• 제목/요약/키워드: Cleaning time

검색결과 622건 처리시간 0.024초

Nd:YAG 레이저의 근적외선과 자외선 펄스를 이용한 NiP 하드디스크 기층의 세척 (Cleaning of Nip Hard Disk Substrate Using Near-Infrared and Ultraviolet Irradiation of Nd:Yag Laser Pulses)

  • 김동식
    • 한국레이저가공학회:학술대회논문집
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    • 한국레이저가공학회 2000년도 추계학술발표대회 논문개요집
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    • pp.23-26
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    • 2000
  • This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning performance and time-resolved optical diagnostics are performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

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카트리지 필터 여과집진기 충격기류시스템의 최적탈진조건에 관한 실험적 연구 (Experimental Study on Optimum Pulse Jet Cleaning Conditions of a Cartridge Filter System)

  • 박승욱;하현철;김성준
    • 한국산업보건학회지
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    • 제25권4호
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    • pp.542-553
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    • 2015
  • Objectives: Many types of dust collector are used for industrial ventilation, with the most common types being the cylinder bag filter system, rectangular bag filter system and cylinder type cartridge filter system. The cylinder type cartridge bag filter, which has more filtering area than other types of bag filter, can increase the pulse time and extend the useful life of the filter. This can save operational costs and installation area. Materials: This study used cylinder type cartridge bag filter equipment and tested the impact of vibration level and filter pressure with different pulse jet cleaning conditions. The final, cleaning efficiency was calculated through input dust mass and cleaning dust mass Conclusions: Two optimum cleaning condition groups were found. The first condition group was $3kgf/cm^2$ pulse pressure, 15 cm pulse distance, 0.2 s pulse time with an H-10 type nozzle. The second condition group was $3kgf/cm^2$ pulse pressure, 15 cm pulse distance, 0.3 s pulse time with an H-10 type nozzle.

멀티로봇에 대한 전체영역 경로계획 (Complete Coverage Path Planning for Multi-Robots)

  • 남상현;신익상;김재준;이순걸
    • 한국정밀공학회지
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    • 제26권7호
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    • pp.73-80
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    • 2009
  • This paper describes a path planning algorithm, which is the minimal turning path based on the shape and size of the cell to clean up the whole area with two cleaning robots. Our method divides the whole cleaning area with each cell by cellular decomposition, and then provides some path plans among of the robots to reduce the rate of energy consumption and cleaning time of it. In addition we suggest how to plan between the robots especially when they are cleaning in the same cell. Finally simulation results demonstrate the effectiveness of the algorithm in an unknown area with multiple robots. And then we compare the performance index of two algorithms such as total of turn, total of time.

금도금을 위한 AISI 304 스테인레스강 표면의 세정 (A Study on the Cleaning of AISI 304 Stainless Steel Surface for Gold Plating)

  • 한범석;장현구
    • 한국표면공학회지
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    • 제28권1호
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    • pp.23-33
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    • 1995
  • AISI 304 stainless steel has high resistance to corrosion due to the presence of a self-healing chromium oxide film on the surface, which also accounts for the difficulty in plating. Surface cleaning of this alloy is of fundamental importance in gold plating since its effectiveness puts an upper limit on the quality of the final coating. The cleaning of AISI 304 stainless steel was investigated with elimination of artificial passive oxide film and degreasing of remaining buffing wax as stearic acid. The familiar cleaning methods i.e. ultrasonic cleaning, electro-cleaning and activation treatment were fabricated in this study. Activation treatment showed best cleaning efficiency for elimination of passive oxide film among these methods, which was also confirmed by AES (Auger electron spectrometer) analysis. However, the best condition of cleaning was obtained by combining these methods. Electrocleaning time, for degreasing the stearic acid layer, was decreased with increasing amount of added KCN.

