• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.11
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• pp.1350-1357
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• 1988

The dual dielectric films have been grown on single-crystalline silicon substrates with the thickness ranging from 125A to 180A at various gas and temperature conditions by using rapid thermal process that included independent nitridation step. The film characteristics and their dependence on the contents of the hydrochloric gas and the processing time have been studied. By the addition of the hydrochloric gas, the initial oxide thickness was significantly changed, but after sequential nitridation processes the thickness of the films was nevertheless a little bit varied within 10A. All the samples of the dual dielectric films show the increased breakdown voltages in proportion to the additive contents of the hydrochloric gas and also show the higher breakdown strengths than the thermal oxide and nitrided oxide films grown by the conventional furnance process or the rapid thermal nitridation process that was composed of the dependent nitridation cycles.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.64-72
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• 2023

In this study, after transferring graphene on a Cu substrate and printing a Sn-3.0Ag-0.5Cu Pb-free solder paste on the Cu substrate, effects of the transferred graphene on formations and growths of intermetallic compound (IMC) at the interface between the Cu substrate and the solder were reported during processes of reflow soldering and isothermal aging for 1000 h with various temperatures (125, 150, and 175 ℃). Thicknesses of Cu₆Sn₅ and Cu₃Sn IMCs at the interfaces with graphene were decreased during the reflow soldering and isothermal aging processes compared to those without graphene. The transferred graphene layers also showed that the growth rate constant and square of growth rate constant which related to the growth mechanisms of Cu₆Sn₅ and Cu₃Sn IMCs with t he t emperature a nd t ime of t he i sothermal aging c ould dramatically decreased.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2006.05a
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• pp.317-324
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• 2006

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, ($CH_{3})_{3}N$) 25wt%-clathrate compound with ethanol($CH_{3}CH_{2}OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5w% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C $ and minimum supercooling is $0.8,\;0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kJ/kgK$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature thermal storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.23-28
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• 2007

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, $(CH_3)_3N$) 25wt%-water clathrate compound with ethanol($CH_3CH_2OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5wt% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C$ and minimum supercooling is 0.8, $0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kcal/kg^{\circ}C$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature latent heat storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• Journal of the Korean Ceramic Society
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• v.39 no.1
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• pp.51-56
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• 2002

The effect of kind of starting materials used for a sintering additive. magnesium acetate and magnesium nitrate, on the mechanical properties of alumina sintered body made by adding 1000 ppm of the additives, respectively, was investigated. As for the alumina sintered bodies prepared from magnesium acetate and magnesium nitrate, we observed that their relative densities decreased rapidly with increasing sintering temperature 1$600^{\circ}C$. Outer layer of alumina bodies had a duplex microstructure consisting of pores and grain growth. Also the inner layer had a second phase between alumina grain boundaries. By EPMA analysis, we confirmed that the grain boundary phase was a compound containing Mg.

• Journal of Korean Society on Water Environment
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• v.30 no.4
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• pp.403-408
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• 2014

The toxicity of heavy metals (Zn, Pb) and diesel, in single and binary solution was investigated using the photobacterium Vibrio fischeri (Microtox test) as a test organism. In this experiment, the concentration of water soluble fraction of diesel was based on the total petroleum hydrocarbon (TPH). The toxicity of each single compound showed the following $EC_{50}$ (15min): Zn 1.90 mg/L, Pb 0.31 mg/L, TPH 2.09 mg/L. The observed toxicity of binary mixtures increased, depending on the concentration of the mixed substance. The effects were defined as synergistic, antagonistic, or additive, in accordance with the sign of difference between the predicted and observed toxicity at binary mixtures. The interactive effects between zinc and lead were synergistic, on the other hand, antagonistic and additive effects were found in each metal and TPH mixtures on the bioluminescence of V. fischeri.

