• Restorative Dentistry and Endodontics
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• v.46 no.1
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• pp.6.1-6.10
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• 2021

Objectives: The aim of this study was to evaluate the corrosion resistance of heat-treated (Reciproc and WaveOne) and non-heat-treated (ProTaper and Mtwo) superelastic nickel-titanium endodontic files when immersed in a 5.25% sodium hypochlorite solution. Materials and Methods: Anodic polarization curves were obtained with potential sweeps that began at the open circuit potential or corrosion potential (E_corr). The pitting potential (E_pit) was identified on the anodic polarization curve as the potential at which a sudden increase in current was observed. The micromorphology of the 28 tested files was analyzed before and after the electrochemical assay using scanning electron microscope (SEM). The data were analyzed using 1-way analysis of variance with the post hoc Bonferroni test (for E_corr) and the Student t-test for independent samples (for E_pit). Results: The mean E_corr values were 0.506 V for ProTaper, 0.348 V for Mtwo, 0.542 V for Reciproc, and 0.321 V for WaveOne files. Only WaveOne and Protaper files exhibited pitting corrosion, with E_pit values of 0.879 V and 0.904 V, respectively. On the SEM images of the ProTaper and WaveOne files, cavities suggestive of pitting corrosion were detected. Conclusions: Signs of corrosion were observed in both heat-treated and non-heat-treated files. Of the evaluated files, WaveOne (a heat-treated file) and ProTaper (a non-heat-treated file) exhibited the lowest corrosion resistance.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.10a
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• pp.508-510
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• 2021

In this study, the difference in resilience was analyzed based on the results of a study of classes that practiced using Raspberry Pi, which had to cross school due to temporarily conducting online classes due to the COVID-19 pandemic. As a result of the study, in online classes, 14 people had resilience less than 150, 32 people who had 150 or more and less than 180, and 9 people who had 180 or more. On the other hand, in the school attendance class, there were 7 people with resilience less than 150, 29 people with resilience less than 150 and less than 180, and 20 people with more than 180. Therefore, in subjects where programming using Raspberry Pi and circuit manufacturing are taught at the same time, the laboratory and practice environment should be able to proceed properly as much as possible. should proceed mainly.

• Transactions of the Korean hydrogen and new energy society
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• v.34 no.6
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• pp.673-681
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• 2023

Hydrocarbon-based polymer membranes to replace perfluorinated polymer membranes are being continuously researched. However, hydrocarbon-based membranes have a problem in that they are less durable than fluorine-based membranes. In this study, we sought to compare the annealing effect to improve the durability of sulfonated poly(ether ether ketone) (SPEEK). After membranes formation, thermogravimetric analysis and tensile strength were measured to compare changes in membranes properties due to annealing. After manufacturing the membrane and electrode assembly (MEA), the initial performance and chemical durability was compared with unit cell operation. During the 24-hour annealing process, the strength increased due to the increase in-S-O-S-crosslinking, and the sulfonic acid group decreased, leading to a decrease in I-V performance. By annealing, the hydrogen permeability was reduced to less than 1/10 of that of the nafion membrane, and as a result, open circuit voltage (OCV) and durability was improved. The SPEEK membranes annealed for 24 hours showed higher durability than the nafion 211 membranes of the same thickness.

• Tribology and Lubricants
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• v.40 no.2
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• pp.47-53
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• 2024

Surface topography plays a decisive role in determining the performance of several precision components. In particular, the surface roughness of semiconductor devices affects the precision of the circuit. In this regard, the surface topography of a given surface needs to be appropriately assessed. Typically, the average roughness is used as one of the main indicators of surface finish quality because it is influenced by both dynamic and static parameters. Owing to the increasing demand for such accurate and reliable surface measurement systems, studies are continuously being conducted to understand the parameters of surface roughness and measure the average roughness with high reliability. However, the differences in the measurement methods of surface roughness are not clearly understood. Hence, in this study, the surface roughness of the back of a silicon wafer was measured using both contact and noncontact methods. Subsequently, a comparative analysis was conducted according to various surface roughness parameters to identify the differences in surface roughness depending on the measurement method. When using a 3D laser confocal microscope, even smaller surface asperities can be measured compared with the use of a 3D profiler. The results are expected to improve the understanding of the surface roughness characteristics of precision components and be used as a useful guideline for selecting the measurement method for surface topography assessment.

• Elastomers and Composites
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• v.59 no.2
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• pp.73-81
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• 2024

In the field of electronic components, the potting material, which is a part of the electronic circuit package, plays a significant role in protecting circuits from the external environment and reducing signal interference among electronic devices during operation. This significantly affects the reliability of the components. Therefore, the accurate prediction and assessment of the lifespan of a material are of paramount importance in the electronics industry. We conducted an accelerated thermal aging evaluation using the Arrhenius technique on elastic potting material developed in-house, focusing on its insulation, waterproofing, and contraction properties. Through a comprehensive analysis of these properties and their interrelations, we confirmed the primary factors influencing molding material failure, as increased hardness is related to aggregation, adhesion, and post-hardening or thermal-aging-induced contraction. Furthermore, when plotting failure times against temperature, we observed that the hardness, adhesive strength, and water absorption rate were the predominant factors up to 120 ℃. Beyond this temperature, the tensile properties were the primary contributing factors. In contrast, the dielectric constant and loss tangent, which are vital for reducing signal interference in electric devices, exhibited positive changes(decreases) with aging and could be excluded as failure factors. Our findings establish valuable correlations between physical properties and techniques for the accurate prediction of failure time, with broad implications for future product lifespans. This study is particularly advantageous for advancing elastic potting materials to satisfy the stringent requirements of reliable environments.

