• Korean Journal of Materials Research
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• v.11 no.9
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• pp.802-809
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• 2001

Electroplating is an attractive alternative deposition method for copper with the need for a conformal and conductive seed layer In addition, the Cu seed layer should be highly pure so as not to compromise the effective resistivity of the filled copper interconnect structure. This seed layer requires low electrical resistivity, low levels of impurities, smooth interface, good adhesion to the barrier metal and low thickness concurrent with coherence for ensuring void-free fill. The electrical conductivity of the surface plays an important role in formation of initial Cu nuclei, Cu nucleation is much easier on the substrate with higher electrical conductivities. It is also known that the nucleation processes of Cu are very sensitive to surface condition. In this study, copper seed layers deposited by magnetron sputtering onto a tantalum nitride barrier layer were used for electroplating copper in the forward pulsed mode. Prior to electroplating a copper film, the Cu seed layer was cleaned by plasma H$_2$ and $N_2$. In the plasma treatment exposure tome was varied from 1 to 20 min and plasma power from 20 to 140W. Effects of plasma pretreatment to Cu seed/Tantalum nitride (TaN)/borophosphosilicate glass (BPSG) samples on electroplating of copper (Cu) films were investigated.

• Journal of Nutrition and Health
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• v.32 no.3
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• pp.296-306
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• 1999

This study was carried out to prepare a copper database of Korean foods which can be used in calculating copper intake from dietary data, and to evaluate the copper nutritional status of Koran adults living in rural areas by dietary intake and serum copper concentrations. A copper database for 1,176 Korean foods was constructed (1) by analysing 112 Korean foods which are frequently consumed by Korean adults living in rural areas, (2) by adapting values form food composition databases from other countries-320 items from the University of Minnesota database, 201 items from the USAD database, and 25 items from U.K. database, and (3) by imputing values from similar foods for 518 food items. Copper intake of 2,034 Korean adults over the age of 30 living in Yeonchongun was Kyunggi province, Korea was estimated by 24-hour recall method. Mean daily copper intake of subjects was 0.98mg. Mean daily intake level of males was 1.11mg which was significantly higher than that of females, 0.88mg. There was a significant difference in the distribution of subjects by the level of copper intake and sex(p<0.05). Mean serum copper concentration was 14.8umol/1 and the percentage of subjects with low, adequate, and high levels of copper concentration were 23.9%, 69.4%, and 6.6%, respectively. The two food groups which contributed most to the dietary copper intake of subjects were cereals and grain products, and vegetables, supplying 46.2% and 12.7% of total copper intake, respectively. Individuallym, rice contributed most, suppling 31% of total copper intake, followed by soybean curd, starch vermicle, barley, etc. Plant foods contributed to 82.1% of the total copper intake. In summary, results of this study show that copper intake of Korean adults living in rural areas is low, and that dietary sources of copper are mainly plant foods. Serum levels of copper in the subjects were relatively normal. The copper database for Korean foods constructed in present study will be a valuable tool for the as-yet limited assessment of copper intake of Koreans. Such studies will contribute to the establishment of a dietary of a dietary allowance of copper and the relationship of copper nutriture and chronic diseases in Koreans.

• Journal of Korean society of Dental Hygiene
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• v.10 no.3
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• pp.531-540
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• 2010

