• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.81-86
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• 2001

This paper deals with the monitoring of grinding wheel wear in surface grinding process. A monitoring system, which makes use of a laser scanning micrometer, is developed to measure the circumferential shape as well as the axial profile of grinding wheel. The monitoring system is applied to surface grinding processes. The experimental results show that the developed monitoring system is useful not only for monitoring the amount of wear in grinding wheel but also for evaluation the quality of ground surface and determining proper derssing time for the grinding wheel.

• 한국주조공학회지
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• 제12권4호
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• pp.317-325
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• 1992

Diamond is the hardest material known to humans, also possesses the highest thermal conductivity and a very low thermal expansion coefficient. Therefore, these properties of diamond make them logical choices for many difficult grinding application. Bonding material is a very important factor to performance of a grinding wheel. Grinding glass constitutes one of the major application areas of diamond grinding wheels, and Cu-Sn tin bronze matrix is widely used as a metal bond of diamond wheel in grinding glass but these studies are rarely reported. The bronze test pieces excluding diamond are sintered by the method of hot sizing respectively at $600^{\circ}C$, $650^{\circ}C$, $700^{\circ}C$, with a composition(Cu-10wt%Sn) on ${\alpha}$ phase and two compositions(Cu-20wt%Sn and Cu-23wt%Sn) on ${\alpha}+{\beta}$ phase. The rupture strength of Cu-10wt%Sn is highest. The bronze bonded diamond wheels are manufactured by same conditions as the bronze test pieces. The results of grinding ratio of wheels are highest in case of Cu-10wt%Sn bonded wheel sintered at $650^{\circ}C$ and grinding power is highest in same composition sintered at $700^{\circ}C$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.516-519
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• 2004

As the optical communication industry is developed, the demand of optical communication part is increasing. ZrO$_2$ ceramic ferrule is very important part which can determines the transmission efficiency and information quality to connect the optical fibers. In general ZrO$_2$ ceramic ferrule is manufactured by grinding process because the demands precision is very high. And the co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. This paper deals with the analysis of the process parameters such as grinding wheel speed, grinding feedrate and regulating wheel speed as influential factors, on the concentricity and surface finish developed based on Taguchi's experimental design methods. Taguchi s tools such as orthogonal array, signal-to-noise ratio, factor effect analysis, etc. have been used for this purpose optimal condition has been found out. Thus, if possible be finding highly efficient and quality grinding conditions.

• 열처리공학회지
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• 제30권5호
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• pp.222-226
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• 2017

Recently sapphire wafer has expected as smart phone cover material, however, brittle nature of sapphire needed edge grinding processes to prevent early initiation of cracks. Electro-deposited multi-layered groove tools with $35{\mu}m$ diamond particles were studied for sapphire wafer grinding. Solid particle flow behaviors in agitated electrolyte was studied using PIV(Particle Image Velocimetry), and uniform particle distribution in Ni bond were obtained when agitating impeller was located lower part of electrolyte. Hardness values of $400{\pm}50Hv$ were maintained for retention of diamond particles in electro-deposited bond layer. Sapphire wafer edge grinding test was carried out and multi-layered $160{\mu}m$ thick diamond tool showed much greater grinding capabilities up to 2000 sapphire wafers than single-layered $50{\mu}m$ thick diamond electro-deposited tools of 420 wafers. The reason why 3 times thicker multi-layered tools than single-layered tools showed 5 times longer tool lives in grinding processes was attributed to self-dressed new diamond particles in multi-layered tools, and multi-layered diamond tools could be promising for sapphire grinding.

• 한국세라믹학회지
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• 제46권1호
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• pp.102-107
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• 2009

This study has been focused on an effective surface finishing method combining ELID (ELectrolytic In-process Dressing) and MAP (Magnetic Assisted Polishing) for the nano-precision mirror grinding of glass-lens molding mould. ELID grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP has been used as polishing method due to its high polishing efficiency and superior surface quality. It also presents some techniques for achieving the nanometer roughness of the hard material such as WC-Co, which are extensively used in precision tooling material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.862-865
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• 2000

The surface grinding of STD-11 was attempted on the machining center. Grinding experiments were performed at the various grinding conditions and the grinding force, machining error, grinding ratio, and surface roughness were measured. The experimental results indicate that the grinding ratio decreases as the table speed and depth of cut increase. The surface roughness of ground surface was not affected by the change of depth of cut. The surface roughness values obtained on the experiments were 0.02 ～ 0.03${\mu}{\textrm}{m}$ which are fairy good and acceptable for ground surface.

• 공업화학
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• 제8권5호
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• pp.811-815
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• 1997

본 연구에서는 고상반응에 의한 $YBa_2Cu_3O_{7-y}$계 고온 초전도체의 결정구조 및 초전도 특성에 미치는 원료분말의 분쇄효과를 명백히 할 목적으로 $Y_2O_3$, $BaCO_3$, CuO의 혼합물을 유성볼밀을 사용하여 건식혼합분쇄를 행하였다. 얻어진 분쇄산물의 비표면적은 60분 분쇄할 때까지 증가하며. 그 후 분쇄시간이 증가함에 따라 감소하는 경향을 보였다. 소결체의 임계온도는 분쇄시간에 의존하지 않고, 약 90K로 일정한 값을 나타내었다. 한편, 소결체의 임계전류밀도는 분쇄시간에 크게 의존하였으며, 60분 분쇄한 소결체에서 최대치 $150A/cm^2$를 나타내었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.15-18
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• 2005

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, The development of ultra-precision grinding system and manufacturing properties for the aspheric surface micro lens are described. In the work reported in this paper, and ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the surface roughness and profiles accuracy. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $3\;{\mu}m$ P-V and a surface roughness of $0.1\;{\mu}m\;R_{max}$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• 시멘트 심포지엄
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• 1호
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• pp.50-55
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• 1973

Improvement of grinding efficiency about open circuit grinding mill in cement production was investigated and the results were as follows; 1. Controlled the steel ball by charging ratio. 2. Raised the slot ratio from 3$\%$ to 4.5$\%$