• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.228.2-228.2
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• 2016

The triggered vacuum switch (TVS) discharges high current through two processes. In the first process, an igniting plasma is generated at a trigger system, and the next process that a main discharge is taken place sequentially at a six-gap rod electrode within a few microsecond. In general, a triggered voltage producing the igniting plasma is increased. However, after several hundred shots, it goes down and stable, in our experiment the trigger voltage is about 5 kV after 250 shots. This triggered characteristics comes from the ceramic insulator which is covered by an electrode material, therefore we have focused on the first igniting plasma process. The igniting plasma has been generated at the surface of a ceramic insulator under a strong electric field. The electric field can be increased through modifying geometries of trigger components which compose of a trigger pin, a ceramic insulator and an enclosed holder. We fabricated not only two types of trigger pin which are a plane head and an umbrella head type, but two different holders which are a concave and a convex type. In this paper the result that the dependency of geometries for these four combined types is included, but the study of the ceramic insulator is not. The research of the ceramic insulator will be announced in the other paper.

• Natural Product Sciences
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• v.17 no.1
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• pp.45-50
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• 2011

Sophisticated modern research tools for evaluation of medicinal plants are available but microscopic methods are one of the simplest and cheapest methods to establish the identity of the source materials. Pharmacognostical investigation of the dried, powdered and anatomical sections of the fruits of Trachyspermum roxburghianum (DC) Craib was carried out to determine its macro and microscopical characteristics along with its physical constants. Externally, the fruits, yellowish or greenish brown in colour are elongated, elliptical, slightly curved, prominently ridged and longitudinal. As seen in transectional views of the fruits from Trachyspermum roxburghianum, the mericarp has concave sides called commissural surfaces and a convex outer side called the dorsal surface. The mericarp has three primary ridges alternating with two secondary ridges on the dorsal side. On the commissural side, there are two primary ridges which are lateral in position and two secondary ridges in the commissural side. The seed is attached to the pericarp by a short stalk called a raphe. Circular, four-lobed calcium oxalate crystals are fairly abundant in the endosperm. Phytochemical studies revealed the presence of phenolic compounds, triterpenoids, proteins and sugars. The pharmacognostical profile of the fruits will assist in standardization for quality, purity and sample identification.

• Environmental Engineering Research
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• v.22 no.1
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• pp.95-107
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• 2017

Adsorption equilibrium and kinetic behavior of two toxic heavy metals hexavalent chromium [Cr(VI)] and mercury [Hg(II)] on mustard oil cake (MOC) was studied. Isotherm of total chromium was of concave type (S1 type) suggesting cooperative adsorption. Total chromium adsorption followed BET isotherm model. Isotherm of Hg(II) was of L3 type with monolayer followed by multilayer formation due to blockage of pores of MOC at lower concentration of Hg(II). Combined BET-Langmuir and BET-Freundlich models were appropriate to predict Hg(II) adsorption data on MOC. Boyd's model confirmed that external mass transfer was rate limiting step for both total chromium and Hg(II) adsorptions with average diffusivity of $1.09{\times}10^{-16}$ and $0.97m^2/sec$, respectively. Desorption was more than 60% with Hg(II), but poor with chromium. The optimum pH for adsorptions of total chromium and Hg(II) were 2-3 and 5, respectively. At strong acidic pH, Cr(VI) was adsorbed by ion exchange mechanism and after adsorption reduced to Cr(III) and remained on MOC surface. Hg(II) removal was achieved by complexation of $HgCl_2$ with deprotonated amine ($-NH_2$) and carboxyl (COO-) groups of MOC.

• Korean Chemical Engineering Research
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• v.48 no.3
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• pp.397-400
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• 2010

The interfacial hydrodynamic issues in the screen printing are experimentally investigated by using model inks that are prepared by dispersing alumina nanoparticles in water. The printing patterns of the inks that are passed through differing geometrical shapes of screen on solid surfaces with differing wettability are not solely determined by the pattern on the screen. The dynamic contact angle cannot solely explain the physics of the problem, either. The difference between the screen and printing patterns was not the same for concave and convex corners. Especially the elasticity of ink affects the edge shape.

