• Title/Summary/Keyword: Component실장Tester

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A Study for Adopting the Temperature Control Unit on Memory Device Tester Based on Principle of Thermoelectric Semiconductor (열전소자 원리를 이용한 부품 Tester용 온도공급 장치 연구 (메모리 Device Tester용 온도제어장치 도입을 위한 연구))

  • Kim, Sun-Ju;Hong, Chul-Ho;Shin, Dong-Uk;Seo, Seong-Bum;Lee, Moo-Jea
    • Proceedings of the KIEE Conference
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    • 2003.11c
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    • pp.414-416
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    • 2003
  • As environmental conditions for memory products are increasingly high speed/high density, adopting diverse system configuration, it's more and more difficult for current component tester to adopt the actual condition of field application. If system test screening is realized in component level, test coverage failure can be made more secured in the initial stage, evaluation cost can be reduced and the effectiveness of investment for the facility can be maximized. Based on the above background, component automatic system tester was developed and showed off satisfactory results per each memory device family. In this paper, component quality stabilization strategy and cost saving for tester investment through future Quality monitoring and application to mass production will be presented.

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ICT inspection System for Flexible PCB using Pin-driver and Ground Guarding Method (핀 드라이버와 접지가딩 기법을 적용한 모바일 디스플레이용 연성회로기판의 ICT검사 시스템)

  • Han, Joo-Dong;Choi, Kyung-Jin;Lee, Young-Hyun;Kim, Dong-Han
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.47 no.6
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    • pp.97-104
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    • 2010
  • In this paper, ICT (in circuit tester) inspection system and inspection algorithm is proposed and detects whether inferiority exists or not in the mounted device on the flexible PCB in cell phones or mobile display devices. The system is composed of PD (pin-driver) and GGM (ground guarding method). The structural characteristics of these flexible PCB are analyzed, which is needed to input or output the test signal. Test signal to investigate the characteristics of passive components is generated using modified circuit diagram and proposed inspection algorithm. PM (pin-map) is decided on the basis of circuit diagram and has the information about the kind of test signal to be applied and the pad number for the test signal to be connected. PD is designed to load a proper test signal for a specific pad and is adjusted according to PM so that the reconstructed circuit has minimum node and mash. The proposed ICT inspection system is realized using PD and GGM. Using the system, an experiment for each passive component is done to investigate the measurement accuracy of the developed system and an experiment for real flexible PCB model is done to verity the effectiveness of the system.