• 한국전기전자재료학회논문지
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• 제16권6호
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• pp.549-554
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• 2003

The purpose of this paper is to investigate the solder properties by the change of P mass percentage. Tension test, wetting balance test, spread test, and analysis of intermetallic compound after isothermal aging of Sn-2.5Ag-0.7Cu-0.005P, Sn-2.5Ag-0.7Cu-0.01P, Sn-2.5Ag-0.7Cu-0.02P, Sn-0.7Cu-0.005P were performed. Adding P in the solder alloys resulted in improvement of tensile strength, reduction of intermetallic compound growth, reduction of oxidization in fusible solders under wave soldering. After comparing solder alloy containing P with tin-lead eutectic solder alloy, P contained solders alloys showed much better solder properties than eutectic solder alloy. Furthermore, this solder alloy presented remarkable properties than any other lead-free solder alloy.

• 한국염색가공학회지
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• 제19권6호
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• pp.35-38
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• 2007

FTriphenylamine dye compound having diheteryl moiety was synthesized and its photoluminescent property was investigated. Organic luminescent materials have received great attentions due to potential application subjects onto full color image displays. In this context, the dye (III) for light emitting materials was synthesized using 2-(4-amino-2-hydroxyphenyl)benzoxazole (I) and 4,4'-diformyltriphenylamine (II). It is well known that the amino groups of compound (I) react with carbonyl groups, especially an aldehyde, to afford azomethine linkages. The dye shows bulish-green fluorescence property, which is anticipated for the light-emitting material for display devices. In this context, our aim is to synthesize diheteryl-substituted triphenylamine fluorescent dye as an emitting material. The spectroscopic characteristics and the fluorescent properties of this dye molecule were examined and determined.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.652-660
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• 2004

The cis-hex-3-ene-1,5-diynyl-bridged diiron compound 3, [(η$^{5}$ - $C_{5}$ M $e_{5}$ ) Fe(dppe)］$_2$($\mu$-C≡C-CH=CH-C≡C), have been prepared and characterized by cyclic voltammetry(CV), and electronic spectroscopy (UV-VIS and near-IR, NMR). From the results, compound 3 show two well resolved, single-electron, reversible oxidation waves by CV, and comproportionation constant(Kc) calculated from the CV data for compound 3. The Mixed-valence (MV) radical cation 3$^{+}$ show strong absorptions in the near IR, 1586 nm, and this band is more readily assigned as MV $\pi$-$\pi$ band of delocalized complex (Robin-Day Mixed-valence Class III), and the $H_{ab}$ , effective coupling parameter are most consistent with electronic delocalization.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.258-259
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• 2005

[ $CuInSe_2$ ] thin films were fabricated at various fabrication conditions (substrate temperature, sputtering pressure, BC/RF power, vapor deposition, heat treatment). And structural and electrical properties were measured in order to certify optimum conditions for growth of the ternary compound semiconductor $CuInSe_2$ thin films with stoichiometric composition. $CuInSe_2$ thin film was well made at the heat treatment of 500[$^{\circ}C$] of SLG/Cu/In/Se stacked elemental layer which was prepared by sputter and thermal evaporator, and chemical composition of the thin film was analyzed nearly as the proportion of 1 : 1 : 2. At the same time, carrier concentration, hall mobility and resistivity of the thin films was $1.27\sim9.88\times10^{17}[cm^{-3}]$, $49.95\sim185[cm^2/V{\cdot}s]$ and $10^{-1}\sim10^{-2}[\Omega{\cdot}cm]$, respectively

• Elastomers and Composites
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• 제56권2호
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• pp.72-78
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• 2021

A phase-change material (PCM) is a material that has the ability to delay heat transfer by absorbing heat from its environment or releasing heat to its environment while its phase changes from solid to liquid or liquid to solid at a specific temperature. As it is applied, it can contribute to environmental conservation such as energy savings and carbon dioxide emission reduction. In order for a PCM to store and release heat, the volume change during its phase transition should be large, and thus a phase transition space is required. When a PCM is used as a polymer additive, it is confined within the polymer, and there is no phase transition space; thus, its ability to absorb and release heat is significantly reduced. Therefore, in this study, porous silica was used to provide EVA/PCM compounds with sufficient space for their phase transition, and to improve the compatibility between the EVA and PCM, modified silica is used: surface-modified 5 wt% silica with 3-methacryloxypropyltrimethoxysilane. The compound was prepared and compared with the silica compound. The presence or absence of the modified silica surface modification was confirmed using Fourier-transform infrared spectroscopy and thermogravimetric analysis, the heat capacity of the compound was evaluated based on a differential scanning calorimetry analysis, and its mechanical strength and morphology were determined using scanning electron microscopy.

