• Korean Journal of Materials Research
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• v.10 no.1
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• pp.21-28
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• 2000

Refractory metals, W and Ti, and their nitrides, $W_2N$ and TiN, were investigated for using as an ohmic contact material with SiC single crystalline thin films. The possibility of nitride materials for using as a stable ohmic contact material of SiC at high temperatures was examined by considering the thermal stability depending on the heat treatment temperature, their electrical properties and protective behavior from the interdiffusion. W contact with SiC thin films, deposited by using new organosilicon precursor, bis-trimethylsilylmethane, showed the lowest resistivity, $2.17{\times}10^{-5}$Ω$\textrm{cm}^2$. On the other hand, Ti-based contact materials showed higher contact resistivity than W-based ones. The oxidation of contact materials was restricted by applying Pt thin films on those electrodes. Nitride electrodes had rather stable electrical properties and better protective behavior from interdiffusion than metal electrodes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.290-293
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• 2003

Ohmic contact characteristics of Al ion implanted n-type SiC wafer were investigated. Al ions implanted with high dose to obtain the final concentration of $5{\times}10^{19}/cm^3$, then annealed at high temperature. Firstly, B ion ion implanted p-well region were formed which is needed for fabrication of SiC devices such as DIMOSFET and un diode. Secondly, Al implanted high dose region for ohmic contact were formed. After ion implantation, the samples were annealed at high temperature up to $1600^{\circ}C\;and\;1700^{\circ}C$ for 30 min in order to activate the implanted ions electrically. Both the inear TLM and circular TLM method were used for characterization. Ni/Ti metal layer was used for contact metal which is widely used in fabrication of ohmic contacts for n-type SiC. The metal layer was deposited by using RF sputtering and rapid thermal annealed at $950^{\circ}C$ for 90sec. Good ohmic contact characteristics could be obtained regardless of measuring methods. The measured specific contact resistivity for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$ were $1.8{\times}10^{-3}{\Omega}cm^2$, $5.6{\times}10^{-5}{\Omega}cm^2$, respectively. Using the same metal and same process of the ohmic contacts in n-type SiC, it is found possible to make a good ohmic contacts to p-type SiC. It is very helpful for fabricating a integrated SiC devices. In addition, we obtained that the ratio of the electrically activated ions to the implanted Al ions were 10% and 60% for the samples annealed at $1600^{\circ}C\;and\;1700^{\circ}C$, respectively.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09a
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• pp.1177-1181
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• 2010

Unsaturated soil can describe soil particles, air-water and contact face between air and water. The providing a simple method to predict water content in Geotechnical mechanics is very important. In this experiment, DIP (Digital Image Processing) and electrical resistivity techniques were used simultaneously to predict the saturation degree, and the results of two techniques will be compared each other to get conclusion. The experiment was carried out for Jumunjin standard sand. The picture of experimental column of soil and water was taken at different times, then using DIP technique to measure Color number-the height of capillary in soil column. At the same time, measure electrical resistivity of the soil.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.2
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• pp.284-287
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• 2013

In this work, we have fabricated TiC films by using unbalanced magnetron sputtering method with graphite and Ti targets for contact strip application of electric railway. TiC films were deposited with various substrate temperatures. We investigated various properties of TiC films prepared with various substrate temperatures, such as the hardness, surface roughness, friction coefficient, resistivity, FESEM (Field Emission Scanning Electron Microscopy), HRTEM (High Resolution Transmission Electron Microscopy) and XPS (X-ray Photoelectron Spectroscopy). The hardness and friction coefficient properties of TiC films were improved with increasing substrate temperature. These results indicate that the improvement of hardness and resistivity is related to the increase of sp2 clusters in TiC films. And also, the resistivity value of TiC films were decreased with increasing substrate temperature.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.178-182
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• 1991

Contact resistance and contact leakage current of the $Al/TiSi_2/Si$ system are investigated for $N^+\;and\;P^+$ junctions. Titanium disilicide is one of the most common silicides because of its thermal stability, ability, to form selective formation and low resistivity. In this paper, the effect of RTA temperature and Junction implant dose are characterized. The $TiSi_2$ contact resistance to $N^+$ silicon is lower than that of Al to $N^+$ silicon, but $TiSi_2$ of contact resistance to $P^+$ silicon is higher than that of Al to $P^+$ silicon. The $TiSi_2$ of contact leakage current to $N^+\;and\;P^+$ silicon is similar to that of Al contact.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1311-1312
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• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using 4he C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}{\cdot}cm^2$ of was obtained due to the improved interfacial adhesion.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.6
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• pp.68-74
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• 2011

The touch or step voltages which exist in the vicinity of a grounding electrode are closely related to the earth structure and resistivity and the ground current. The grounding design approach is required to determine the grounding electrode location where the hazardous voltages are minimized. In this paper, in order to propose a method of mitigating the electric shock hazards caused by the ground surface potential rise in the vicinity of a counterpoise, the hazards relevant to touch voltage were evaluated as a function of the soil resistivity ratio $\rho_2/\rho_1$ for several practical values of two-layer earth structures. The touch voltage and current on the ground surface just above the test electrode are calculated with CDEGS program. As a consequence, it was found that burying a grounding electrode in the soil with low resistivity is effective to reduce the electric shock hazards. In the case that the bottom layer soil where a counterpoise is buried has lower resistivity than the upper layer soil, when the upper layer soil resistivity is increased, the surface potential is slightly raised, but the current through the human body is reduced with increasing the upper layer soil resistivity because of the greater contact resistance between the earth surface and the feet. The electric shock hazard in the vicinity of grounding electrodes is closely related to soil structure and resistivity and are reduced with increasing the ration of the upper layer resistivity to the bottom layer resistivity in two-layer soil.

• Economic and Environmental Geology
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• v.23 no.2
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• pp.215-219
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• 1990

Geological and electrical resistivity surveys along the survey line of about 3 km between Kyungsangbukdo Youngilgun Hodong and Gwangmyungdong using by dipole-dipole electrode array method were carried out to examine the boundary and structural relationship between Tertiary Pohang and Janggi basins. Electrical resistivity data were interpreted qualitatively and quantitatively by means of pseudosection of apparent electrical resitivity distribution and finite difference method for two dimensional geologic structure model. The nearly vertical fault zone with low electrical resistivity value of 1-5 Ohm-m and widths of about 200m at the surface and 400 m at depth exists around 1.2 km west of national road between Ocheoneup and Yangbukmyun. Mudrocks, sandstones and tuffaceous rocks are widely distributed with electrical resistivity values of 6-77 Ohm-m. Especially, tuffaceous rocks with relatively high electrical resistivity value are predominant at eastern side of fault zone. Consequently, it is known that Pohang and Janggi basins are in fault contact.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.57-60
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.