• Title/Summary/Keyword: Color Chip

Search Result 144, Processing Time 0.025 seconds

Development of High Efficiency and High Power LED Package for Applying Silicone-Reflector (실리콘 리플렉터를 적용한 고효율 고출력 LED 패키지 개발)

  • Jeong, Hee-Suk;Lee, Young-Sik;Lee, Jung-Geun;Kang, Han-Lim;Hwang, Myung-Keun
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
    • /
    • v.27 no.9
    • /
    • pp.1-5
    • /
    • 2013
  • We developed high-efficient 6W-LED package with simple structure by applying Heat Slug and silicone-reflector. LED package was manufactured in $8.5{\times}8.5mm$ sized multi-chip structure having thickness of $500{\mu}m$ achieved by bonding silicon-reflector with prepreg on top of the plate after implementing the reflector placed on copper substrate Half Etching by thickness of $200{\mu}m$. The luminous flux, luminous efficacy, correlated color temperature, color rendering index and thermal resistance of developed LED was evaluated, and it verified the application of products by applying it to 120W-LED road luminaires through simulation. The luminous efficacy of LED package reached over 130lm/W, and it is possible to be manufactured into 120W-LED road luminaires using 18 packages. In addition, the simulation results showed average of horizontal illuminance and overall illuminance uniformity that is suitable for three-lane road.

Development of Red CaAlSiN3:Eu2+ Phosphor in Glass Ceramic Composite for Automobile LED with High Temperature Stability (고온 안정성이 우수한 자동차 LED용 Red CaAlSiN3:Eu2+ 형광체/Glass 세라믹 복합체 개발)

  • Yoon, Chang-Bun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.31 no.5
    • /
    • pp.324-329
    • /
    • 2018
  • Red phosphor in glasses (PiGs) for automotive light-emitting diode (LED) applications were fabricated with 620-nm $CaAlSiN_3:Eu^{2+}$ phosphor and Pb-free silicate glass. PiGs were synthesized and mounted on high-power blue LED to make a monochromatic red LED. PiGs were simple mixtures of red phosphor and transparent glass powder. After being fabricated with uniaxial press and CIP at 300 MPa for 20 min, the green bodies were thermally treated at $550^{\circ}C$ for 30 min to produce high dense PiGs. As the phosphor content increased, the density of the sintered body decreased and PiGs containing 30% phosphor had a full sintered density. Changes in photoluminescence spectra and color coordination were studied by varying the thickness of plates that were mounted after optical polishing. As a result of the optical spectrum and color coordinates, PiG plate with $210{\mu}m$ thickness showed a color purity of 99.7%. In order to evaluate the thermal stability, the thermal quenching characteristics were measured at temperatures of $30{\sim}150^{\circ}C$. The results showed that the red PIG plates were 30% more thermally stable compared to the AlGaInP red chip.

Luminescence Properties of Ba3Si6O12N2:Eu2+ Green Phosphor

  • Luong, Van Duong;Doan, Dinh Phuong;Lee, Hong-Ro
    • Journal of the Korean institute of surface engineering
    • /
    • v.48 no.5
    • /
    • pp.211-217
    • /
    • 2015
  • To fabricate white LED having a high color rendering index value, red color phosphor mixed with the green color phosphor together in the blue chip, namely the blue chips with RG phosphors packaging is most favorable for high power white LEDs. In our previous papers, we reported on successful syntheses of $Sr_{2-}$ $Si_5N_8:Eu^{2+}$ and $CaAlSiN_3$ phosphors for red phosphor. In this work, for high power green phosphor, greenemitting ternary nitride $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphor was synthesized in a high frequency induction furnace under $N_2$ gas atmosphere at temperatures up to $1400^{\circ}C$ using $EuF_3$ as a raw material for $Eu^{2+}$ dopant. The effects of molar ratio of component and experimental conditions on luminescence property of prepared phosphors have been investigated. The structure and luminescence properties of prepared $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphors were investigated by XRD and photoluminescence spectroscopy. The excitation spectra of $Ba_3Si_6O_{12}N_2:Eu^{2+}$ phosphors indicated broad excitation wavelength range of 250 - 500 nm, namely from UV to blue region with distinct enhanced emission spectrum peaking at ${\approx}530nm$.

Reduction of Acrylamide Formation in Potato Chips Fermented by Bacillus sp. (Bacillus sp. 발효를 이용한 감자 칩의 아크릴아마이드 저감화)

  • Lee, Joongjae;Oh, Myeonggeun;Chang, Yoon Hyuk;Lee, Youngseung;Jin, Yong-Ik;Chang, Dong-Chil;Kim, Sung-Hwan;Jeong, Yoonhwa;Kim, Misook
    • Journal of the Korean Society of Food Science and Nutrition
    • /
    • v.45 no.3
    • /
    • pp.460-465
    • /
    • 2016
  • The market for potato chips has expanded due to increased consumption of seasoned potato chips. However, the deep-frying process facilitates development of a browning color and formation of acrylamide. The objective of this work was to minimize browning color and acrylamide formation by fermentation prior to deep-frying. Potato slices were fermented by using three Bacillus strains, B. licheniformis (BL), B. methylotrophicus (BM), and B. subtilis, for 6 h at $30^{\circ}C$. In all fermentation groups, contents of total sugars in potato slices decreased. The color of fermented potato chips improved compared to the control. BM potato chips showed the best color values (76.33 in L value, 5.67 in a value, and 34.79 in b value). All fermentation processes reduced levels of acrylamide in deep-fried potato chips. Fermentation of potato slices for 2 h by BL reduced up to 96.1% acrylamide content. It was concluded that the fermentation process can positively affect color development and acrylamide formation.