• Journal of the Optical Society of Korea
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• v.16 no.1
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• pp.36-41
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• 2012

Polymethylmethacrylate powders are commonly used to improve the spreadability and blurring effects of powder foundation cosmetics. In this study, the opacity and haze effect of four types of polymethylmethacrylate powders and their 10wt% powder foundation formulation was evaluated. The distorted random hemispherical particulates with both concave and convex portions showed the highest haze and opacity value as a single powder substance. And as a formulated phase, the powder foundation formulation containing particulates with fine pores provided the highest haze and opacity value. We also examined the quantity of reflected light over the angular range $20-75^{\circ}$ by polarized light goniophotometry. The total reflected light intensity, surface-reflected light, and internally reflected light were characterized. These studies demonstrated that hemispherical PMMA powders produce natural brilliance by creating high internally reflected light which is similar to the total reflection profile of artificial skin.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.1
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• pp.73-84
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• 1995

New morphological positioning algorithm and inspection method are presented and compared with a method by means of the Hough transform. The positioning algorithm is the process of finding the center and the rotated angle of the surface mounted device (SMD). The inspection method is capable of detecting the location of broken or bent leads. In order to obtain the center and the orientation of the SMD rapidly, the Hough transform method utilizes feature points (concave points) and is executed on a DSP board. The proposed morphological method is implemented by using the morphological skeleton subsets, and an ultimate orientation is decided by the Hit-or-Miss transform (HMT). In the inspection process, two inspection methods also are presented. The first method utilizes the morphological methods, i.e., opening and closing. It is performed before the positioning process and called an initial inspection. The second method follows the positioning process and is performed by an inspection of intersections of rulers and the lead edge (or the skeleton). It is a ruling technique which is referred to as a detailed inspection. We find the morphological approach is preciser and faster than the Hough approach by the comparison of the proposed algorithms.

• Proceedings of the KSME Conference
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• 2000.11b
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• pp.591-596
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• 2000

Flow through compliant tubes with linear taper in wall thickness is numerically simulated by finite element analysis. Two models are examined: a planar two-dimensional channel, and an axisymmetric tube. For verification of the numerical method, flow through a compliant stenotic vessel is simulated and compared to existing experimental data. Computational results for an axisymmetric tube show that as cross-sectional area falls with a reduction in downstream pressure, flow rate increases and reaches a maximum when the speed index (mean velocity divided by wave speed) is near unity at the point of minimum cross-section area, indicative of wave speed flow limitation or "choking" (flow speed equals wave speed) in previous one-dimensional studies. For further reductions in downstream pressure, flow rate decreases. Cross-sectional narrowing is significant but localized. When the ratio of downstream-to-upstream wall thickness is ${\le}$ 2 the area throat is located near the downstream end; as wall taper is increased to ${\ge}$ 3 the constriction moves to the upstream end of the tube. In the planar two-dimensional channel, area reduction and flow limitation are also observed when outlet pressure is decreased. In contrast to the axisymmetric case, however, the elastic wall in the two-dimensional channel forms a smooth concave surface with the area throat located near the mid-point of the elastic wall. Though flow rate reaches a maximum and then falls, the flow does not appear to be choked.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.2
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• pp.81-88
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• 2020

The damping hinge of a built-in refrigerator was examined in terms of its stress and fatigue life. Analysis of the initial design showed that stress concentration occurred at the concave surface of the hinge lever, which was broken during the door opening-and-closing endurance test of the prototype. The maximum von Mises stress at this location exceeded the yield strength. In addition, Goodman fatigue analysis of the initial design showed that the fatigue life at this location was consistent with the failure observed during the endurance test. Based on these results, an improved design for the damping hinge was derived. Analysis of this improved design showed that the stress concentration in the hinge lever of the initial design was eliminated. In this case, the maximum stress occurred at the position where the hinge lever was in contact with the door stopping pin, and the maximum von Mises stress was smaller than the yield strength. Goodman fatigue analysis of the improved design indicated that the fatigue life of the entire damping hinge was infinite. It was therefore concluded that the improved design does not suffer from fatigue damage during the endurance test.