• 제목/요약/키워드: Conduction cooling

검색결과 217건 처리시간 0.03초

복합재료에 의한 열전변환 냉각소자의 개발에 관한 연구 (Experimental fabrication and analysis of thermoelectric devices)

  • 성만영;송대식;배원일
    • E2M - 전기 전자와 첨단 소재
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    • 제9권1호
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    • pp.67-75
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    • 1996
  • This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

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플립칩 접합용 초음파 혼의 CFD 열유동 해석 (Heat transfer analysis of CFD at the Ultrasonic horn bonding flip chip)

  • 심현석;리광훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2750-2753
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    • 2008
  • This paper introduce the CFD analysis for predicting the heat transfer at the Ultrasonic horn. Approximately Ultrasonic horn separates two part. One is preheating part and the other is cooling part. Temperature of preheating part rise up by $260^{\circ}C$ that make it possible to attach a chip to a semiconductor. Also there is a piezo material in the cooling part. When piezo work, it generates heat of $100^{\circ}C$. It can stand by $150^{\circ}C$. But the high temperature conducted from the preheating part has a bad affect on the piezo. These situation make it necessary cooling at piezo. Previously except of the piezo, all of them are composed of the SUS440c that has good thermal conductivity. This study shows way that not only cooling the piezo but also cutting off the conduction between preheating part and cooling part by using the Ti and Duralumin that have low thermal conductivity compare with the SUS440c. Conclusion of CFD analysis that the heat coming from the piezo can't be transferred the horn cause of the Ti and Duralumin.

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Thermal Analysis of Water Cooled ISG Based on a Thermal Equivalent Circuit Network

  • Kim, Kyu-Seob;Lee, Byeong-Hwa;Jung, Jae-Woo;Hong, Jung-Pyo
    • Journal of Electrical Engineering and Technology
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    • 제9권3호
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    • pp.893-898
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    • 2014
  • Recently, the interior permanent synchronous motor (IPMSM) has been applied to an integrated starter and generator (ISG) for hybrid electric vehicles. In the design of such a motor, thermal analysis is necessary to maximize the power density because the loss is proportional to the power of a motor. Therefore, a cooling device as a heat sink is required internally. Generally, a cooling system designed with a water jacket structure is widely used for electric motors because it has advantages of simple structure and cooling effectiveness. An effective approach to analyze an electric machine with a water jacket is a thermal equivalent network. This network is composed of thermal resistance, a heat source, and thermal capacitance that consider the conduction, convection, and radiation. In particular, modeling of the cooling channel in a network is challenging owing to the flow of the coolant. In this paper, temperature prediction using a thermal equivalent network is performed in an ISG that has a water cooled system. Then, an experiment is conducted to verify the thermal equivalent network.

노후 학교건물의 창호 교체에 따른 부하분석 (Analysis of Heating and Cooling Load Profile According to the Window Retrofit in an Old School Building)

  • 이예지;김주욱;송두삼
    • 설비공학논문집
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    • 제29권9호
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    • pp.455-462
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    • 2017
  • The purpose of this study is to analyze heating and cooling load variation due to envelope retrofits in an old school building. In a previous study, envelope retrofit of an old school building resulted in annual energy consumption reduction. However, cooling energy consumption increased with the envelope retrofit. This is because of high internal heat generation rates in school buildings and internal heat cannot escape through windows or walls when the envelope's thermal performance improves. To clarify this assumption, thermal performance changes due to envelope retrofits were analyzed by simulation. Results revealed indoor temperature and inner window surface temperature increased with high insulation level of windows. Indoor heat loss through windows by conduction, convection and radiation decreased and resulted in an increase of cooling load in an old school building. From results of this study, energy saving impact of envelope retrofits in an old school building may not be significant because of high internal heat gain level in school buildings. In case of replacing windows in school buildings, local climate and internal heat gain level should be considered.

정밀금형 알루미늄 합금주조공정시 주물/금형 접촉면에서의 Inverse 열전달해석에 관한 연구 (Inverse Heat Transfer Analysis at the Mold/Casting Interface in the Aluminum Alloy Casting Process with Precision Metal Mold)

  • 문수동;강신일
    • 한국주조공학회지
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    • 제18권3호
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    • pp.246-253
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    • 1998
  • Precision metal mold casting process is a casting method manufacturing mechanical elements with high precision, having heavy/light alloys as casting materials and using permanent mold. To improve dimensional accuracy and the final mechanical properties of the castings, the solidification speed and the cooling rate of the casting should be controlled with the optimum mold cooling system, and moreover, to obtain more accurate control of the whole process interfacial heat transfer characteristic at the mold/casting interface must be studied in advance. In the present study, aluminum alloy casting system with metal mold equipped with electrical heating elements and water cooling system was designed and the temperature histories at points inside the metal mold were measured during the casting process. The heat transfer phenomena at the mold/casting interface was characterized by the heat flux between solidifying casting metal and metal mold, and the heat flux history was obtained using inverse heat conduction method. The effect of mold cooling condition upon the heat flux profile was examined, and the analysis shows that the heat flux value has its maximum at the beginning of the process.

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$Na_4P_2O_7{\cdot}10H_2O$의 축열방열시 열전달 특성에 관한 실험적 연구 (An experimental study of heat transfer with $Na_4P_2O_7{\cdot}10H_2O$ as P.C.M.)