Objectives : In this study, following the cavity restorations with low copper conventional alloy, high copper admixed one and high copper unicompositional one, which are used the most frequently in a clinical setting at the present, to experiment the time-dependent changes of strength, bubbles were examined. Besides, to examine the detrimental effects of mercury contained in dental amalgam, the amount of mercury release was evaluated. Methods : As dental amalgams which were used herein, [BESTALOY], [Hi-Aristaloy 21] and [Sybraloy] were selected for a low-copper conventional amalgam, a high-copper admixed one and a high-copper unicompositional one in the corresponding order. The formation of bubbles and the weight ratio of mercury release were evaluated using a field emission scanning electron microscope (FE-SEM). Thus, the following results were obtained: Results : 1. The time-dependent amount of mercury release reached a statistical significance in three types of alloys, which was shown in such a descending order as [BESTALOY], [Hi-Aristaloy 21] and [Sybraloy]. 2. A low-copper conventional type, BESTALOY is a cutting type and it was found to have an increased formation of fine bubbles. In the remaining two types, [Hi-Aristaloy 21] (a high-copper admixed alloy) and [Sybraloy] (a high-copper unicompositional alloy), the time-dependent changes in the formation of bubbles was negligible. Conclusions : Accordingly, this type of mercury release from amalgam alloy denotes the difference in the weight ratio of total constituents between after 24 hours and after two weeks. But further studies are warranted to examine the amount of mercury release which is detrimental to human bodies. Besides, a low-copper conventional alloy is a cutting type and it was characterized by the abundant formation of bubbles in a time-dependent manner. This implies that the strength of amalgam is impaired, which should be considered in selecting the appropriate amalgam alloy in a clinical setting.

• Journal of Community Nutrition
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• v.1 no.1
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• pp.3-9
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• 1999

This study was performed to investigate the biochemical status of iron, zinc and copper for 125 preschool children (Males : 69, Females : 56) residing in a low-income area of Seoul. The number of subjects aged, 3, 4, 5 and 6 were 19, 41, 41 and 24, respectively. The hemoglobin level of the children aged 3 was 11.8 g/dl and was lower thant hat of the other groups(p<0.05). Similar results were found for hematocrit and serum zinc. The percentage of children with an iron deficiency assessed by Hb(3-5) years : <11.0g/dl, 6 years: <11.5g/dl), Hct(3-6 years : 33%, 6 years : <35%), serum transferrin(<16%) and serum ferritin(<10ng/ml) were 4.3%, 9.5%, 8.2% and 17.7%, respectively. The mean serum zinc was 67.9$\mu\textrm{g}$/dl and urinary zinc was 0.1300mg/day. Low serum zinc (61.0$\mu\textrm{g}$/dl) occurred in 28.0% of the children. The mean serum copper was 110.5$\mu\textrm{g}$/dl and urinary copper was 0.0126mg/day. The prevalence of children with elevated serum copper($\geq$ 130$\mu\textrm{g}$/dl) was 54.8%, which was higher than 7.4%, the prevalence of low serum copper(<70$\mu\textrm{g}$/dl). Children with higher status, more weight, larger girth of chest, or larger midarm circumference showed higher values of Hb. The height and weight of children also showed a positive crrelation with serum zinc(P<0.001-P<0.05).

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.1-26
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• 1994

The purpose of this study was to investigate the dissolution components during corrosion of amalgams and to identify surface corrosion products in the modified Fusayama artificial saliva. Four type of amalgam alloys were used: low copper lathe cut amalgam alloy (Cavex 68), low copper spherical amalgam alloy (Caulk Spherical Alloy), high copper admixed amalgam alloy (Dispersalloy) and high copper single composition amalgam alloy (Tytin). Each amalgam alloy and Hg were triturated according to the manufacturer's direction by means of mechanical amalgamator (Capmaster, S.S.White), and then the triturated mass was inserted into the cylindrical metal mold which was 10mm in diameter and 2.0mm in height and condensed with compression of 150kg/$cm^2$ using oil pressor. The specimens were removed from the mold and stored at room temperature for 7 days and cleansed with distiled water for 30 minutes in an ultrasonic cleaner. The specimens were immersed in the modified Fusayama artificial saliva for the periods of 1 month, 3 months and 6 months. The amounts of Hg, Cu, Sn and Zn dissolved from each amalgam specimen immersed in the artificial saliva for the periods of 1 month, 3 months and 6 months were measured using Inductivity Coupled Plasma Atomic Emission Spectrometry (ICPQ-1000, Shimadzu, Japan) and amount of Ag dissolved from amalgam specimen was measured using Atomic Absorption Spectrophotometry (Atomic Absorption/Flame emission spectrophotometer M-670, Shimadzu, Japan). A surface corrosion products of specimens were analysed using Electron Spectroscopy Chemical Analyser (ESCA PHI-558, PERKIN ELMER, U.S.A.). The secondary image and back scattered image of corroded surface of specimens was observed under the SEM, and the corroded surface of specimens was analysed with the EDX. The following results were obtained. 1. The dissolution amount of Cu was the most in high copper admixed amalgam(Dispersalloy) and the least in high copper single composition amalgam(Tytin). 2. Sn and Zn were dissolved during all the experiment periods, and dissolution amounts were decreased as the time elapsed. 3. Initial surface corrosion products were ZnO and SnO. 4. Corrosion of ${\gamma}$ and ${\gamma}_2$ phase in low copper amalgams was observed and Ag-Cu eutectic alloy phase was corroded in low copper spherical amalgam(Caulk Sperical Alloy). 5. Corrosion of ${\gamma}$ and $\eta$' phase in high copper amalgams was observed and Ag-Cu eutectic alloy phase was corroded in high copper admixed amalgam(Dispersalloy). 6. Sn-Cl was produced in the subsurface of low copper amalgams and high copper admixed amalgam.

