• Title/Summary/Keyword: Conductive ink

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Characteristics of dry-process based metal nano ink for printed electrodes

  • Kim, Dong-Kwon;Lee, Caroline;Hong, Seong-Je;Kim, Young-Seok
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1466-1468
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    • 2009
  • The preparation method of copper nanopowder by dry process for conductive ink was investigated. Inert gas condensation method was used to synthesize copper nanopowder. The produced powders was spherical and sized 10~100nm flowing the conditions. The results showed that input voltage and evaporation rate is critical variables for nano-sized copper powder.

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Rheological behavior and IPL sintering properties of conductive nano copper ink using ink-jet printing (전도성 나노 구리잉크의 잉크젯 프린팅 유변학적 거동 및 광소결 특성 평가)

  • Lee, Jae-Young;Lee, Do Kyeong;Nahm, Sahn;Choi, Jung-Hoon;Hwang, Kwang-Taek;Kim, Jin-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.30 no.5
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    • pp.174-182
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    • 2020
  • The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 1013 Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

Evaluation of DC Resistive Humidity Sensors Based on Conductive Carbon Ink (전도성 카본 잉크를 이용한 직류 저항형 습도센서 제작 및 평가)

  • An, Taechang
    • Journal of Sensor Science and Technology
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    • v.26 no.6
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    • pp.397-401
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    • 2017
  • A DC resistance type humidity sensor using conductive carbon ink was fabricated and its performance was evaluated. The humidity sensor was fabricated using a screen printing technique and have a structure that does not require additional metal electrodes to measure resistance change. To evaluate the performance of the humidity sensor, we measured the DC resistance change under various relative humidity levels. The fabricated humidity sensor showed a resistance change of about $2.5{\sim}50k{\Omega}$ in 11 ~ 95% RH environment. It also shows a linear relationship in the relative humidity versus log DC resistance graph. In comparison with commercial humidity sensor under real environment, it can be confirmed that the resistance of the humidity sensor changes to almost the same level as the measured humidity. These results show that the resistance type humidity sensor can be operated stably in actual environment.

Electric Circuit Fabrication Technology using Conductive Ink and Direct Printing

  • Jeong, Jae-U;Kim, Yong-Sik;Yun, Gwan-Su
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.12.1-12.1
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    • 2009
  • For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

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Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board (잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발)

  • Seo, Shang-Hoon;Lee, Ro-Woon;Yun, Kwan-Soo;Joung, Jae-Woo;Lee, Hee-Jo;Yook, Jong-Gwan
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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Implementation of High Performance Micro Electrode Pattern Using High Viscosity Conductive Ink Patterning Technique (고점도 전도성 잉크 패터닝 기술을 이용한 고성능 미세전극 패턴 구현)

  • Ko, Jeong Beom;Kim, Hyung Chan;Dang, Hyun Woo;Yang, Young Jin;Choi, Kyung Hyun;Doh, Yang Hoi
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.1
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    • pp.83-90
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    • 2014
  • EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

Study of Specific Resistance of Conductive Ink According to Temperature During Laser Sintering Process (전도성 잉크의 레이저 열경화 공정 시 온도에 따른 비저항 연구)

  • Lee, Dae-Geon;Park, Yong-Han;Park, Ji-Young;Kim, Dong-Keun;Moon, Yoon-Jae;Moon, Seung-Jae;Hwang, Jun-Young;Kang, Heui-Seok
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.37 no.2
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    • pp.119-124
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    • 2013
  • In this study, the two-dimensional transient temperature of printed Ag nanoparticle ink during continuous wave laser sintering was calculated. Ag nanoparticle ink was printed on a glass substrate by inkjet printing. Then, a 532-nm continuous wave laser with different laser intensities was irradiated on the printed Ag nanoparticle ink for 60 s. During laser irradiation, the in-situ specific resistance of the sintered ink was measured. To obtain the transient temperature of the sintered ink during the laser sintering process, a two-dimensional transient heat conduction equation was derived by applying the Wiedemann-Franz law. It was found that the specific resistance of the sintered ink decreased with an increase in the sintering temperature of the printed ink.

UHF RFID Tag Using National Code in a Bar-code Using Conductive Ink (도전성 잉크를 사용한 바코드의 국가코드 모양 UHF RFID 태그 안테나)

  • Chung, You-Chung;Jeon, Byung-Don
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.37 no.2C
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    • pp.168-172
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    • 2012
  • An UHF RFID tag is designed and fabricated using the national code in a bar-code with conductive ink. The bar-code sample was taken from a general bar-code from a general box. The conductivity of the conductive ink was measured, and the measured conductivity was used for the simulation tool to design the printed bar-code shape tag antenna. The tag antenna was fabricated using T-matching to reduce the size of the tag, and the bar-code tag antenna is recognized by both a general bar-code reader and an UHF RFID reader. The input reflection coefficient characteristic, the reading range pattern and the reading rate of the tag antenna are measured.