• Journal of the Korea Safety Management & Science
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• v.15 no.4
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• pp.279-288
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• 2013

The purpose of this study is to present a case study of six sigma quality improvement practice in cooling fan motor(CFM) manufacturing processes. In this study, the CFM manufacturing process of automobile parts not relevant to the target process rate of the process point of view, in order to reduce the system to solve the problem of localized resolution procedures of six sigma DMAIC methodology was applied to study. In conclusion, this study's field D in order to improve the initial rate of inadequate quality management best practices by applying the method of Six Sigma quality CFM failure through stabilization schemes were proposed cost reduction.To be CFM product to satisfy customers based on continuous monitoring of the effective field of claims quality management system is required.

• The Transactions of the Korean Institute of Power Electronics
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• v.21 no.5
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• pp.381-387
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• 2016

Many efforts have focused on the improvement of power density and efficiency by downsizing the motor and inverter. Recently, Toyota, Honda, and GM realized that the compact-sized motor uses the hairpin structure with increased space factor. Reducing the maximum torque from high-speed technique also makes it possible to design the high-power density model. Toyota and Honda used the newly developed power semiconductor IGBT to decrease conduction loss for high-efficiency inverter. In particular, Toyota used the boost converter to increase the DC link voltage for high efficiency in low-torque high-speed region. Toyota and GM also used the double-sided cooling structure for miniaturization of inverter for high-power density.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• Journal of Welding and Joining
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• v.4 no.3
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• pp.43-49
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• 1986

Weldability of the TMCP steel manufactured by controlled rolling followed by accelerated cooling process was investigated. For comparison, two other steel plates produced by different manufacturing processes were selected; normalized and controlled rolled. Tandem submerged arc welding with both side one run technique was carried out. The results of this study can be summarized as follows; TMCP steel having the lowest carbon equivalent shows the best combination of mechanical properties, not only in the base metal but also in the heat affected zone. In the HAZ, the accelerated colling effect imarted on the trengthis releved by the weld thermal cycles, and thus the strength of the welded joint decrease substantially accompanied with the fracture in the HAZ. On the other hand, not only the softening but the fine microstructure can preserve the high toughness of TMCP steel in the HAZ.

• Journal of Korea Foundry Society
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• v.30 no.3
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• pp.94-99
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• 2010

When the returned scrap of bulk amorphous alloy is remelted, impurities such as oxides and intermetallic compounds increase. Glass forming ability of its scrap is deteriorated remarkably. Melt fluxing technique is introduced to enhance the glass forming ability during melting and freezing of bulk amorphous alloys. Cu and Zr based alloys are chosen. Small pieces of these alloy scraps and $B_2O_3$ flux are put together in a quartz tube. Cyclic heating and cooling are done by induction heating and water quenching or air cooling. Melting fluxing was effective for both Cu-based and Zr-based alloy, and their glass forming abilities were improved with increasing the number of fluxing.

• Corrosion Science and Technology
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• v.9 no.3
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• pp.137-141
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• 2010

Sodium nitrite is widely used as one of the popular corrosion inhibitors for the protection of ferrous metal in closed cooling water system, such as a diesel engine and a chiller. The optimum treatment conditions are studied through laboratory tests using linear polarization resistance (LPR) technique. Corrosion rate of the carbon steel electrode could be maintained less than $2.5{\times}10^{-3}$ mmpy in the test condition of 500 ppm as ${NO_2}^-$, 200 ppm as $Cl^-$, $70^{\circ}C$ and pH 6.8. The pH control is confirmed not to be an important factor in the protection of carbon steel by sodium nitrite inhibitor. The addition of tolyltriazole was needed for the protection of the copper alloy in the sodium nitrite treatment system.

• Journal of the Korean Institute of Navigation
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• v.14 no.2
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• pp.77-82
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• 1990

In this paper the results for thin multi-layer InGaAsP($1.3{\mu}m$)/InP crystal growth by vertical liquid epitaxial growing furnance have been presented. The growth rates of InGaAsP layer and InP layer at cooling rate of $0.3^{\circ}C$/min and the growing temperature of $630^{\circ}C$ were obtained as $0.11 {\mu}m$/min and $0.06 {\mu}m$/min, respectively, by the uniform cooling with two phase solution technique.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

• International Journal of Air-Conditioning and Refrigeration
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• v.7
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• pp.91-100
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• 1999

This paper investigates ventilation characteristics of an environmental chamber simulating an under-floor air conditioning system for isothermal and cooling supply air conditions. The tracer gas sulfur-hexafluoride (SF$F_6$) was injected into a supply duct using step-up and step-down methods. Local mean and room mean ages were calculated from the concentrations measured at internal points and at the exhaust duct. The air change efficiency of the chamber has been found to be greater in cooling conditions than in isothermal conditions. Also the room air change efficiency is not significantly affected but slightly improved by the presence of a supply diffuser.

• Journal of Fisheries and Marine Sciences Education
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• v.19 no.3
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• pp.366-372
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• 2007

This paper presents the fabrication techniques of microcooling fins for microelectronics applications. The various types of cooling fins have been fabricated on the surface of a silicon wafer (4inch-N type) by using wet etching technique. The designed micro fins and micro channels are considered as an effective method for cooling microelectronics devices generating high heat flux. Further we extensively investigate the design processes fabricating micro fins and channels which can cool the heat generated from high density electronics devices.