Measurement of the Surface Emissivity of the LED Lighting Module (LED 조명 모듈 표면의 방사율 측정에 관한 연구)

  • Park, Jin-Sung;Huh, Chang-Su
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.26 no.6
    • /
    • pp.493-501
    • /
    • 2013
  • LED lighting is sensitive because it made by semiconductor. So it has been researched about radiation of heat technologies for a long time. In addition, measurement and assessment a radiation of heat also conducted. It is necessary to get a date of accuracy temperature on the board after LED driven for measuring Junction temperature of the LED Lighting. For this research, we use 5 chip which is 4 W power on top of LED lighting board made by aluminum. Thermal camera effects to emissivity depending on material and property of the surface in LED board because it determines thermal energy which emitted from material surface. it is not only thermal camera has not a standard about emissivity. It has an error of temperature when emissivity was measured by thermal camera. we confirmed that emissivity and reflected temperature depending on color and quality of the surface throughout experiment.

Luminescent Properties of $Mn^{2+}$ co-doped $Ca_8Mg_1(SiO_4)_4Cl_2:Eu^{2+}$ phosphor and Application in white LEDs

  • Park, Seung-Hyok;Park, Jung-Kyu;Kim, Chang-Hee;Chang, Hyun-Ju;Jang, Ho-Gyeom
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08b
    • /
    • pp.1529-1530
    • /
    • 2007
  • The manganese co-doped $Ca_8Mg_1(SiO_4)_4Cl_2:Eu^{2+}$,$Mn^{2+}$ phosphor was synthesized by solid-state reaction and its photoluminescence characteristics were investigated. The synthesized phosphor show two emission spetrums: green band of 512nm and yellow band of 550nm. White light-emitting diodes (LEDs) were fabricated through combination of a 405nm-emitting InGaN chip and a synthesis phosphor in a single package. Under 20mA current, its CIE chromaticity coordinates are x=0.40 and y=0.45 and a color temperature of 4053K.

  • PDF

APPLICATION OF TIN ION-PLATING TO THE ORTHODONTIC APPLIANCE (교정용 장치물에 대한 TiN Ion Plating의 응용)

  • Kwon, Oh-Won;Kim, Kyo-Han
    • The korean journal of orthodontics
    • /
    • v.21 no.1 s.33
    • /
    • pp.7-16
    • /
    • 1991
  • To estimate the possibility of the application of TiN ion-plating to the orthodontic appliance, colorimetric properties, and characteristics of ion-plated film as well as adhesive strength of TiN film to the substrate and mechanical properties of ion-plated orthodontic appliance were investigated. The obtained results were as follows: 1) TiN ion-plated film had the colorimetric properties which were the hue of about 2.5 Y, the brightness of about 6, and the chroma of about 4 by the standard color chip of JIS. 2) TiN ion-plated film was $2{\mu}m$ in thickness and its deposition pattern was rather irregular. 3) TiN phase was confirmed on the X-ray diffraction pattern. 4) Critical load for delamination of ion-plated film from stainless steel band was 10N. 5) Tensile and yield strength of ion-plated specimen was increased about 10Kg $f/mm^2$, while elongation was decreased $1\%$ compairing to the values of the non ion-plated specimen.

  • PDF

2.2" Digital driving AMOLED One-chip Solution for Mobile Application

  • Bae, Han-Jin;Kim, Seung-Tae;Lim, Ho-Min;Ha, Won-Kyu;Lee, Jae-Do;Kim, Ji-Hun;Kim, Hak-Su;Han, Chang-Wook;Tak, Yoon-Heung;Ahn, Byung-Chul
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2008.10a
    • /
    • pp.127-130
    • /
    • 2008
  • A 2.2" QVGA($320{\times}240$) 262,114 color AMOLED module has been developed using digital driving methodology. In this paper, we discuss the development of diver IC which is applied to Digital AMOLED module. Technologies for low cost IC structure and image quality enhancement are presented.

  • PDF

Design of Low Power OLED Driving Circuit (저소비 전력 OLED 디스플레이 구동 회로 설계)

  • 신홍재;이재선;최성욱;곽계달
    • Proceedings of the IEEK Conference
    • /
    • 2003.07b
    • /
    • pp.919-922
    • /
    • 2003
  • This paper presents a novel low power driving circuit for passive matrix organic lighting emitting diodes (OLED) displays. The proposed driving method for a low power OLED driving circuit which reduce large parasitic capacitance in OLED panel only use current driving method, instead of mixed mode driving method which uses voltage pre-charge technique. The driving circuit is implemented to one chip using 0.35${\mu}{\textrm}{m}$ CMOS process with 18V high voltage devices and it is applicable to 96(R.G.B)X64, 65K color OLED displays for mobile phone application. The maximum switching power dissipation of driving power dissipation is 5.7mW and it is 4% of that of the conventional driving circuit.

  • PDF

Design of Pattern Generation Circuit for Display Test (디스플레이 테스트를 위한 패턴 생성 회로 설계)

  • 조경연
    • Proceedings of the IEEK Conference
    • /
    • 2003.07b
    • /
    • pp.1149-1152
    • /
    • 2003
  • Now a days, many different kinds of display technologies such as Liquid Crystal Display (LCD), Organic Light Emitting Diode (OLED), and Liquid Crystal On Silicon (LCOS) are designed. And these display technologies will be used in many application products like High Definition Televisions (HDTVs) or mobile devices. In this paper, pattern generation circuit for display test is proposed. The proposed circuit will be embedded in the control circuit of display chip. Two differenct kinds of patterns is generated by the circuit. One is block pattern for color test, and the other is line pattern for pixel test. The shape of test pattern is determined by the values of registers in pattern generation circuit. The circuit is designed using Verilog HDL RTL code.

  • PDF