchers have discoved various methods of joining ceramic to metal. However, most of these joining methods are perfomed under vacuum and pressured circumstances. So, when we join ceramic to metal,the proceedings are very complicated and require a very high cost. The purpose of this study is to develop a new joining method of an alumina ceramic to an aluminum metal in air atmosphere. The joining condition, such as copper metallizing, nickel plating, brazing, etc. was investigated through the shear strength test of the trial joint. The results obtained from the above experimenta are summarized as follows : 1) In the case of the $Al_2O_3$/$Al_2O_3$joint, the shear strength of the joint was affected by the various foctor such as kaolin content, copper metallizing thickness, firing temperature, firing time. 2) The better shear strength of the $Al_2O_3$/Al joint was obtained when Ni plating was conducted under higher current density than existing plating condition. 3) The shear strength of the $Al_2O_3$/Al joint increases with the Ni plating thickness is confined to the range of this paper. 4) The shear strength of the thermal-shocked specimen($Al_2O_3$/Al joint) was far more deteriorated than that of the as-bonded specimen.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.47-52
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• 2013

Gold wire has long been used as a proven method of connecting a silicon die to a substrate in wide variety of package types, delivering high yield and productivity. However, with the high price of gold, the semiconductor packaging industry has been implementing an alternate wire material. These materials may include silver (Ag) or copper (Cu) alloys as an alternative to save material cost and maintain electrical performance. This paper will analyze and compare the electrical characteristics of several wire types. For the study, typical 0.6 mil, 0.8 mil and 1.0 mil diameter wires were selected from various alloy types (2N gold, Palladium (Pd) coated/doped copper, 88% and 96% silver) as well as respective pure metallic wires for comparison. Each wire model was validated by comparing it to electromagnetic simulation results and measurement data. Measurements from the implemented test boards were done using a vector network analyzer (VNA) and probe station setup. The test board layout consisted of three parts: 1. Analysis of the diameter, length and material characteristic of each wire; 2. Comparison between a microstrip line and the wire to microstrip line transition; and 3. Analysis of the wire's cross-talk. These areas will be discussed in detail along with all the extracted results from each type the wire.

• Carbon letters
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• 제21권
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• pp.68-73
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• 2017

We have demonstrated the production of thin films containing multilayer graphene-coated copper nanoparticles (MGCNs) by a commercial electrodeposition method. The MGCNs were produced by electrical wire explosion, an easily applied technique for creating hybrid metal nanoparticles. The nanoparticles had average diameters of 10-120 nm and quasi-spherical morphologies. We made a complex-electrodeposited copper thin film (CETF) with a thickness of $4.8{\mu}m$ by adding 300 ppm MGCNs to the electrolyte solution and performing electrodeposition. We measured the electric properties and performed corrosion testing of the CETF. Raman spectroscopy was used to measure the bonding characteristics and estimate the number of layers in the graphene films. The resistivity of the bare-electrodeposited copper thin film (BETF) was $2.092{\times}10^{-6}{\Omega}{\cdot}cm$, and the resistivity of the CETF after the addition of 300 ppm MGCNs was decreased by 2% to ${\sim}2.049{\times}10^{-6}{\Omega}{\cdot}cm$. The corrosion resistance of the BETF was $9.306{\Omega}$, while that of the CETF was increased to 20.04 Ω. Therefore, the CETF with MGCNs can be used in interconnection circuits for printed circuit boards or semiconductor devices on the basis of its low resistivity and high corrosion resistance.

• 한국재료학회지
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• 제6권2호
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• pp.158-165
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• 1996

열증착기(thermal evaporator)로 증착시킨 Cu를 상온에서 3.5M CuCl2+0.5M HCI+0.5MKCI 용액을 사용하여 습식각하고 2일간 대기중 노출시킨 후 X-선 광전자 분광기를 이용하여 표면의 결합상태를 관찰하였다. 그 결과 습식식각된 Cu 표면에서는 C, O, Ci 및 Cu가 존재함을 알 수 있었다. 표면원소에 대한 오제이 전자 스펙트라(Auger electron spectra)와 광전자 스펙트라(photoelectron spectra)의 정량적인 비교를 통하여 표면의 모든 결합상태를 확인할 수 있었고 그 상대적인 양까지도 얻어낼 수 있었다. 식각된 Cu의 표면에는 Cu-Cu, 2Cu-O, Cu-Ci, Cu-2(OH), 및 Cu-2Cl의 결합상태가 존재함을 알 수 있었고, CuLMMAuger line spectrum의 관찰을 통하여 계산된 각 결합의 정량적인 비교를 검증할 수 있었다. 따라서 chemical shift가 거의 관찰되지 않아 결합상태 분리가 불가능한 식각된 구리표면의 정량적 결합상태는 각 결합상태의 상대적 비교를 통하여 얻어질 수 있음을 알 수 있었다.

• Bulletin of the Korean Chemical Society
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• 제32권4호
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• pp.1241-1248
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• 2011

Three dimensional quantitative structure-activity relationships (3D-QSARs) between new thiosemicarbazone analogues (1-31) as a substrate molecule and their inhibitory activity against tyrosinase as a receptor were performed and discussed quantitatively using CoMFA (comparative molecular field analysis) and CoMSIA (comparative molecular similarity indices analysis) methods. According to the optimized CoMSIA 2 model obtained from the above procedure, inhibitory activities were mainly dependent upon H-bond acceptor favored field (36.5%) of substrate molecules. The optimized CoMSIA 2 model, with the sensitivity of the perturbation and the prediction, produced by a progressive scrambling analysis was not dependent on chance correlation. From molecular docking studies, it is supposed that the inhibitory activation of the substrate molecules against tyrosinase (PDB code: 1WX2) would not take place via uncompetitive inhibition forming a chelate between copper atoms in the active site of tyrosinase and thiosemicarbazone moieties of the substrate molecules, but via competitive inhibition based on H-bonding.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• Journal of Welding and Joining
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• 제16권5호
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• 한국표면공학회지
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• 제29권6호
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• pp.714-719
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• 1996

For the fabrication of the circuits, contact or terminal areas are usually coated with nickel and gold. Usually, diluted palladium solution is applied to initiate electroless nickel plating on the copper circuits. However, the trace amounts of palladium remains on the resin and it causes the extraneous deposition. We confirmed that selectivity was greatly improved by the treatment with the strong reducing agents such as SBH or DMAB. Bondability was greatly influenced by the contents of phosphorus in the deposited nickel. Stabilizers in the electroless gold plating were also influenced the bonding strength. The baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. The gold deposits having strong orientation with Au(220) and Au(311) showed good bond ability.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 추계학술대회 논문집 전력기술부문
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• pp.370-372
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• 2003

As there expands the usage of Al-Cu connections to interface aluminum and copper in power distribution systems, efforts to mitigate the mechanical, electrical or electro-chemical degradation are widely spreading. The explosive bending technology, in particular, has been thought as a countermeasure for the degradation. In this paper, electrochemical analysis and optical microscopic observation are carried out in order to compare the corrosion resistivities of the commercial compression type bimetallic sleeve and the explosion type bimetallic sleeve. The results show that the explosive bonding technology can prevent the interfacial corrosion caused by the formation of crevices and pits as well as from galvanic potential difference.