• 설비공학논문집
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• 제29권12호
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• pp.645-653
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• 2017

Thermal and flow modeling and fin structure optimization were performed to reduce the weight of an electrical device with a staggered fin. First, a numerical model for thermal and flow characteristics was suggested, and then, the model was verified experimentally. Using the verified model, improvement in cooling performance of the cooling system through the staggered fins was predicted. As a result, 87.5% of total heat generated was dissipated through the cooling fins, and a thermal island was observed in the rotor because of low velocity of the internal air flow through the air gap. In addition, it was confirmed that the staggered fin improves the cooling performance but it also increases the total pressure drop within the cooling system, by maximizing the leading edge effect. Based on this analysis result, the effect of each design parameter on the thermal and flow characteristics was analyzed to select the main optimal design parameters, and multi-objective optimization was performed by considering the cooling performance and the fin weight. In conclusion, the optimized fin structure improved the cooling performance by 7% and reduced the fin weight by 28% without any compromise of the pressure drop.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.31-36
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• 2003

Recently, the power consumption and heat generation in an electronic equipment increase as the components are miniaturized and the computing speed becomes faster. Effective cooling method is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the cooling characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer characteristics. The results are compared with the experimental data or correlations of several researchers for the channel flow with pin-fin arrays.

• 대한기계학회논문집B
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• 제29권1호
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• pp.16-26
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• 2005

Air-cooled heat sinks are employed in many electronic cooling applications since they provide significant heat transfer enhancement and operational flexibility. Strip-shaped fin heat sink is of interest and needs to be investigated as general cooling products for more applicability. The purposes of this study are to evaluate heat sink performance without bypass flow condition and to determine optimal heat sink geometries. The results show that the decreasing rate of thermal resistance of a heat sink decreases with increasing inlet air velocity, and the increasing rate of pressure drop increases with increasing inlet air velocity, but is not affected by input power. The increasing rate of optimal longitudinal fin spacing is larger than that of transverse fin spacing. The strip fin heat sink tested in this study showed better cooling performance compared to that of other plate fin type.matism. 2004; 50(11): 3504-3515.

• 공업화학
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• 제8권6호
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• pp.1034-1040
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• 1997

전기자동차의 동력원으로 사용되는 90Ah급 Nickel/Metal hydride 전지 11개로 구성된 module의 온도특성을 상용 software인 NISA II를 사용하여 해석하였다. 전지 module에 대한 element수를 감축하기 위하여 열전도도가 다른 여러 층을 통하여 전달되는 열흐름에 대한 해석을 전기저항 등가식을 사용하여 단순화하였으며, Cartesian coordinate의 축별로 다른 열전도도를 삽입하는 orthotropic model을 사용하였다. 전지 module의 온도를 낮추기 위하여 알루미늄 재질의 cooling fin을 전지와 전지사이에 삽입하여 실험을 수행하였고, 전지 module 최외곽에 위치한 fin에 의한 최고온도의 강하 효과는 미미하다는 결과를 얻었다. 전지 module내 전지별 온도차이를 극소화하기 위하여 cooling fin의 개수와 두께 그리고 측면 fin의 복합적인 영향에 대한 실험을 수행하였으며, 1mm 두께의 알루미늄 fin을 4개 사용하여 module내 전지별 최고온도의 차이를 $3^{\circ}C$ 이내로 줄일 수 있었다.

• 설비공학논문집
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• 제16권8호
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• pp.728-740
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• 2004

Heat sink has extended surface area for enhanced heat transfer. The enhanced convection heat transfer has been used widely, such as cooling electronic chips in the electronics industry. Heat sink usually requires an increase in the heat transfer and a decrease in the pressure drop, and must improve the performance in the flow field of industrial plants. In this study, wing fin heat sink was studied and tests were conducted in a rectangular cross sectional channel with wing fin heat sinks. The leading and trailing ends of a wing fin have a sharp edge, simulating the airfoil feature. Empirical correlations have been developed for wing fin heat sink types. And wing fin heat sinks have better cooling performance than elliptic fin and square fin types.

• 대한기계학회논문집B
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• 제29권7호
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• pp.828-836
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• 2005

Impingement/effusion cooling technique is used for combustor liner or turbine parts cooling in gas turbine engine. In the impingement/effusion cooling system, the crossflow generated in the cooling channel induces an adverse effect on the cooling performance, which consequently affects the durability of the cooling system. In the present study, to reduce the adverse effect of the crossflow and improve the cooling performance, circular pin fins are installed in impingement/effusion cooling system and the heat transfer characteristics are investigated. The pin fins are installed between two perforated plates and the crossflow passes between these two plates. A blowing ratio is changed from 0.5 to 1.5 for the fixed jet Reynolds number of 10,000 and five circular pin fin arrangements are considered in this study. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The results show that local distributions of heat/mass transfer coefficient are changed due to the installation of pin fins. Due to the generation of vortex and wake by the pin fin, locally low heat/mass transfer regions are reduced. Moreover, the pin fin prevents the wall jet from being swept away, resulting in the increase of heat/mass transfer. When the pin fin is installed in front of the impinging let, the blockage effect on the crossflow enhances the heat/mass transfer. However, the pin fin installed just behind the impinging jet blocks up the wall jet, decreasing the heat/mass transfer. As the blowing ratio increases, the pin fins lead to the higher Sh value compared to the case without pin fins, inducing $16\%{\~}22\%$ enhancement of overall Sh value at high blowing ratio of M=1.5.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.129-133
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• 2000

Vapor oil fer radiator fm press in heat exchangers of air conditioners is carefully considered as the cooling performance can be affected by the residual vapor oil on the surface of radiator fin after fin press working. In this work, vapor oil for radiator fin press was developed in consideration of several properties such as physical characteristics, the rate of volatility, hazardous properties and material compatibility. In addition, it was confirmed that radiator fin press workability adopting the vapor oil and the cooling performance of air conditioner using the radiator fin were good.

• 설비공학논문집
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• 제25권9호
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• pp.522-528
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• 2013

Spray cooling is a technology of increasing interest for electronic cooling and other high heat flux applications. In this study, heat transfer coefficients (HTCs) and critical heat fluxes (CHFs) were measured on a smooth square flat copper heater of $9.53{\times}9.53$ mm at $36^{\circ}C$ in a pool, with a smooth flat surface, and 26 fpi. Low-fin surfaces were used to see the change in HTCs and CHFs according to the surface characteristics, and FC-72 was used as the working fluid. FC-72 fluid had a significant influence on the heat transfer characteristics of the spray over the cooling surface. HTCs were taken from 10 $kW/m^2$ to critical heat flux, for all surfaces. Test results with Low-fin showed that the CHFs of all the enhanced surface were greatly improved. It can be said that the surface form affects the heat transfer coefficient and critical heat flux.

• 설비공학논문집
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• 제22권3호
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• pp.171-179
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• 2010

Thermal performance of louver fin and plate fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically evaluated. The thermoelectric cooling system consists of a thermoelectric module and two heat exchanger fins. The analytic results show that the optimized louver fin has lower thermal resistance than plate fin. The COP and heat absorbed rate of the thermoelectric cooling system with optimized louver fins are 10.3% and 5.8% higher than optimized plate fins, respectively.

• 설비공학논문집
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• 제15권8호
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.