• 한국분말재료학회지
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• 제31권1호
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• pp.37-42
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• 2024

Friction stir spot welding (FSSW) is a solid-state joining process and a rapidly growing dissimilar material welding technology for joining metallic alloys in the automotive industry. Welding tool shape and process conditions must be appropriately controlled to obtain high bonding characteristics. In this study, FSSW is performed on dissimilar materials AA5052-H32 aluminum alloy sheet and SPRC440 steel sheet, and the influence of the shape of joining tool and tool insertion depth during joining is investigated. A new intermetallic compound is produced at the aluminum and steel sheets joint. When the insertion depth of the tool is insufficient, the intermetallic compound between the two sheets did not form uniformly. As the insertion depth increased, the intermetallic compound layer become uniform and continuous. The joint specimen shows higher values of tensile shear load as the diameter and insertion depth of the tool increase. This shows that the uniform formation of the intermetallic compound strengthens the bonding force between the joining specimens and increases the tensile shear load.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1581-1583
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• 1999

Epoxy Compound has been used as insulation material in cable accessories. During the applying voltage to cable, heat shock is induced to accessory by the temperature difference between atmosphere and conductor. In this study, crack resistance, thermal and mechanical properties were evaluated about conventional epoxy compound and rubber toughened epoxy compound. Because rubber absorbs the stress caused by heat shock, crack resistance of rubber toughened epoxy compound is high. In the case of low thermal expansion coefficient, the compound shows high crack resistance because of low volumetric change.

• 열처리공학회지
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• 제14권2호
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• pp.103-109
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• 2001

Plasma nitrocarburising and post oxidation were performed on SM45C steel using a plasma nitriding unit. Nitrocarburising was carried out with various methane gas compositions with 4 torr gas pressure at $570^{\circ}C$ for 3 hours and post oxidation was carried out with 100% oxygen gas atmosphere with 4 torr at different temperatures for various times. It was found that the compound layer produced by plasma nitrocarburising consisted of predominantly ${\varepsilon}-Fe_{2-3}(N,C)$ and a small proportion of ${\gamma}-Fe_4(N,C)$. With increasing methane content in the gas mixture, ${\varepsilon}$ phase compound layer was favoured. In addition, when the methane content was further increased, cementite was observed in the compound layer. The very thin oxide layer on top of the compound layer was obtained by post oxidation. The formation of Oxide phase was initially started from the magnetite($Fe_3O_4$) and with increasing oxidation time, the oxide phase was increased. With increasing oxidation temperature, oxide phase was increased. However the oxide layer was split from the compound layer at high temperature. Corrosion resistance was slightly influenced by oxidation times and temperatures.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.603-608
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• 2023

Carbon black with high purity and excellent conductivity is used as a conductive filler in the semiconductive compound for EHV (Extra High Voltage) power cables of 345 kV or higher. When carbon black and CNT (carbon nanotube) are applied together as a conductive filler of a semiconductive compound, stable electrical properties of the semiconductive compound can be maintained even though the amount of conductive filler is significantly reduced. In EHV power cables, since the semi-conductive layer is close to the conductor, stable electrical characteristics are required even under high-temperature conditions caused by heat generated from the conductor. In this study, the theoretical principle that a semiconductive compound applied with carbon black and CNT can maintain excellent electrical properties even under high-temperature conditions was studied. Basically, the conductive fillers dispersed in the matrix form an electrical network. The base polymer and the matrix of the composite, expands by heat under high temperature conditions. Because of this, the electrical network connected by the conductive fillers is weakened. In particular, since the conductive filler has high thermal conductivity, the semiconductive compound causes more thermal expansion. Therefore, the effect of CNT as a conductive filler on the thermal conductivity, thermal expansion coefficient, and volume resistivity of the semiconductive compound was studied. From this result, thermal expansion and composition of the electrical network under high temperature conditions are explained.

• 한국결정학회지
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• 제16권2호
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• pp.102-106
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• 2005

The crystal structure of the title compound has been analyzed by single crystal X-ray diffraction method. The compound crystallized in the triclinic space group $P\bar{1}$ with a=11.300(6) ${\AA}$, c=18.716(10) ${\AA}$, ${\alpha}=82.833(10)^{\circ}$, ${\beta}=83.042(11)^{\circ}$, ${\gamma}=66.139(10)^{\circ}$, $V=2162(2)\;{\AA}^{3}$, Z=2 and R1=0.661 for 10578 unique reflections. The four $C_{5}Me_{5}$ planar groups from a tetrahedron with a mean dihedral angle $70.92(9)^{\circ}$ among them and the $Ti_{4}O_{6}$ cage sits at the center of the tetrahedron. Each Ti atom in the $Ti_{4}O_{6}$ cage is bonded by three bridging oxygen atoms and coordinated by a $C_{5}Me_{5}$ ligand with a mean distance $2.067{\AA}$ from Ti atoms to the centroids of the four five-membered rings. Two oxygen atoms facing each other in $Ti_{4}O_{6}$ cage are $4.051(3){\AA}$ away in average.