• Membrane and Water Treatment
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• v.12 no.1
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• pp.1-9
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• 2021

This study optimized the chemical cleaning process of discarded RO membranes for reuse in less demanding separation processes. The effect of physicochemical parameters, including the temperature, cleaning time, pH of the cleaning solution, and addition of additives, on the cleaning process was investigated. The membrane performance was evaluated by testing the flux recovery rate and salt rejection before and after the cleaning process. High temperatures (45-50 ℃) resulted in a better flux recovery rate of 71% with more than 80% salt rejection. Equal time for acid and base cleaning 3-3 h presented a 72.43% flux recovery rate with salt rejection above 85%. During acid and base cleaning, the best results were achieved at pH values of 3.0 and 12.0, respectively. Moreover, 0.05% concentration of ethylenediaminetetraacetic acid presented 72.3% flux recovery, while 69.2% flux was achieved using sodium dodecyl sulfate with a concentration of 0.5%; both showed >80% salt rejection, indicating no damage to the active layer of the membrane. Conversely, 0.5% concentration of sodium percarbonate showed 83.1% flux recovery and 0.005% concentration of sodium hypochlorite presented 85.2% flux recovery, while a high concentration of these chemicals resulted in oxidation of the membrane that caused a reduction in salt rejection.

• Korean Chemical Engineering Research
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• v.48 no.3
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• pp.401-404
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• 2010

A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

• Journal of the Korean Society of Clothing and Textiles
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• v.23 no.7
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• pp.987-997
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• 1999

The purpose of this study was finding out the appropriate cleaning method for buried fabrics from old tombs focusing on the conservation of textiles. Cleaning effects and physical properties change depending on cleaning method have been analysed, The following results were obtained from this study : 1. Wet cleaning showed better effect on the cleaning of fabrics compared to solvent cleaning which meant more water-soluble soils existed than oily soils. 2. All the cleaning methods used did not cause any distorsion or shrinkage to the fabrics because fabrics had been stabilized for a long time 3. Addition of detergent to cleaning system decreased the friction of fiber during cleaning rocess so that the damage of fabrics could be minimized., 4. Ironing is an undesirable process because heat remarkably weakened fibers.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.1-6
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• 2003

In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.114-118
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• 2009

PVA (polyvinyl alcohol) brush cleaning method is a typical cleaning method for semiconductor cleaning process especially post-CMP cleaning. PVA brush contacts with the wafer surface and abrasive particle, generating the contact rotational torque of the brush, which is the removal mechanism. The brush rotational torque can overcome theoretically the adhesion force generated between the abrasive particle and wafer by zeta potential. However, after CMP (chemical mechanical polishing) process, many particles remained on the wafer because the brush was contaminated in previous post-CMP cleaning step. The abrasive particle on the brush redeposits to the wafer. The level of the brush contamination increased according to the cleaning run time. After cleaning the brush, the level of wafer contamination dramatically decreased. Therefore, the brush cleanliness effect on the cleaning performance and it is important for the brush to be maintained clearly.

• Laser Solutions
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• v.4 no.2
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Journal of ILASS-Korea
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• v.12 no.4
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• pp.185-190
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• 2007

There is a growing interest to develop a new cleaning technology to overcome the disadvantages of wet cleaning technologies such as environmental pollution and the cleaning difficulty of contaminants on integrated circuits. Laser cleaning is a potential technology to remove various pollutants on a wafer surface. However, there is no fundamental data about cleaning efficiencies and cleaning mechanisms of contaminants on a wafer surface using a laser cleaning technology. Therefore, the cleaning characteristics of a wafer surface using an excimer laser were investigated in this study. Fingerprint consisting of inorganic and organic materials was chosen as a representative of pollutants and the effectiveness of a laser irradiation on a wafer cleaning has been investigated qualitatively and quantitatively. The results have shown that cleaning degree is proportional to the laser irradiation time and repetition rate, and quantitative analysis conducted by an image processing method also have shown the same trend. Furthermore, the cleaning efficiency of a wafer contaminated by fingerprint strongly depended on a photothermal cleaning mechanism and the species were removed in order of hydrophilic and hydrophobic contaminants by laser irradiation.

• Journal of Power System Engineering
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• v.21 no.3
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• pp.74-84
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• 2017

This paper presents the development of the underwater cleaning robot platform for a higher efficiency in manufacturing industry. Human operators directly go into the cistern and clean sludge after drainage of the water so far. It is sometimes dangerous because of the harmful chemical materials from the product making process. In addition, it takes long time for water drainage and supplying it back. However, the robot cleaning operation does not need to drain water so that it could be applied to the sludge cleaning work at any time without the plant pause. Moreover, it can prevent the safety accidents because human operators are not necessary to enter directly the sludge cisterns. This paper shows the performance of cleaning work that can be applied in the industrial field through the design and development of underwater cleaning robot platform. And these results demonstrate that the developed underwater cleaning robot has great possibilities to clean other industrial water cisterns.

• Journal of the Korean Applied Science and Technology
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• v.27 no.2
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• pp.107-113
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• 2010

The object of this research is to conform of practicable possibility and recycling of producing junk after citrus fruits is processed. With extracting d-limonene oil that have 70~90% a component of oil out of junk citrus peel, making certain the about 12000ppm concentration of it. Limonene derived from citrus in jeju using conventional synthetic detergents can be replaced with the development of environmentally friendly natural detergent investigated the possibility. Mostly due to ocean dumping, disposal and cause environmental problems by recycling natural citrus cleaner alternative to the research conducted on the possibility. Cleaning efficiency with temperature did not affect the largest concentrations were able to identify the difference between cleaning efficiency. At least 10% of the d-limonene oil could be from the cleaning performance, increasing the concentration of the cleaning efficiency was increased in size. Ultrasonic is very high removal efficiency under the conditions shown in the cause of pure self-generated ultrasonic cleaning power as co-effects of d-limonene oil appears to chemical cleaning effect of ultrasonic cavitation occurs in the physical cleaning effect due to a combination of synergistic stability is maximized by low concentrations of d-limonene oil in a short time showed an excellent cleaning ability. Having the ability of cleaning at the same time, considering the side recycling in the junk citrus peels reflects possibility of basic materials utility eco-friendly in the skin soap, bath soap, cosmetics etc, through ability of exclusion a contaminant in based cleaning effect(EC) it can prospect substitution effect environmentally in the pre existence synthetic detergents.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.295-298
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• 2015

Ozone micro-bubble cleaning system was designed, and made to develop a unique technique to clean wafers by using ozone micro-bubbles. The ozone micro-bubble cleaning system consisted of loading, cleaning, rinsing, drying and un-loading zones, respectively. In case of the cleaning the silicon wafers of a solar cell, more than 99 % of cleaning efficiency was obtained by dipping the wafers at 10 ppm of ozone for 10 minutes. Both of long cleaning time and high ozone concentration in the wet-solution with ozone micro-bubbles reduced cleaning efficiency because of the re-sorption of debris. The cleaning technique by ozone micro-bubbles can be also applied to various wafers for an ingot and LED as an eco-friendly method.