• International Journal of Air-Conditioning and Refrigeration
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• 제10권2호
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• pp.88-96
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• 2002

The present study was conducted to estimate the effect on fouling reduction in tubes of the condenser. It shows in detail how to calculate the fouling factor from the experimental results of refrigeration systems with or without the automatic cleaning system using sponge balls and to predict the variation of the factor with time. It also represents how to calculate the temperature and pressure decrease of the refrigerant vapor in the condenser and the load decrease of the compressor in the refrigeration system by fouling reduction.

• 대한전기학회논문지
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• 제40권6호
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• pp.626-629
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• 1991

The negative wire of an electrolytic ozone generator, proposed by authors, has been contaminated by attaching the impurity particulate in tap water, which is called BUILD-UP phenomenon. The higher applied voltage and the larger wire diameter have shown the higher build-up rate, which makes the current reducing largely and concurrently the ozone production smaller. It is found that the positive electrode of the ozone generator has a strong SELF-CLEANING effect by detaching the impurity particulate from its surface, which, however, is used us a novel means of solving the build-up problem. As a result, the build-up problem can be solved effectively by applying an alternate square wave pulse voltage to the electrodes so as to get the self-cleaning ability on the both electrodes during each of the half pulse duration time.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2011년도 제42회 하계학술대회
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• pp.2015-2016
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• 2011

Detection of data cleaning bed of because method of communication uses AODV(Ad hoc On-demand Distance Vector) Zig-Bee communication though communication method is important being separated by several part structurally data monitor ring do it way to understand be. Although data that detect in transmitter will get into several kinds, data of each senses is detected by 4 - 20 mA conclusively and remainder data is consisted of temperature data. That is measured in transmitter in mast baud via conversion relation to do monitorring norm of data being decided to PC mistake of measured value so that can do control between enforcement compose. Speak that can manage equipment of cleaning bed by number of persons who write if detect data detection in wide cleaning bed through Zig-Bee communication and is easy because also administration of data consists of real time.

• 보존과학회지
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• 제5권2호
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• pp.15-24
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• 1996

Th)s study was carried out of the historical characters and textile coservations for Mrs. Danha Lee's Wonsam. As the textile material was silk, dry cleaning method was suggested. The solvents for dry cleaning were n-hexane, n-decane, and benzene. During the second cleaning process, the dry soap(HI-TECH, 120:1, volume ratio) was added to the mixed solvents. The reaction's temparature was $20^{\circ}C$, and the reaction's time was 30 minuutes. It seemed to be a gift for hot from the Royal Family because of the attachment of pheonlx hungbae. This wonsam was decorated symmetrically by gold weaving yarn, the basic fabric was green silk satin with glorius letters and floral patterns. It was made on the 17th C and the oldest thing among them.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.242-243
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• 2015

Fault detection using optical emission spectra with modified K-means cluster analysis and principal component anal ysis are demonstrated for inductive coupl ed pl asma cl eaning processes. The optical emission spectra from optical emission spectroscopy (OES) are used for measurement. Furthermore, Principal component analysis and K-means cluster analysis algorithm is modified and applied to real-time detection and sensitivity enhancement for fluorocarbon cleaning processes. The proposed techniques show clear improvement of sensitivity and significant noise reduction when they are compared with single wavelength signals measured by OES. These techniques are expected to be applied to various plasma monitoring applications including fault detections as well as chamber cleaning endpoint detection.

• 제어로봇시스템학회논문지
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• 제22권6호
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• pp.470-476
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• 2016

This paper proposes a practical algorithm for the reduction of measurement errors due to drift in a micro-electromechanical system (MEMS) gyros that are used for a mobile robot. Any drift in a MEMS gyro will cause an unbounded growth of errors in the estimation of heading, which makes it nearly useless in applications that require high accuracy over a long operating time. In proposed method, maneuvers of a cleaning robot are observed through encoders' measurement process and a decision to correct bias drift will be made if necessary. The method used in this paper is called the "heading estimation filter". To evaluate the accuracy of the proposed method, a comparison was made between the estimation of the heading of the cleaning robot and one from a motion capture system.

• 대한가정학회지
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• 제34권3호
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• pp.75-87
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• 1996

The purpose of the study was to examine the effect of sex role orientation on the amount of time spent in meal preparation and cleanup, clothing care, and indoor cleaning accomplished by husbands and wives in couple-headed households in the U.S.. The overall research hypotheses examined were : (1) there is a relationship between demographic and socioeconomic characteristics of the husband and wife and the sex role orientation of the husband and wife; (2) for both husbands and wives, there is a relationship between sex role orientation and the amount of household production time that is accomplised by each individual; and (3) the relationship between sex role orientation and the amount of household production time remains when demographic and socioeconomic factors are controlled. The 1981 data from the 1975-1981 Time Use Longitudinal Panel Study collected at the University of Michigan were used for this study. The major findings is that a relationship between sex role orientation and the amount of time spent in three household production activities was not found, when all independent variables were controlled. That is, sex activities was not found, when all independent variables were controlled. That is, sex role orientation was not a predictor affecting the amount of time that husbands and wives spend on meal preparation and cleanup, clothing care, and indoor cleaning.

• 한국기계가공학회지
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• 제14권5호
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• pp.1-7
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• 2015

Cleaning by injecting dry ice and water is a generally adopted trend these days to clean molds (injection, diecasting foundry, press, rubber mold, etc). This cleaning method is performed manually, or by installing multiple high pressure spray nozzles. We have manufactured a turbine cleaning module device that is able to clean diecasting modules at any position and angle in the space by mounting an articulated robot instead of the existing pipe type injection nozzle, to minimize lead time and enhance working yield of the cleaning process. In this paper, we analyzed process factors that are required to design the turbine module by reviewing number of revolution, and results according to different blade angles and thicknesses of the mold release injection turbine module, using computational fiuid dynamics (CFD).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.