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Enzymatic Cleaning of Ultrafiltration Membrane Fouled with a Semi-synthetic Type Cutting Oil

  • Chung, Kun-Yong;Lee, Jeung-Bok;Chang, Pahn-Shick
    • Korean Membrane Journal
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    • 제2권1호
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    • pp.60-63
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    • 2000
  • The effect of Candida rugosa and steapsin lipase cleaning was investigated for ultrafiltration polyethersulphone membrane (30,000 dalton MWCO) fouled with the semi-synthetic type cutting oil. The experimental by the water circulator. The enzyme cleaning effect was measured with respect to temperature, cleaning time and enzyme concentration. The optimum cleaning condition for the system was 25$^{\circ}C$ and 2 hour cleaning with 1,000 unites/mL steapsin solution. The pure water flux improvement by the steapsin solution cleaning was about 17% at the optimum cleaning condition.

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세라믹 볼을 이용한 판형열교환기 세정장치의 볼 회수율 측정 (The Measurements of Ball Recovery Rate for the Cleaning Apparatus in Plate Heat Exchanger Using Ceramic Ball)

  • 채희만;권정태;차동안;권오경
    • 동력기계공학회지
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    • 제18권1호
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    • pp.38-44
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    • 2014
  • The objectives of this study are to measure the ball recovery rate of cleaning apparatus for plate heat exchanger. Ceramic ball is used for plate heat exchanger cleaning. The main components of cleaning apparatus are comprised of ball collector, ball trap, ejector, pump and plate heat exchanger. The ball recovery rate are obtained with change in recovery time and velocity of water. The results show that the ball recovery rate is slightly increased with increase in the recovery time and the velocity of water over 0.4 m/s in the straight flow. In the case of reverse flow, the ball recovery rate more increased than straight flow. The maximum ball recovery rate of the straight flow and reverse flow reach 83.97% and 86.61%, respectively, when the velocity and cleaning time are 0.5 m/s and 15min.

Regeneration of solid phase filter by chemical cleaning

  • Byung-Dae Lee
    • 한국응용과학기술학회지
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    • 제41권1호
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    • pp.19-26
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    • 2024
  • Recently, separation membranes have been applied to fields such as water supply, sewage treatment, gray water reuse, and air pollution control. Chemical cleaning technology is attracting attention among the methods of reusing these expensive separation membranes. It was found that the separation membrane could be regenerated using chemical cleaning. Specifically, it was found that the use time of the separation membranes regenerated by chemical cleaning was sustainable for more than 1,700 hours. Additionally, it was found that the flux recovery ratio after chemical cleaning was maintained at least 60%. In addition, the flux recovery ratio of HYDREX 4710, an organic membrane cleaner, and 4703, an inorganic membrane cleaner, was 76% and 62%, respectively, showing the highest flux recovery ratio among the chemicals used. Considering that the target raw water of this study is biological secondary treatment water, it was suggested that chemical cleaning could be actively used to regenerate separation membranes in future water treatment.

중유화력발전소 탈황 흡수탑 세정시기예측 (Estimation of Washing Duration of Desulfurized Absorber in a Heavy Oil Power Plant)

  • 장영기;유호선
    • 플랜트 저널
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    • 제12권1호
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    • pp.24-28
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    • 2016
  • 중유를 연소하는 D 발전소 탈황설비는 운전시간의 경과에 따라 흡수탑 내부에 석고 스케일이 부착되어 발전가능 최대출력의 하향조정이 발생되고 나아가 발전정지를 초래한다. 스케일 제거를 위한 탈황설비 세정은 발전가능 최대출력의 하향조정이 발생하는 시점으로 결정할 수 있다. 본 연구에서는 탈황설비의 운전 자료를 분석하여 발전가능 최대출력의 하향조정이 발생되기 6주전은 탈황설비 출구 $SO_2$ 농도값이 130ppm을 초과하고 동시에 흡수탑 차압은 $380mmH_2O$을 초과하며, 직전 흡수탑 세정 이후 44주가 경과된 시점이 됨을 확인하였다. 최종적으로 흡수탑의 세정시기는 직전 세정시점으로부터 50주가 경과된 시점임을 예측하였다.