• Corrosion Science and Technology
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• v.13 no.1
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• pp.6-14
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• 2014

Copper metal is widely used in tubes installed in sprinkler water services because of its excellent corrosion resistance. Copper corrosion is considered to be insignificant in water system and the incident of copper pipeline failure is relatively low. However, pitting corrosion is a major problem with all copper tubes. In this study, leaked sprinkler copper tubes were collected from three different locations and examined on the causes of pitting corrosion of copper tubes in sprinkler water plumbing systems. Electrochemical tests such as potentiodynamic polarization, as well as surface and chemical analyses were performed. Results show that pitting corrosion of copper tubes were found as Type I pitting that the carbon film formed on the copper tubes have a harmful effects, causing the pinhole failure in the pipe and resulting in leakage of water. The contermeasures on Type I pitting corrosion of copper tubes were proposed.

• Restorative Dentistry and Endodontics
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• v.17 no.2
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• pp.287-306
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• 1992

The amounts of copper, mercury, silver, tin, and zinc released from conventional, dispersed phase and spherical high copper content amalgam immersed in artificial saliva soln. for periods of 2 hours, 1 day, 7 days, 30 days has been measured using Neutron Activation analysis and Atomic Absorption Spectrophotometry. The second electron image and EDX of the surface of samples immersed in artificial saliva were observed using SEM. The following results were obtained. 1. The dispersed non-$\gamma_2$ amalgam released more Hg, Ag than the $\gamma_2$-amalgams. Later a decrease of the release rate could be observed. 2. The dispersed high copper amalgam released more copper than low-copper amalgam and the release rate was decreased with time. But the amounts of copper released from Tytin increased with time. 3. Zinc was released all the experiment time. 4. EDAX showed that surface was composed of Ca,P, Sn, Ag, Zn, and Cu, but C1 was not detected. 5. The discontinued destructed surface was observed from the polished amalgam surface. High copper amalgam was destructed more than low copper amalgam.

• Applied Science and Convergence Technology
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• v.23 no.1
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• pp.14-26
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• 2014

Copper is an important component from coin metal to electronic wire, integrated circuit, and to lithium battery. Copper oxides, mainly including $Cu_2O$ and CuO, are important semiconductors for the wide applications in solar cell, catalysis, lithium-ion battery, and sensor. Due to their low cost, low toxicity, and easy synthesis, copper oxides have received much research interest in recent year. Herein, we review the crystallization of copper oxides by designing various chemical reaction routes, for example, the synthesis of $Cu_2O$ by reduction route, the oxidation of copper to $Cu_2O$ or CuO, the chemical transformation of $Cu_2O$ to CuO, the chemical precipitation of CuO. In the designed reaction system, ligands, pH, inorganic ions, temperature were used to control both chemical reactions and the crystallization processes, which finally determined the phases, morphologies and sizes of copper oxides. Furthermore, copper oxides with different structures as electrode materials for lithium-ion batteries were also reviewed. This review presents a simple route to study the reaction-crystallization-performance relationship of Cu-based materials, which can be extended to other inorganic oxides.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.