• Journal of Advanced Marine Engineering and Technology
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• v.29 no.1
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• pp.98-106
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• 2005

The chemical conversion film formed on magnesium alloy was investigated by using the colloidal silica with some parameters such as solution pH. temperature, solution conditions, and treatment time. Moreover. the solutions consisted of colloidal silica titanium sulfate, and cobalt ions were used for the colloidal silica film to having a good corrosion resistance and adhesion properties. It was thought that the film at 298K was made with combination of Si-O. The quantity of film formed at high temperature such as 333K and 353K is smaller than dissolved quantity during chemical conversion treatment. Adding $CoSO_4$ to the colloidal silica solution enhanced the adhesion force between the silica film and magnesium substrate, The optimum conditions for the chemical conversion treatment solution were PH 2.90 s treatment, and 298K.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.35-37
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• 2005

100, 200nm 크기의 colloidal silica 각각에 나노 ceria 입자를 수열합성법으로 코팅하였다. Colloidal silica 입자에 ceria를 코팅 시 slurry의 pH조절과 수열처리에 이용하여 silica에 ceria가 코팅됨을 TEM과 zeta-potential을 이용하여 확인하였다. 연마 슬러리의 분산 안정성과 연마효율을 높이기 위하여 슬러리의 pH 는 9로 하였으며, 이때의 zeta-potential 값은 -25 mV이었다. 1 wt%로 제조된 연마슬러리를 이용하여, 4 inch $SiO_2$, $Si_3N_4$ wafer를 압력변화에 따른 연마특성을 관찰 하였다. Ceria coated colloidal silica 100 nm, 200 nm와 commercial한 $CeO_2$입자를 연마압력 6 psi로 oxide film을 연마한 결과 연마율이 각각 2490 ${\AA}/min$, 4200 ${\AA}/min$, 4300 ${\AA}/min$으로 측정되었다. 또한 $SiO_2$, $Si_3N_4$ film의 6 psi압력에서 ceria coated colloidal silica 100 nm, 200 nm와 commercial 한 $CeO_2$입자의 선택비는 3, 3.8, 6.7 이었다. 입자크기가 클수록 연마율이 높으며, Preston equation을 따라 연마 압력과 연마율이 비례하였다.

• Korea-Australia Rheology Journal
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• v.16 no.4
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• pp.175-182
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• 2004

Colloidal coating solution was prepared to enhance the hydrophilic property of the film surface. Water and ethanol were used as the dispersion media and (glycidoxypropyl) trimethoxysilane (GPS) as a binder in the colloidal silica coatings. Ethylene diamine was added to the colloidal silica solution as the curing agent. The colloidal silica solution was regarded as a hard-sphere suspension model with low volume fraction of the silica particles. Rheological properties of the silica suspensions modified with GPS have been investigated as a function of pH and concentration. The acidic solution showed high viscosity change by fast hydrolysis reaction and adsorption of the organic binders on the surface of silica particles. However, the hydrolysis was slow at the basic condition and the binders combined with themselves by condensation. The viscosity change was smallest at pH 7. The viscosity increased with the curing time after adding ethylenediamine, and the increase of viscosity at low pH was higher than that at high pH. The hydrophilic properties of the coating film were investigated by the contact angle of water and film surface. The smallest contact angle was shown under the strong acidic condition of pH 2.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Korean Journal of Materials Research
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• v.11 no.5
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• pp.413-418
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• 2001

We investigated change of crystal structure, surface morphology and crystal orientation of the electrodeposited film from dispersed $SiO_2$ suspensions (colloidal silica) copper sulfate bath and arse corrosion potentials and physical specific properties. As addition of colloidal silica in copper electrolytic hath, the crystal Particles on filial was fined-down, made uniform and account of particles were increased. Hardness of copper electrodeposited film ascended about 15% and (111), (200) and (311) plane of X-ray diffraction patterns were almost swept away, so preferred orientation chanced from (111) to (110) plane. Also, corrosion potential of electrodeposited copper film was noble with colloidal silica addition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.553-554
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• 2007

By sol-gel method, we have fabricated silica-titania hybrid film using silane treated colloidal $TiO_2$ and characterized the film through FT-IR, TGA, UV-VIS and AFM. The silica-titania hybrid film showed Ti-O-Si chemical bond at FT-IR peak of $910{\sim}940cm^{-1}$. The fabricated hybrid film showed thermal stability of around $350^{\circ}C$(5wt% loss temperature) and transparency more than 90%. In addition, the good surface smoothness was confirmed by AFM. Therefore, the silica-titania hybrid film with outstanding properties can be potential for application in electronics and displays.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.161-161
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• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.

• Journal of the Korean Ceramic Society
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• v.42 no.6 s.277
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• pp.399-404
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• 2005

Anti-reflection film was coated by using spherical silica nano colloidal particles and fumed silica particles. Silica colloid sol was reserved between two inclined slide glasses by capillary force, and particles were stacked to form a film onto the substrate as the upper glass was sliding. The deposition processes were studied to enhance the wavelength dependency of the light transmittance and to control the effective refractive index of the film. Both of the spherical and fumed silica particles showed an enhancement of $4.0-4.4\%$ in light transmittance by one step coating. The dependence of the transmittance on wavelength was largely improved at the longer wavelength by partial coating of fumed particles on the film of spherical particles. The effective refractive index of the film was controlled by removing latex particles that were co-deposited with silica particles. Using this process the light reflectance from one side of the glass substrate could be reduced from $4.2\%$ to $0.6\%$ although zero reflectance was not achieved due to the agglomeration of the latex particles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.422-422
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• 2009

Photocurable inorganic-organic hybrid materials were prepared from colloidal-silica nanoparticles synthesized through the solgel process and using acryl resin. The synthesized colloidal-silica nanoparticles had uniform diameters of around 20 nm, and they were organically modified, using methyl and methacryl functional silanes, for efficient hybridization with acryl resin. The organically modified and stabilized colloidal-silica nanoparticles could be homogeneously hybridized with aeryl resin without phase separation. The successfully fabricated hybrid materials exhibit efficient photocurability and simple film formation due to the photopolymerization of the organically modified colloidal-silica nanoparticles and acryl resin upon UV exposure. The fabricated hybrid films exhibit an excellent optical transmission of above 90% in the visible region as well as an enhanced surface smoothness of around 1 nm RMS roughness. In addition, the hybrid films exhibit improved thermal and mechanical characteristics, much better than those of acryl resin. More importantly, these photocurable hybrid materials fabricated through the synergistic combination of colloidal-silica nanoparticles with acryl resin are candidates for optical and electrical applications.

• Korean Chemical Engineering Research
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• v.55 no.6
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• pp.754-761
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• 2017

UV-curable hydrophilic coating solutions were prepared by mixing colloidal silica dispersed in alcohol with an acrylic monomer, pentaerythritol triacrylate (PETA). Hydrophilic coating films were also prepared by spin coating the hydrophilic coating solutions on PC substrates and UV curing for 10 minutes subsequently. The effect of the amount of colloidal silica in the coating solutions, which was varied from 10 g to 50 g, was investigated on the hydrophilic properties of UV-cured coating films. The results showed that the amount of colloidal silica had a great influence on the hydrophilic properties of UV-cured coating films and the coating film prepared with 30 g of colloidal silica showed a lowest contact angle of $37^{\circ}$ and an excellent pencil hardness of H.