  • 이채문;임장순
    • 태양에너지
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    • 제9권1호
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    • pp.70-77
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    • 1989
  • Sodium pyrophosphate that melting point is $79-80^{\circ}C$ have been Studied on heat storage and heat discharge. In heat storage process, sodium pyrophosphate was kept up initial temperature $50^{\circ}C,\;60^{\circ}C,\;70^{\circ}C$ which melt by heated water at temperature $85^{\circ}C,\;90^{\circ}C,\;95^{\circ}C$. In heat discharge process, initial temperature of sodium pyrophosphate was maintained at temperature $85^{\circ}C,\;90^{\circ}C,\;95^{\circ}C$ which varied cooling temperature $50^{\circ}C,\;60^{\circ}C,\;70^{\circ}C$. The experiment has been reached conclusions as follows. 1) Heat transfer properties of phase change material is controlled by conduction during heating and cooling process. 2) The temperature increased rapidly at initial stage and transient region increase slowly because of characteristic of latent heat. 3) The lower cooling water temperature is the less the time that get to thermal equivalent state take during discharge process. 4) The higher cooling water temperature is the less temperature difference between top and bottom in P.C.M during discharge process.

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HVDC 냉각시스템의 전기전도현상 및 부식현상 기술 분석과 스위칭 소자의 방열판 최적 설계 검토 (The Analysis of Electrical Conduction and Corrosion Phenomena in HVDC Cooling System and the Optimized Design of the Heat Sink of the Semiconductor Devices)

  • 김찬기;박창환;김장목
    • 전력전자학회논문지
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    • 제22권6호
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    • pp.484-495
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    • 2017
  • In HVDC thyristor valves, more than 95% of heat loss occurs in snubber resistors and valve reactors. In order to dissipate the heat from the valves and to suppress the electrolytic current, water with a high heat capacity and a low conductivity of less than 0.2 uS/cm must be used as a refrigerant of the heat sink. The cooling parts must also be arranged to reduce the electrolytic current, whereas the pipe that supplies water to the thyristor heat sink must have the same electric potential as the valve. Corrosion is mainly caused by electrochemical reactions and the influence of water quality and leakage current. This paper identifies the refrigerants involved in the ionization, electrical conductivity, and corrosion in HVDC thyristor valves. A method for preventing corrosion is then introduced. The design of the heat sink with an excellent heat radiation is also analyzed in detail.

열용량이 큰 벽체나 지붕재의 전도시계열 계수를 유한차분법으로 구하는 과정 (A Procedure for Computing Conduction Time Series Factors for Walls and Roofs with Large Thermal Capacity by Finite Difference Method)

  • 변기홍
    • 한국태양에너지학회 논문집
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    • 제38권5호
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    • pp.27-36
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    • 2018
  • The purpose of this paper is to apply the numerical solution procedure to compute conduction time series factors (CTSF) for construction materials with large thermal capacities. After modifying the procedure in Ref. [9], it is applied to find the CTSF for the wall type 19 and the roof type 18 of ASHRAE. The response periods for one hr pulse load are longer than 24hrs for these wall and roof. The CTSF generated using modified procedure agree well with the values presented in the ASHRAE handbook. The modified procedure is a general procedure that can be applied to find CTSF for materials with complex structures. For the large thermal capacity materials, it should be checked whether thermal response period of the material is over 24hr or not. With suggested solution procedure, it is easy to check the validity of the CTSF based on 24hr period.

극저온냉동기로 전도냉각되는 초전도시스템의 열적 안정성 (Thermal stability of superconducting systems conduction-cooled by cryocooler)

  • 권기범;장호명
    • 한국초전도ㆍ저온공학회논문지
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    • 제3권1호
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    • pp.56-63
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    • 2001
  • The thermal stability conditions are investigated for superconducting magnet systems cooled conductively by cryocooler without liquid cryogens. The worst scenario in the systems is that the heat generation in the resistive state exceeds the refrigeration. causing a rise in the temperature of the magnet winding and leading to the burnout. It is shown by an analytical solution that in the continuous resistive state, the temperature may increase indefinitely or a stable steady-state may be reached, depending upon the relative size of the magnet with respect to the refrigeration capacity of the cryocooler. The stability criteria include the temperature-dependent Properties of the magnet materials and the refrigeration characteristics of the cryocooler. A useful graphical scheme is Presented and discussed to demonstrate the physical importance of the results.

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지하거주공간의 연간 열환경에 관한 연구 (A Study on the Yearly Thermal Environmental Characteristics in Underground Space)

  • 정효민;정한식
    • 동력기계공학회지
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    • 제2권3호
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    • pp.27-33
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    • 1998
  • The room temperature and air conditioning load in the underground space have been investigated numerically by the unsteady heat conduction equation. The model room has 3 m in height and 10 m in width, and it's position in the underground depth are 0.5 m to 5 m. When the room was located around surface, the room temperatures were strongly influenced by the atmosphere. But the underground depth is more than 2 m, the yearly temperature amplitude was small and the temperature phase was delayed. Up to 5 m of the depth, the cooling and heating load was decreased rapidly, but over 10 m of the depth, the air conditioning load was constant.

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