• Title/Summary/Keyword: Contact thermal resistance

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Determination of Thermal Contact Conductance of an Injection Mold Assembly for the Prediction of Mold Surface Temperature

  • Lee, Ki-Yeon;Kim, Kyeong-Min;Park, Keun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.6
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    • pp.1008-1012
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    • 2012
  • Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

Evaluation of Thermal Durability of Thermal Barrier Coating and Change in Mechanical Behavior

  • Lee, Dong Heon;Kang, Nam Kyu;Lee, Kee Sung;Moon, Heung Soo;Kim, Hyung Tae;Kim, Chul
    • Journal of the Korean Ceramic Society
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    • v.54 no.4
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    • pp.314-322
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    • 2017
  • This study investigates changes in the mechanical behavior, such as changes in indentation load-displacement curve, wear resistance and contact fatigue resistance of thermal barrier coatings (TBCs) by thermal cycling test and thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/superalloy are prepared; the highest temperature applied during thermal durability test is $1350^{\circ}C$. The results indicate that the porous TBCs have relatively longer lifetime during thermal cycling and thermal shock tests, while denser TBCs have relatively higher wear and contact fatigue resistance. The mechanical behavior is influenced by sintering of the TBCs by exposure to high temperature during tests.

Simulation Method for Thermal appropriate Desing of Compound Cylinder using Bondgraph Modeling (원통결합부의 열특성 최적설계를 위한 예측 시뮬레이션 방법)

  • 민승환;박기환;이선규
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.04a
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    • pp.635-640
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    • 1996
  • A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

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A Study on the Electrical Fire Risk of Terminal Block Due to Single and Composite Cause (단일 및 복합 원인에 의한 단자대 전기화재위험성에 관한 연구)

  • Kim, Si-Kuk;Gum, Dong-Shin;Lee, Chun-Ha
    • Fire Science and Engineering
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    • v.29 no.5
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    • pp.57-66
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    • 2015
  • This thesis is based on a research to investigate the electrical fire risk due to the single and composite cause in a terminal block. This paper analyzed the thermal characteristics depending on the screw torque change and contact resistance change to measure the fire risk due to the poor contact from single cause first. To measure the fire risk due to the composite cause, the acceleration tracking depending on the contact resistance change was experimented to check the correlation of poor contact and tracking to fire. The experiment result showed that the thermal characteristics were clearer as the screw torque in poor contact status and magnitude of contact resistance increased and that the thermal characteristics of terminal block depending on the contact resistance change was more reliable than the thermal characteristics depending on the screw torque change. Moreover, the terminal block poor contact and tracking were correlated in the case of the composite cause, and when two composite causes were interacted, the electrical fire risk was higher than the single cause.

Investigation into Heat Transfer Characteristics of an Injection Mold by Considering Thermal Contact Resistance (열접촉 저항을 고려한 사출금형의 온도분포특성 고찰)

  • Kim, Kyung-Min;Lee, Ki-Yeon;Sohn, Dong-Hwi;Park, Keun
    • Transactions of Materials Processing
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    • v.20 no.1
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    • pp.29-35
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    • 2011
  • In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

Sensitivity Analysis of Contact Resistance for Thermal Analysis of Spacecraft (위성 열해석을 위한 접촉열저항의 민감도 해석)

  • Han, Cho-Young
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.32 no.7
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    • pp.117-125
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    • 2004
  • Performing the sensitivity analysis of contact conduction on the basis of the thermal model already established, the study of thermal design is accomplished for the preparation of the future changes of mechanical interface design. A relatively simple thermal model is taken into consideration for the convenience of the analysis. A variety of the spacecraft bus voltages and the contact resistances are tried. As a consequence, when the mechanical interface condition is changed at the same module, the successful thermal design could be achieved if we design the heater to have sufficiently large power with reference to the heritage of contact resistance.

Temperature Dependent Behavior of Thermal and Electrical Contacts during Resistance Spot Welding

  • Kim, E.
    • International Journal of Korean Welding Society
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    • v.2 no.1
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    • pp.1-10
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    • 2002
  • The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

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Analysis of Thermal Characteristics and Insulation Resistance based on Usage Environment and Current Value of Electrical Socket Outlet (전기콘센트의 사용환경과 전류값에 따른 열적특성 및 절연저항 분석)

  • Kim, Kyung Chun;Kim, Doo Hyun;Kim, Sung Chul
    • Journal of the Korean Society of Safety
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    • v.34 no.5
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    • pp.22-30
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    • 2019
  • In 2018, overload, overcurrent, insulation aging, and a contact failure caused 659 electric fires. There is almost no failure of electrical socket outlets during their manufacturing or installation period. After several months or several years, overload or overcurrent of electrical socket outlets leads to a contact failure or short circuit which causes an electric fire. Therefore, this paper analyzed for thermal characteristics based on a current value and the change in insulation resistance along with a temperature rise caused by electrical socket outlets and the state of laboratory use in workplaces. As a results, regarding the thermal characteristics based on the current value of each installation year, a temperature increase was related to a current value, an installation year, and whether the contact unit is corroded. Insulation resistance began to decrease when a temperature increased to a certain level. With a lapse of installation year, the temperature at which insulation resistance began to decrease was lowered. This paper can be applicable for the survey data about electrical socket outlet induced fire accidents and management guidelines.

Development of Evaluating Technology for the Capability of Carrying Short-Circuit Current at Electrical Contacts in EHV Disconnecting Switches (초고압 단로기 접점의 단락전류 통전성능 평가기술 개발)

  • Oh, Yeon-Ho;Song, Ki-Dong;Chong, Jin-Kyo
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.1
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    • pp.46-51
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    • 2008
  • Extra-high voltage(EHV) disconnecting switch(DS) consists of the electrical contacts and mechanical parts which actuate the contacts. When the short-circuit condition occurs, a large amount of current flows through the electrical contact in disconnecting switches and this causes considerable temperature rise due to Joule heating. If the temperature rise is higher than the melting point of contact material, the DS contact becomes melting and cannot be usable anymore. For this reason, the analysis for capability of carrying short-circuit current in DS contacts must be performed at a design stage. Here, we proposed a numerical technique for evaluating the capability of carrying short-circuit current at electrical contacts in EHV DS. In this numerical approach, the mechanical and thermal analyses were simulated to check the capability of carrying short-circuit current. First, the applied pressure at contact parts was analyzed considering the mechanical properties, and then contact resistance was calculated by an empirical equation. Finally, thermal analysis was performed with resistance variation at electrical contacts. To verify these numerical results, the distributions of temperature in DS were experimentally measured and compared with each other. The results from experiments were agreed well with those from the proposed numerical simulations.

Electrical Characteristics of Ti Self-Aligned Silicide Contact (Ti Self-Aligned Silicide를 이용한 Contact에서의 전기적 특성)

  • 이철진;허윤종;성영권
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.41 no.2
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    • pp.170-177
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    • 1992
  • Contact resistance and contact leakage current of the Al/TiSiS12T/Si system are investigated for NS0+T and PS0+T junctions. SALICIDE (Self Aligned Silicide) process was used to make the Al/TiSiS12T/Si system. Titanium disilicide is one of the most common silicides because of its thermal stability, ability to form selective formation and low resistivity. In this paper, RTA temperature effect and Junction implant dose effect were evaluated to characterize contact resistance and contact leakage current. The TiSiS12T contact resistance to NS0+T silicon is lower than that to PS0+T silicon, and TiSiS12T of contact leakage current to NS0+T silicon is lower than that to PS0+T silicon. Contact resistance and contact leakage current of the Al/TiSiS12T/Si system by this method were possible for VLSI application.