• Journal of Advanced Marine Engineering and Technology
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• 제29권4호
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• pp.407-416
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• 2005

The kimchi refrigerator is the electric home appliance which is used for the maturing and preserving of the kimchi in domestic and foreign market. The kimchi refrigerator is composed in 3 main parts as insulation. kimchi container, machinery room. The heat exchanger of kimchi refrigerator is made of aluminum and the other parts are made of steel and polymer. Also, kimchi refrigerator is expensive and heavy as compared with same class of refrigerator until now. In the present study, the possibility to replace heat exchanger from aluminum to thermal conductive plastic was analyzed and experimented. The thermal conductive plastic has $10{\sim}100$ times heat conductivity than that of normal plastic. It is known that heat transfer process is dependent not only conduction but convection or radiation. Thermal conductivity of the applied material in this research is over than 2 W/mK, thermal conductivity doesn't play a vital role on heat transfer. In this study, temperature is the most important parameter on the kimchi refrigerator and the temperature of kimchi refrigerator's heat exchanger was measured and compared with the temperature calibrated by CFD analysis on the inside wall of the kimchi refrigerator. It is important to keep constantly the inside temperature of the Kimchi refrigerator. Besides numerical analyses for the new thermal conductive plastic for heat exchanger were executed with the various height of evaporation tube. A series of experiments were conducted to compare the performance of the two heat exchanger made of aluminum and thermal conductive plastic at the same condition and certified the possibility of the thermal conductive plastic. According to these results, it was confirmed that the conventional aluminium heat exchanger can be replaced by thermal conductive plastic successfully.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• 대한전기학회논문지
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• 제37권1호
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• pp.55-62
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• 1988

The variation of electrical resistivity of silver particle-filled polymers with the volume percent of silver particles was investigated. Also, the relationships between the surface tension of polymer and dispersion effect of silver particles were studied to find the steep drop of electrical resisivity, in view of agglomerate morphology. The critical volume precent of silver particles varied depending on the polymer species and increased with the increasing surface tension of polymer. The steep variation of resistivity with the increasing temperature was explained with the expansion of polymer at the melting temperature of polymer. The conductive break down current increased with the increasing volume percent of silver particles in the Ag/LDPE system and that was attributed to heat of Joule taken througn the contact area between the silver particle.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.46.5-46
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• 2001

Electrostrictive polymer is deformed by electric force generated by electric field built by high voltage. When high voltage is applied to the electrostrictive polymer film in which the electrodes such as conductive grease or carbon powder are installed, it expands in the direction of area. Because electrostrictive polymer is incompressible and electric force is applied to it in the direction of thickness. Electrostrictive polymer film in which electrodes are installed, functions as a parallel-plate capacitor. Therefore anode and cathode charges are piled up or both electrodes and there exists attractive force that functions as pressure in the direction of thickness. So the thickness of electrostrictive polymer becomes thicker ...

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.178-179
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• 2006

나노 크기를 가지는 DNA 분자를 template로 사용하여 전도성 고분자의 일종인 polypyrrole nanowire를 합성하였다. 본 논문에서 합성된 polypyrrole nanowire는 단량체인 pyrrole과 산화제와의 화학적인 반응에 의해 만들어졌다. 먼저 DNA 분자를 APTES(3-aminopropyltriethoxysilane) modified Si surface 위에 정렬한다. 그리고 이 기판을 농도를 달리한 pyrrole solution에서 incubationn한다. 마지막으로 APS (ammonium persulfate)와 반응시켜 conductive nanowire를 합성하였다. SEM을 이용하여 silicon 기판위에 1차원적으로 정렬된 나노 크기를 가지는 polypyrrole nanowire를 관찰할수 있었다. 그리고 pyrrole의 농도에 따라 nanowire의 uniformity를 조절할 수 있었다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.348-348
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• 2009

The conductive coating method is used for various industrial fields. For example, Sputtering process is used to coat ITO layer in LCD or OLED panel manufacture process and fabricate a base layer of substrate of an electric printing device. However, conventional coating processes (beam sputtering, spin coating etc.) has a problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers have proposed various printing process instead of conventional coating processes. In this paper, we propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Furthermore, the effect of the nozzle and also the applied voltage on different configuration of the nozzle head was also studied for better understanding of the Electro Static deposition process.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권2호
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• pp.61-67
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• 2006

Dielectric and conductive frequency spectra in 0.01 Hz-13 MHz range have been measured for the composite consisting of PZT inclusions dispersed in $LiCIO_{4}$-doped polyerhylene oxide(Li_PEO) matrix with various volume fractions. The dielectric and conductive spectra of the composites revealed the relaxations related with electrode polarization and interfacial polarization. The observed spectra were reproduced using the empirical dielectric function and we could obtain various parameters related to the above two kinds of polarizations and dicussed about the parameters.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 C
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• pp.1838-1840
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• 2005

Dielectric and conductive spect frequency spectra in a $1Hz{\sim}13MHz$ range have been measured for the composite consisting of PZT inclusions dispersed in a $LiClO_4$ doped polyethylene oxide(Li_PEO) matrix with various volume fractions. The dielectric and conductive spectra of the composites revealed the relaxations related with electrode polarization and interfacial polarization The observed spectra were reproduced using the empirical function and we could obtain vairous parameters related to electrode polarization and interfacial polarization.

• 한국의류학회지
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• 제23권2호
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• pp.326-334
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• 1999

Polyaniline(PAn)-nylon 6 composite fabrics were prepared by immersing the nylon 6 fabrics in 100% distilled aniline for specified diffusion time and drawn out. Then the excess aniline on the fabric surface was blotted and successive polymerization was initiate by immersing them into oxidant and dopant solution for in situ polymerization of polyaniline. Consequently highly conductive PAn-nylon 6 composite fabrics could be obtained and the conductivity reaches as high as 10-2 S/cm. The maximum conductivity was obtained when the fabric was immersed in 100% aniline at 4$0^{\circ}C$ for 3hours and polymerization was proceeded in 0.25M ammonium peroxydisulfate solution at 5$^{\circ}C$ for 1hour.