• Title/Summary/Keyword: Cleaning Method

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Development of a Monitoring System for a Pipe Cleaning Robot with RS-485 (RS-485 통신을 이용한 배관청소 로봇의 모니터링 시스템 개발)

  • Kim, Min-wook;Lee, Hun-seok;Oh, Jin-seok
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.5
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    • pp.923-930
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    • 2016
  • Various pipes are used in the many industrial field such as water supply, drainage system and marine plants, so a maintenance of these pipes is essential. Especially, the maintenance of the piping in the industrial field, some professional staffs enter and clean the pipe. If the professional staffs can not enter and clean the pipe, the workers has to use the method of inserting a scraper connected to wire inside the pipe. However, this method demands huge budget and causes a number of problems such as traffic congestion. To solve these problems, pipe cleaning robot has been researching and developing. Many Pipe cleaning robots have a problem, that is impossible to confirm the operating condition of the robot in a real time. This paper suggest pipe cleaning robot with RS-485 which transmit operating and cleaning condition of robot and inner pipe filmed by camera, that user can check.

Cleanliness Test by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 분사형 세정제에 대한 청정도 평가)

  • Heo, Hyo Jung;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.47 no.6
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    • pp.688-694
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    • 2009
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study the cleanliness test and efficiency. In order to choose alternative environmental-friendly cleaning agents, it is important that the systematic selection procedures should be introduced and applied through the evaluation of their cleaning ability, environmental characteristics, and economical factors, and that the objective and effective evaluation methods of cleanliness should be established for the industry. A novel cleaning evaluation method with scanning electron microscopy/energy-dispersive X-ray analysis of surface observation evaluation method and an infra-red thermography camera(THERMOVISION A20 model) was studied in this work. The sound card(CT-2770 model) cut by $2{\times}2cm$ size was used as a part, and before and after the spray cleaning, the cleanliness was observed by the image analyzer of SEM and further the removal efficiency of dust was quantitatively evaluated by the component analysis of EDX. For the parts of P4TE model motherboard and IPC-A-36 PCB plate, before and after the spray cleaning, temperature differences were measured and compared at room temperature and 50 oven temperature by an infra-red thermography camera in the contaminants of dust and iron powder.

The Change of Physical Properties of Artificial aging Paper in the Cleaning Process for the Conservation Treatment of Historical Paper Documents - Focusing on Immersion Wet Cleaning - (고문헌 보존처리의 클리닝 방법에 따른 인공열화지 물성 변화 - 침적 습식클리닝을 중심으로 -)

  • Jeong, Seon Hwa;Cho, An Naa
    • Korean Journal of Heritage: History & Science
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    • v.46 no.1
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    • pp.228-237
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    • 2013
  • Paper relics are affected by a number of complex physical, chemical, biological and artificial damaging factors due to the vulnerability of organic materials. Wet cleaning is a conservation treatment method for removing pollutants from paper artefacts. This study was carried out in order to analyse the effect of wet cleaning on Hanji (Traditional Korean paper made from mulberry trees) which is the main material used in Korean paper relics (historical paper documents). For this study, the color change and folding endurance of artificially degraded paper was analysed before and after immersion wet cleaning. The result showed that washing each twice in 30 minutes is the most appropriate method for obtaining cleaning efficiency and material stability.

Via Cleaning Process for Laser TSV process (Laser TSV 공정에 있어서 Via 세정에 관한 연구)

  • Seo, Won;Park, Jae-Hyun;Lee, Ji-Young;Cho, Min-Kyo;Kim, Gu-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.45-50
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    • 2009
  • By Laser Through-Silicon-Via process, debris and particles occur when you are forming. Therefore the research of TSV cleaning become important to remove those particles and debris. Both chemical cleaning method that uses a surfactant and physical cleaning method that uses a brush were studied with the via of $30{\mu}m$ diameter and $100{\mu}m$ depth on the 8 inch CMOS Image Sensor wafer. On the DI water and a surfactant in mixture ratio of 2:1, debris show $73{\mu}m^2$ per $0.054mm^2$. Cleaning is superior by lower mixture ratio of DI water and surfactant. In addition, It is less than 5% of debris distribution in the laser condition changed by Laser's frequency and its speed and cleaning had no effect. In the physical cleaning, there are no crack and damage when the system condition is set by $1000{\sim}3000rpm$ strip, $50{\sim}3000rpm$ rinsing, and $200{\sim}300rpm$ brushing Therefore, debris and particles can be removed by enforced chemical method and physical method.

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Complete Coverage Path Planning for Multi-Robots (멀티로봇에 대한 전체영역 경로계획)

  • Nam, Sang-Hyun;Shin, Ik-Sang;Kim, Jae-Jun;Lee, Soon-Geul
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.7
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    • pp.73-80
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    • 2009
  • This paper describes a path planning algorithm, which is the minimal turning path based on the shape and size of the cell to clean up the whole area with two cleaning robots. Our method divides the whole cleaning area with each cell by cellular decomposition, and then provides some path plans among of the robots to reduce the rate of energy consumption and cleaning time of it. In addition we suggest how to plan between the robots especially when they are cleaning in the same cell. Finally simulation results demonstrate the effectiveness of the algorithm in an unknown area with multiple robots. And then we compare the performance index of two algorithms such as total of turn, total of time.

