• 한국결정학회지
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• 제19권1호
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• pp.1-6
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• 2008

Dilithio-o-carborane과 dipenyl disulfide를 반응(反應)하여 a phenyl thiolated o-carborane compound가 얻어 졌으며 X-ray crystallography로 밝혀진 이 compound의 구조(構造)와 ab initio 및 density functional theory로 계산(計算)한 이 compound의 구조문(構造間)에 conformational similarity가 있음을 확인(確認)하였다.

• 전기학회논문지P
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• 제65권3호
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• pp.224-234
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• 2016

This study developed the conductivity pattern of solid surface using laser direct pattern and compound polymer material technology. For development direct patterning system of solid surface, we used the laser power stabilizer, the dynamic focusing, 3D scanner S/W and the auto aligning techniques. Also For conductivity pattern, we are developed compound polymer material with additive by electro-less plating. These technologies are already used commercially. However operation and control integrated system for direct patterning of solid surface are not yet developed. The objective of this paper is to introduce the laser direct structuring for simple process improvement instead complex PCB process, and develop the operating stability and integration system. Also we implemented new application of laser direct structuring through sample manufacture.

• 한국방재학회:학술대회논문집
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• 한국방재학회 2008년도 정기총회 및 학술발표대회
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• pp.529-532
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• 2008

Recently the compound material has interested in using the structural material as the bridge member assembly. It is the lighter material against existing construction material and has excellent durability and economy. The existing floor of bridge has its short period to repair and replace compared to other parts of the bridge with the pavement and the shoe. These deteriorations of usage and safety by aging and corrosion are needed frequent maintenance. The use of compound material as a structural member suggests solve these problems. So this thesis evaluates the static and the fatigue performance for whether there are fiber lamination direction and stress concentration section of FRP floor plate, the compound material.

• 항공우주시스템공학회지
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• 제9권3호
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• pp.1-7
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• 2015

In this study, the design of compound smart materials hydraulic pump that can be applied to a small-medium size UAV having a limited space envelope and weight has been conducted. Compound Smart Material Pump(CSMP) proposed in this paper is composed of a pressurize pump and a flow pump for supplying the high pressure and fluid displacement to overcome the disadvantages of the piezoelectric actuator which has a small strain. Though this compound smart material pump has been designed as small size and lightweight as possible, it can sequentially supply the sufficient large flow rate and pressure required for the brake operation. For the design of CSMP, about 2,700 kg (6,000 lb) class fixed wing manned aircraft was selected. Based on the established requirements, the design of the CSMP have been done by strength, vibration, and fluid flow analysis.

• 한국태양에너지학회 논문집
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• 제34권6호
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• pp.85-92
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• 2014

This study carried out experimental on the cooling characteristics of clathrate compound including TMA(Tri-Methyl-Amine ; $(CH_3)_3N$) as a low temperature latent heat storage material. And additive was used for subcooling improvement of TMA-water clathrate compound. The conclusion of above study is as following ; TMA 25wt%-water clathrate compound is shown stable phase change and low subcooling degree. The subcooling was improved in the case ethanol($CH_3CH_2OH$) 0.5wt% is added to TMA 25wt%-water clathrate compound.

• 한국전기전자재료학회논문지
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• 제17권4호
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• pp.432-438
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• 2004

In this study, we investigated the WVTRs Properties of inorganic thin composite films(ITCFs) to be newly adopted as the passivation layer of the OLED to replace the inorganic compound material Because we thought that inorganic compound materials were limited to enhance the barrier property of thin film. So, ITCFs were fabricated by mixing the cooperated material with the base material. And then, ITCFs were deposited onto the plastic substrate using the electron beam evaporation system and the water vapor transmission rates(WVTRs) were measured using the Mocon equipment. As a result of the WVTR measurement, we could analyze the WVTR values for various ITCFs. ITCFs had a remarkably lower value than the inorganic compound film. Through the analysis of thin film, we can understand the crystal structure and mixed amount. Therefore, ITCFs can be used as the inorganic passivation layers of OLED with the inorganic compound film.

• 한국식품영양학회지
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• 제1권1호
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• pp.7-12
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• 1988

In the view of the fact that data are scare concerning the change of Methionine composition of poultry meat in function of storage temperature and cooking method. The present study was carried out to change in these compounds and the results were summarized as follows. 1. The result of measuring methionine compound of raw material stored under the condition of 5$^{\circ}C$, 1$0^{\circ}C$ for 6 weeks were increased as temperature increases. 2. The result of change in methionine compound of roasting were decreased than raw material It was greatly decreased in the storage for 42 days at 1$0^{\circ}C$ and slightly decreased in the storage for 14 days at 5$^{\circ}C$ 3. When the boiling in the water, methionine compound was decreased than roasting to compare with raw material 4. By the results of this study, one of the best cooking method is roasting, because of the change in methionine compound of roasting is slightly decrease.

• 대한가정학회지
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• 제19권1호
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• pp.47-52
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• 1981

In the view of the fact that data are scare concerning the change of Methionine composition of poultry meat in function of storage temperature and cooking method. The present study was carried out to change in these compounds and the results were summarized as follows. 1. The result of measuring Methionine compound of Raw material stored under the condition of $5^{\circ}C$, $10^{\circ}C$ for 6 weeks were increased as temperature increases. 2. The result of change in Methionine compound of Roasting were deceased than Raw material It was greatly decreased in the storage for 42 days at 1$0^{\circ}C$ and slightly decreased in the storage for 14 days at $5^{\circ}C$. 3. when the Boiling in the water, Methoinine compound was decreased than Roasting to compare with Raw material 4. By the results of this study, one of the best cooking method is Roasting, Because of the change I Methionine compound of Roasting is slightly decrease.

• E2M - 전기 전자와 첨단 소재
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• 제5권4호
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• pp.393-399
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• 1992

In order to increase the coupling strength between bisphenol-A type epoxy resin and filler SiO$_{2}$ it was treated to filler with silane coupling agent[KBM-603]. To observe how silane coupling agent effects on dielectric breakdown strength of Epoxy/SiO$_{2}$ compound material, specimens of eight type were made like following. (A-1, A-2), (B-1, B-2), (C-1, C-2), (D-1, D-2) (see 2-2. Specimen) Specimen treated with silane coupling agent had always bigger dielectric breakdown strength than non-treated specimen. Under the influence of silane coupling agent, increment ratio of dielectric breakdown strength at specimen manufactured by hand drill was very bigger than that of specimen inserted spherical electrode. Therefore, as the specimen shape was varied, it was studied on effect that silane coupling agent affects on dielectric breakdown strength of Epoxy/SiO$_{2}$ compound material.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.226-229
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• 1999

Epoxy compound has been used as insulation material in electrical equipment for a long time because of its excellent electrical, mechanical and chemical properties. Nowdays, becoming higher voltage system, the properties of interface between epoxy and metal insert become more important. The breakdown voltage of epoxy compound for electric material is variable according to the surface roughness of metal insert. Generally, with metal insert sanding, the adhesion strength is enhanced and the breakdown strength is reduced. But in this study, we knew that the adhesion strength became enhanced but the breakdown strength didn\`t reduced with metal insert sanding. So in this study sanding. So in this study, we suggest the optimum interface condition by adjusting the surface roughness.