• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.831-841
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• 2010

The conventional vertical probe has the thin and long signal path that makes transfer characteristic of probe worse because of the S-shaped structure. So we propose the new vertical probe structure that has branch springs in the S-shaped probe. It makes closed loop when the probe mechanically connects to the electrode on a wafer. We fabricated the proposed vertical probe and measured the transfer characteristic and mechanical properties. Compared to the conventional S-shaped vertical probe, the proposed probe has the overdrive that is 1.2 times larger and the contact force that is 2.5 times larger. And we got the improved transfer characteristic by 1.4 dB in $0{\sim}10$ GHz. Also we developed the simulation model of the probe card by using full-wave simulator and the simulation result is correlated with measurement one. As a result of this simulation model, the cantilever probe and PCB have the worst transfer characteristic in the probe card.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.4
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• pp.16-21
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• 2008

The demand for three-dimensional (3D) shape measurements is increasing in a variety of fields, including the manufacture of molds and dies. The most popular technology for 3D shape measurement is the coordinate measuring machine (CMM) with a contact trigger probe. Although a CMM provides a high degree of accuracy, it is inefficient due to its long measuring time. It also has difficulty measuring soft objects that can be deformed by the touch of the contact probe. In addition, a CMM cannot digitize areas that are difficult to reach, and cannot capture very minute details on the surface of complex parts. For these reasons, optical non-contact measurement techniques are receiving more attention since they eliminate most of the problems associated with contact methods. Laser scanning is emerging as one of the more promising non-contact measurement techniques. This paper describes various acquisition considerations for laser scanning, including the accuracy of the 3D scan data, which depends on the charge-coupled device (CCD) gain and noise. The CCD gain and noise of a 3D laser scanner are varied while keeping the other conditions constant, and the measurement results are compared to the dimensions of a standard model. The experimental results show that a considerable time savings and an optimum degree of accuracy are possible by selecting the proper CCD gain and noise.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.479-484
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• 1996

This paper describes a method of measuring tilt motion. This method measures the tilt motion of drilling machines using a laser interferometer, a simple sliding linear bearing, measurement of the probe and the LSC(least square center) method. The next order of business is discussing the procedure of measurement. First, The measured position is considered to be the point of contact between the drill shank and the probe. The revolution of the drill axis delivers the point of contact to the probe. Second, because the laser interferometer is attached on the sliding linear bearing, any movement of probe influences laser reflector. Thus, the laser program displays the moving factor of laser reflector. Namely, this is tilt factor. Third. the points of measurement are a full circle which has 8 points (each are 45$^{\circ}$), After it is finished measuring the 8 points, let the spindle of the drilling machine move down about 5 cm. Repeating this procedure three times, we can get tilt motion's values which are calculated by LSC method. Many error factors affect the accurate measurement of tilt motion. However in this paper we ignore some error factors because they are less significant than tilt motion.

• Journal of Surface Science and Engineering
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• v.45 no.2
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• pp.81-88
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• 2012

Probe tip, which should have not only superior electrical characteristics but also good abrasion resistance for numerous contacts with semiconductor pads to confirm their availability, is essential for MEMS probe card. To obtain good durability of probe tip, it needs thick and crack-free rhodium layer on the tip. However, when the rhodium thickness deposited by electroplating increased, unwanted cracks by high internal stress led to serious problem of MEMS probe tip. This article reported the method of thick Rh deposition with Au buffer layer on the probe tip to overcome the problem of high internal stress and studied mechanical and electrical properties of that. MEMS probe tip with double-Rh layer had good contact resistance and durability during long term touch downs.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.1
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• pp.82-87
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• 2010

A measurement system of contact force between overhead contact line and pantograph of train is developed which measures the contact force by using four sets of full-bridge strain gauges instead of load cells and accelerometers. The sensors are installed on the pan head of pantograph and the measured data from the sensors are transmitted to a server system in the train by way of wireless Lan. This configuration of the measuring system makes it easy to install on the trains without any alteration of train system. The measurement system is applied to KTX on the Kyungbu high speed line, and the measured contact force data shows good agreement with those measured by load cell and accelerometers. The waveform of the contact force between overhead contact line and pantograph contains essential information about their conditions. The proposed measurement system can probe any defects on overhead contact lines with train running at high speed, which will be a powerful solution for the maintenance of long-distance overhead contact lines.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.4 s.175
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• pp.874-880
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• 2000

In this paper, a DC potential drop measurement system was used to find the position of the flaw on a simple thin plate. Four-point probe test was evaluated and used for this study. In the four-point probe test, the more distance between current pins provides the more measurable scope, the less voltage difference, and the more voltage difference rate. In the other hand, the more distance between voltage pins provides the less voltage difference and the less voltage difference rate. An optimized four-point probe was applied to measure the relation between voltage and the relative position of flaw to the probe. The Maxwell 21) simulator was used to analyze the electromagnetic field, and it showed that the analytical result was similar to the experimental result within 11.4% maximum error.

• 한국연소학회:학술대회논문집
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• 2003.12a
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• pp.237-242
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• 2003

The measurement study of instantaneous temperature at combustion chamber wall and the temperature of combustion gas has been under lots of research and development to conclude the temperature process in internal combustion engine for combustion characteristics analysis. The measurement with fast responsibility should be used for temperature measurement inside combustion chamber wall since temperature of wall changes, due to the various gas temperature, irregularly during the combustion. Therefore, thin film instantaneous surface temperature probe, which characterizes the fastest and the most accurate responsibility among contact typed temperature measurement, was used for the experiments. This new thin film instantaneous surface temperature probe improved the problems of noise and durability. The optimal coating thickness of thin film instantaneous surface temperature probe was proven to be $10{\mu}m$ for the best responsibility and durability. It also allowed the stable temperature measurement be taken up to $1,200^{\circ}C$ and proven to be read possibly from the combustion chamber wall.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.6
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• pp.647-652
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• 2015

A probe pin is a key component of LED inspection equipment. The probe pin makes contact with the LED electrodes and supplies an electric current. Because the mechanical and electrical homogeneity of the probe surface affects the service life and reliability, its characterization is essential. For this study, the hardness was measured using a micro-Vickers hardness test. Moreover, the thicknesses of the plating at different locations and the elemental compositions were examined using an FE-SEM. The uniformity of the plating was found to be acceptable because palladium was detected consistently throughout the tested domain. In addition, the hardness of the surface was determined to be higher than that of the typical palladium range, which is attributed to the use of undercoated nickel.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.3
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• pp.323-331
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• 1997

A new probing mechanism and an active compliance control algorithm have been developed for the in-circuit test of a PCB( printed circuit board ). Commercially available robotic probing devices are incapable of controlling contact force generated through rigid probe contacts with a solder joint, at high speed. The uncontrollable excessive contact force often brungs about some defects on the surface of the solder joint, which is plastically deformable over some limited contact force. This force also makes unstable contact motions resulting in unreliable test data. To overcome these problems, we propose that a serially connected macro and micro device with active compliance provide the best potential for a safe and reliable in-circuit test. This paper describes the design characteristics, modeling and control scheme of the newly proposed device. The experimental results clearly show the effectiveness of the proposed system.