65nm급 300mm Wafer 세정조 개발을 위한 유동 특성연구

  • Kim, Jin-Tae;Kim, Gwang-Seon;Lee, Seung-Hui;Jeong, Eun-Mi
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2007.06a
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    • pp.174-178
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    • 2007
  • The cleaning process to remove small particles, ions, and other polluted sources is one of the major parts in the recent semiconductor industry because it can cause fatal errors on the quality of the final products. According to the other reports, the major factors of bath's fluid motion are the cleaning method, nozzle, the geometry (of bath, guide and wafer), and the position (of guide and wafer). So to enhance cleaning efficiency in the bath, these factors must be controlled. The purpose of this study is to analyze and visualize fluid motion in the cleaning bath as basic data for designing the nozzle system and finding the process control parameters. For that, we used the general CFD code FLUENT.

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Development of Robot System for Cleaning & Inspection of Live-line Tension Insulator String (활선 내장애자련 청소 및 점검용 로봇 시스템의 개발)

  • Park J.Y.;Cho B.H.;Byun S.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.315-316
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    • 2006
  • A new cleaning robot system for live-line tension insulator string was developed to prevent an insulator failure, which can have severe effects on national security as well as national industry and economy. The robot moves along the insulator string using the clamps installed on its two moving frames. Especially, unlike the existing cleaning robots using jets of water or water/air, the robot system adopts dry cleaning method using a rotating brush and a circular motion guide. This robot system has control architecture consisting of a master control unit and two slave control units. We confirmed its effectiveness through experiments.

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A Study on Dyes Solubility of Dry cleaning Solvents (드리아 클리닝 용제에 대한 염료의 용해성)

  • Cha, Ok-Sun;Shin, Jung-Sook
    • Textile Coloration and Finishing
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    • v.2 no.3
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    • pp.43-50
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    • 1990
  • The purpose of this paper is to investigate the dyes solubility of dry cleaning solvents among the current domestic products. The dyes were experimented in following way; 1) The flow rate of dyes by paper chromatography method. 2) The color difference & the absorbance of solvents between the dyed fabrics before and after dry cleaning. From the experiment, following results were obtained. 1. In paper chromatography methods, the flow rate of dyes in the disperse dyes was bigger while flow was not shown in the direct dyes & acid dyes. 2. The more the number of times on dry cleaning in dyed fabrics was, the higher the absorbance of solvents was shown. The results were showed following order, PerchloroethyleneHydrocarbon> Fluorocabon. 3. The color difference between before & after dry cleaning on dyed fabrics showed bigger in disperse dyes.

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Evaluation of Cleanliness and Jet Forces by Spray-Type Cleaning Agent for Electronic and Semiconductor Equipment (전자·반도체용 스프레이 세정제에 대한 분사력 및 세정성 평가)

  • Heo, Hyo Jung;Jung, Young An;Row, Kyung Ho
    • Korean Chemical Engineering Research
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    • v.48 no.3
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    • pp.401-404
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    • 2010
  • A spray-type cleaning agent in utilizing dust-remover on PCB was chosen to study. In cleaning of electronic and semiconductor equipment, a substrate(IPC-A-36) was used to test the jet forces of the agent. And according to the jet forces time of the cleaning agent, the corresponding moving distances were compared with the spray times, and for the pollutants of iron powder and dust, the cleaning efficiency was tested with the IPC-A-36 by a weight method. The moving distance increased with the spray cleaning time longer. For a spray cleaning time of 3sec, the cleaning efficiency decreased with the amount of dust and the iron powder. It was also observed that the dust was remarkably removed, compared to the iron powder.

Detergency improvement of hydrophilic soils in dry cleaning process (드라이클리닝 시 친수성 오구의 세탁성 향상을 위한 연구)

  • Kwak, Soo-Kyoung;Sang, Jeong Seon;Park, Myung-Ja
    • Journal of the Korea Fashion and Costume Design Association
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    • v.21 no.4
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    • pp.213-220
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    • 2019
  • The dry cleaning effect related to the type of soil and fiber was analyzed using silicone and alcohol-based solvents(ethyl alcohol, isopropyl alcohol, acetone) that are relatively safe for the human body and environment to improve the detergency of hydrophilic soils in dry cleaning system. Based on this analysis, an effective dry cleaning method to be carried out for improving the detergency according to the type of hydrophilic soils. After dry cleaning was performed using 20 types of artificial soiled fabrics consisting of 7 types of fibers and 4 types of hydrophilic soils, the detergency was measured and the results were compared and analyzed by solvents and fiber types. The results are presented as follows; first, the detergency of hydrophilic soils using silicone solvents showed a low rate of detergency. In particular, the tannin soil showed a lower level of detergency compared to the protein soil. Second, the detergency of hydrophilic soils using silicon solvents with dry soap differed in some detergency according to the soil and fiber types. Especially, the detergency of curry soil on cotton fabric showed significant improvement. Third, the protein soil was not removed from dry cleaning using alcohol-based solvents, but the effect of dry cleaning of curry soil on both cotton and polyester fabric was substantially improved. As a result, the elimination of blood soil is more effective in silicon solvents than in alcohol-based solvents. The removal of tannin soils may improve detergency by adding dry soap to silicon solvents or by using alcohol-based solvents as alternative solvents. The use of alternative solvents such as silicon and alcohol solvents can contribute to the environmental improvement of the dry cleaning industry, which uses petroleum-based solvents. It is also expected to provide consumers with the opportunity to choose eco-friendly and efficient dry cleaning methods.