• Safety and Health at Work
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• v.10 no.2
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• pp.229-236
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• 2019

Background: Emerging reports suggest the potential for adverse health effects from exposure to emissions from some additive manufacturing (AM) processes. There is a paucity of real-world data on emissions from AM machines in industrial workplaces and personal exposures among AM operators. Methods: Airborne particle and organic chemical emissions and personal exposures were characterized using real-time and time-integrated sampling techniques in four manufacturing facilities using industrial-scale material extrusion and material jetting AM processes. Results: Using a condensation nuclei counter, number-based particle emission rates (ERs) (number/min) from material extrusion AM machines ranged from $4.1{\times}10^{10}$ (Ultem filament) to $2.2{\times}10^{11}$ [acrylonitrile butadiene styrene and polycarbonate filaments). For these same machines, total volatile organic compound ERs (${\mu}g/min$) ranged from $1.9{\times}10^4$ (acrylonitrile butadiene styrene and polycarbonate) to $9.4{\times}10^4$ (Ultem). For the material jetting machines, the number-based particle ER was higher when the lid was open ($2.3{\times}10^{10}number/min$) than when the lid was closed ($1.5-5.5{\times}10^9number/min$); total volatile organic compound ERs were similar regardless of the lid position. Low levels of acetone, benzene, toluene, and m,p-xylene were common to both AM processes. Carbonyl compounds were detected; however, none were specifically attributed to the AM processes. Personal exposures to metals (aluminum and iron) and eight volatile organic compounds were all below National Institute for Occupational Safety and Health (NIOSH)-recommended exposure levels. Conclusion: Industrial-scale AM machines using thermoplastics and resins released particles and organic vapors into workplace air. More research is needed to understand factors influencing real-world industrial-scale AM process emissions and exposures.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.

• Journal of the Korean Ceramic Society
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• v.27 no.6
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• pp.799-807
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• 1990

In this study, effects of oxide additives on mechanical properties and microstructure of A1N and A1N polytype ceramics were investigated. Fine A1N powder was synthesized by nitriding alumiuim hydroxide prepared from Al-isopropoxide, at 1350$^{\circ}C$ for 10h in N2 atmosphere. By adding 3w/o Y2O3, 0.56w/o CaO, and 10w/o SiO2 to AlN powder, AlN and AlN polytype ceramics were prepared by hot-pressing under the pressure of 30 MPa at 1800$^{\circ}C$ for 1h. AlN ceramics with no additives formed considerable amount of AlON phase, while AlN ceramics doped with Y2O3 or CaO decreased AlON phase and formed Y-Al or Ca-Al oxide compound. AlN＋10w/o SiO2(＋3w/o Y2O3) composition produced AlON and AlN polytype compound having 21R as a major phase. Room temperature flexural strength of AlN ceramics with no additive was 246MPa, and room temperature flexural strength and critical temperature difference by thermal shock(ΔTc) of AlN ceramics dooped with Y2O3 or CaO were 532MPa/340$^{\circ}C$ and 423MPa/300$^{\circ}C$, respectively. Y2O3 and CaO used as sintering agent played roles of densification and oxygen removal of AlN ceramics, and affected grain growth/grain morphologies of AlN ceramics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.3
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• pp.188-192
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• 2000

In this study PZT etching was performed using planar inductively coupled Ar/Cl$_2$/BCI$_3$ plasma. The etch rate of PZT film was 2450 $\AA$/min at Ar(20)/BCl$_3$(80) gas mixing ratio and substrate temperature of 8$0^{\circ}C$. X-ray photoelectron spectroscopy(XPS) analysis for films composition of etched PZT surface was utilized. The chemical bond of PbO is broken by ion bombardment and Cl radical, and the peak of metal Pb in a Pb 4f narrow scan begins to appear upon etching. As increasing additive BCl$_3$content the relative content of oxygen decreases rapidly in contrast with etch rate of PZT thin film. So we though that the etch rate of PZT thin film increased because abundant B and BCl radicals made volatile oxy-compound such as B$_{x}$/O$_{y}$ and/or BClO$_{x}$ bond. We achieved etch profile of about 80$^{\circ}$ at Ar(20)/BCl$_3$(80) gas mixing condition and substrate temperature of 8$0^{\circ}C$TEX>X>.