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In-Situ Dry-cleaning (ISD) Monitoring of Amorphous Carbon Layer (ACL) Coated Chamber

  • Lee, Ho-Jae;Park, George O.;Hong, Sang-Jeen
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.183-183
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    • 2012
  • In the era of 45 nm or beyond technology, conventional etch mask using photoresist showed its limitation of etch mask pattern collapse as well as pattern erosion, thus hard mask in etching became necessary for precise control of etch pattern geometry. Currently available hard mask materials are amorphous carbon and polymetric materials spin-on containing carbon or silicon. Amorphous carbon layer (ACL) deposited by PECVD for etch hard mask has appeared in manufacturing, but spin-on carbon (SOC) was also suggested to alleviate concerns of particle, throughput, and cost of ownership (COO) [1]. SOC provides some benefits of reduced process steps, but it also faced with wiggling on a sidewall profile. Diamond like carbon (DLC) was also evaluated for substituting ACL, but etching selectivity of ACL was better than DLC although DLC has superior optical property [2]. Developing a novel material for pattern hard mask is very important in material research, but it is also worthwhile eliminating a potential issue to continuously develop currently existing technology. In this paper, we investigated in-situ dry-cleaning (ISD) monitoring of ACL coated process chamber. End time detection of chamber cleaning not only provides a confidence that the process chamber is being cleaned, but also contributes to minimize wait time waste (WOW). Employing Challenger 300ST, a 300mm ACL PECVD manufactured by TES, a series of experimental chamber cleaning runs was performed after several deposition processes in the deposited film thickness of $2000{\AA}$ and $5000{\AA}$. Ar Actinometry and principle component analysis (PCA) were applied to derive integrated and intuitive trace signal, and the result showed that previously operated cleaning run time can be reduced by more than 20% by employing real-time monitoring in ISD process.

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질화막 성장의 하지의존성에 따른 적층캐패시터의 이상산화에 관한 연구 (A Study on the Abnormal Oxidation of Stacked Capacitor due to Underlayer Dependent Nitride Deposition)

  • 정양희
    • 한국전기전자재료학회논문지
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    • 제11권1호
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    • pp.33-40
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    • 1998
  • The composite SiO$_2$/Si$_3$N$_4$/SiO$_2$(ONO) film formed by oxidation on nitride film has been widely studied as DRAM stacked capacitor multi-dielectric films. Load lock(L/L) LPCVD system by HF cleaning is used to improve electrical capacitance and to scale down of effective thickness for memory device, but is brings a new problem. Nitride film deposited using HF cleaning shows selective deposition on poly silicon and oxide regions of capacitor. This problem is avoidable by carpeting chemical oxide using $H_2O$$_2$cleaning before nitride deposition. In this paper, we study the limit of nitride thickness for abnormal oxidation and the initial deposition time for nitride deposition dependent on underlayer materials. We proposed an advanced fabrication process for stacked capacitor in order to avoid selective deposition problem and show the usefulness of nitride deposition using L/L LPCVD system by $H_2O$$_2$cleaning. The natural oxide thickness on polysilicon monitor after HF and $H_2O$$_2$cleaning are measured 3~4$\AA$, respectively. Two substrate materials have the different initial nitride deposition times. The initial deposition time for polysilicon is nearly zero, but initial deposition time for oxide is about 60seconds. However the deposition rate is constant after initial deposition time. The limit of nitride thickness for abnormal oxidation under the HF and $H_2O$$_2$cleaning method are 60$\AA$, 48$\AA$, respectively. The results obtained in this study are useful for developing ultra thin nitride fabrication of ONO scaling and for avoiding abnormal oxidation in stacked capacitor application.

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