• Journal of Advanced Marine Engineering and Technology
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• 제41권1호
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• pp.1-7
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• 2017

두 판을 맞대기 용접할 경우 용접부 시종단부 측면에 열전도도가 큰 금속(예를 들어 구리)으로 만든 엔드 탭을 장착하고 용접을 진행하면 용접부 끝부분의 비드흘러내림과 결함을 방지할 수 있다. 본 논문에서는 엔드 탭의 방열 성능을 강화시키기 위하여 자연 대류에 의한 방열 특성이 뛰어난 것으로 알려진 평판 휜 모양을 적용하였고, 실험 및 수치해석을 통하여 엔드 탭에 평판 휜 모양의 구멍이 있는 형상이 구멍이 없는 형상보다 방열 성능이 더 뛰어남을 확인하였다. 그리고 열, 유동해석을 통하여 엔드 탭의 휜 형상에 대한 냉각 속도를 평가하여, 방열 성능 측면으로 도움이 될 형상 인자적인 특성을 파악하였다. 그 결과, 엔드 탭에 수직 휜이 있으며 휜 간 간격에 최적 휜 간 간격 식을 적용한 구조가 우수한 형상으로 판단되었다.

• Journal of Welding and Joining
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• 제3권1호
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• pp.11-21
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• 1985

The line heating is a thermoplastic working technique which is used in bending work of steel plate and in correcting the distortion of welded structure. This method is considerably effective when the water-cooling is followed. In this study, an investigation was accomplished to find the effects on the change of material properties when the line heating was applied on the high tensile steel plate of 50kg/mm^2$ grade. Some steel plates were heated to various temperatures and then cooled with water or in the air. In this study, the author measured the angular distortion continuously during line heating to find out the relation between the bending efficiency and heating or water-cooling temperature. Furthermore, its material properties were examined by the V-notch Charpy impact test, the microscope observation and the Vickers hardness test. As results, the followings were clarified. (1) The amount of angular distortion increases as the heating temperature or the water-cooling temperature rises. (2) When the steel plate is heated between 700.deg. C and 900.deg. C, and then is water-cooled over 700.deg. C, some brittle structure is observed. But if the temperature of water-cooling is below 700.deg. C, no brittle one is found. (3) When the steel plate is heated over 800.deg. C and is cooled in the air, there is no unfavrable effect.

• 소성∙가공
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• 제20권1호
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• pp.29-35
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• 2011

In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.836-840
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• 2006

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.471-476
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• 2006

Thermoacoustic refrigerators are operated with acoustic power to pump heat. The acoustic standing wave displaces the gas In the channels of the stack while compressing and expanding. The thermal interaction between the osillating gas he surface of the stack generates an acoustic heat pumping. in this study, a thermoacoustic refrigerator is composed of a resonator of 4cm diameter, stack of plates, heat exchangers and cooling part. Length of the hot heat exchangers, the stack of plates and the cold heat exchanger are 9mm, 8mm and 6mm respectively. Using helium as a coolant at frequency of 516Hz, the cold-part temperature of exchanger fell to $-19.0^{\circ}C$ after 1hours.

• 대한조선학회논문집
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• 제41권4호
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• pp.68-76
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• 2004

Inherent strain method for analyzing deformation of line-heating is substituting experiments of high cost, because of its high accuracy and quickness. Nowadays, the progressing forms of line-heating are not straight moving motions used to traditional studies, but weaving motions which can diversely input heat source. In shipyard, reasons of weaving motions are induction of a special characteristic by water cooling, maximum temperature limitation for keeping plates from melting, and rhythm for workman's maintaining velocity. On this study, a method which can obtain optimal weaving heating condition was presented, some examples were introduced, and the results corresponded to works of shipyard. Lastly, what the specifications of plates on efficiency are is presented, through the quality standard of shipyard and FEM heat transfer simulation. The ultimate purpose of line heating is the automation, so in case of plates which need weaving heating, the optimal heating condition suggested by this study can be used well in designing coil specifications of induction heaters which are heat input sources of new generation.

• 설비공학논문집
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• 제20권7호
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• pp.462-469
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• 2008

A regenerative evaporative cooler has been fabricated and tested for the evaluation of cooling performance. The regenerative evaporative cooler is a kind of indirect evaporative cooler comprised of multiple pairs of dry and wet channels. The air flowing through the dry channels is cooled without any change in the humidity and at the outlet of the dry channel a part of air is redirected to the wet channel where the evaporative cooling takes place. The regenerative evaporative cooler fabricated in this study consists of the multiple pairs of finned channels in counterflow arrangement. The fins and heat transfer plates were made of aluminum and brazed for good thermal connection. Thin porous layer coating was applied to the internal surface of the wet channel to improve surface wettability. The regenerative evaporative cooler was placed in a climate chamber and tested at various operation condition. The cooling performance is found greatly influenced by the evaporation water flow rate. To improve the cooling performance, the evaporation water flow rate needs to be minimized as far as the even distribution of the evaporation water is secured. At the inlet condition of $32^{\circ}C$ and 50%RH, the outlet temperature was measured at $22^{\circ}C$ which is well below the inlet wet-bulb temperature of $23.7^{\circ}C$.

• 설비공학논문집
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• 제16권11호
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• pp.1051-1059
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• 2004

Two phase thermosyphone loop for electronics cooling are designed and manufactured to test its performance under the partial load and low environment temperature conditions. The thermosyphone device has six evaporators connected parallel for the purpose of cooling six power amplifier units (PAU) independently. The heater modules for simulating PAUs are adhered with thermal pad to the evaporator plates to reduce the contact resistance. There are unbalanced distributions of liquid refrigerant in the differently heated evaporators due to the vapor pressure difference. To reduce the vapor pressure differences caused by partial heating, two evaporators are connected each other using the copper tube. The pressure regulation tube successfully reduces these unbalances and it is good candidates for a field distributed systems. Under the low environment temperature operating condition, such as $-30^{\circ}C$, there may be unexpected subcooling in condenser. It leads the very low saturation pressure, and under this condition there exists explosive boiling in evaporator. The abrupt pressure rise due to the explosive boiling inhibits the supplement of liquid refrigerant to the evaporator for continuous cooling. Finally the cooling cycle will be broken. For the normal circulation of refrigerant there may be an optimum cooling air flow rate in condenser to adjust the given heat load.

• Journal of Welding and Joining
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• 제4권3호
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• pp.43-49
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• 1986

Weldability of the TMCP steel manufactured by controlled rolling followed by accelerated cooling process was investigated. For comparison, two other steel plates produced by different manufacturing processes were selected; normalized and controlled rolled. Tandem submerged arc welding with both side one run technique was carried out. The results of this study can be summarized as follows; TMCP steel having the lowest carbon equivalent shows the best combination of mechanical properties, not only in the base metal but also in the heat affected zone. In the HAZ, the accelerated colling effect imarted on the trengthis releved by the weld thermal cycles, and thus the strength of the welded joint decrease substantially accompanied with the fracture in the HAZ. On the other hand, not only the softening but the fine microstructure can preserve the high toughness of TMCP steel in the HAZ.

• 한국안전학회지
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• 제13권2호
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.