• Journal of Intelligence and Information Systems
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• v.20 no.2
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• pp.163-178
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• 2014

Following research proposes "Virtualization of Smart Cards (ViSCa)" which is a security system that aims to provide a multi-device platform for the deployment of services that require a strong security protocol, both for the access & authentication and execution of its applications and focuses on analyzing Virtualization of Smart Cards (ViSCa) platform-based mobile payment service by comparing with other similar cases. At the present day, the appearance of new ICT, the diffusion of new user devices (such as smartphones, tablet PC, and so on) and the growth of internet penetration rate are creating many world-shaking services yet in the most of these applications' private information has to be shared, which means that security breaches and illegal access to that information are real threats that have to be solved. Also mobile payment service is, one of the innovative services, has same issues which are real threats for users because mobile payment service sometimes requires user identification, an authentication procedure and confidential data sharing. Thus, an extra layer of security is needed in their communication and execution protocols. The Virtualization of Smart Cards (ViSCa), concept is a holistic approach and centralized management for a security system that pursues to provide a ubiquitous multi-device platform for the arrangement of mobile payment services that demand a powerful security protocol, both for the access & authentication and execution of its applications. In this sense, Virtualization of Smart Cards (ViSCa) offers full interoperability and full access from any user device without any loss of security. The concept prevents possible attacks by third parties, guaranteeing the confidentiality of personal data, bank accounts or private financial information. The Virtualization of Smart Cards (ViSCa) concept is split in two different phases: the execution of the user authentication protocol on the user device and the cloud architecture that executes the secure application. Thus, the secure service access is guaranteed at anytime, anywhere and through any device supporting previously required security mechanisms. The security level is improved by using virtualization technology in the cloud. This virtualization technology is used terminal virtualization to virtualize smart card hardware and thrive to manage virtualized smart cards as a whole, through mobile cloud technology in Virtualization of Smart Cards (ViSCa) platform-based mobile payment service. This entire process is referred to as Smart Card as a Service (SCaaS). Virtualization of Smart Cards (ViSCa) platform-based mobile payment service virtualizes smart card, which is used as payment mean, and loads it in to the mobile cloud. Authentication takes place through application and helps log on to mobile cloud and chooses one of virtualized smart card as a payment method. To decide the scope of the research, which is comparing Virtualization of Smart Cards (ViSCa) platform-based mobile payment service with other similar cases, we categorized the prior researches' mobile payment service groups into distinct feature and service type. Both groups store credit card's data in the mobile device and settle the payment process at the offline market. By the location where the electronic financial transaction information (data) is stored, the groups can be categorized into two main service types. First is "App Method" which loads the data in the server connected to the application. Second "Mobile Card Method" stores its data in the Integrated Circuit (IC) chip, which holds financial transaction data, which is inbuilt in the mobile device secure element (SE). Through prior researches on accept factors of mobile payment service and its market environment, we came up with six key factors of comparative analysis which are economic, generality, security, convenience(ease of use), applicability and efficiency. Within the chosen group, we compared and analyzed the selected cases and Virtualization of Smart Cards (ViSCa) platform-based mobile payment service.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.12
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• pp.1098-1125
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• 2000

A review on the papers published in the Korean Journal of Air-Conditioning and Refrigerating Engineering in 1998 and 1999 has been done. Focus has been put on current status of research in the aspect of heating, cooling, ventilation, sanitation and building environment. The conclusions are as follows. 1) A review of the recent studies on fluid flow, turbomachinery and pipe-network shows that many experimental investigations are conducted in applications of impingement jets. Researches on turbulent flows, pipe flows, pipe-networks are focused on analyses of practical systems and prediction of system performance. The results of noise reduction in the turbomachinery are also reported. 2) A review of the recent studies on heat transfer analysis and heat exchanger shows that there were many papers on the channel flow with the application to the design of heat exchanger in the heat transfer analysis. Various experimental and numerical papers on heat exchanger were also published, however, there were few papers available for the analysis of whole system including heat exchanger. 3) A review of the recent studies on heat pump system have focused on the multi-type system and the heat pump cycle to utilize treated sewage as the heat source. The defrosting and the frosting behaviors in the fin-tube heat exchanger is experimentally examined by several authors. Several papers on the ice storage cooling system are presented to show the dynamic simulation program and optimal operation conditions. The study on the micro heat pipes for the cooling of high power electronic components is carried out to examine the characteristics of heat and mass transfer processed. In addition to these, new type of separate thermosyphon is studied experimentally. 4) The recent studies on refrigeration/air conditioning system have focused on the system performance and efficiency for new alternative refrigerants. New systems operating with natural refrigerants are drawing lots of attention. In addition to these, evaporation and condensation heat transfer characteristics of traditional and new refrigerants are investigated for plain tubes and also for microfin tubes. Capillary tubes and orifice are main topics of research as expansion devices and studies on thermophysical properties of new refrigerants and refrigerant/oil mixtures are widely carried out. 5) A review of the recent studies on absorption cooling system shows that numerous experimental and analytical studies on the improvement of absorber performance have been presented. Dynamic analysis of compressor have been performed to understand its vibration characteristics. However research works on tow-phase flow and heat transfer, which could be encountered in the refrigeration system and various phase-change heat exchanger, were seemed to be insufficient. 6) A review of recent studies on duct system shows that the methods for circuit analysis, and flow balancing have been presented. Researches on ventilation are focused on the measurement of ventilation efficiency, and variation of ventilation efficiency with ventilation methods by numerous experimental and numerical studies. Furthermore, many studies have been conducted in real building in order to estimate indoor thermal environments. Many research works to get some information for cooling tower design have been performed but are insufficient. 7) A review on the recent studies on architectural thermal environment and building mechanical systems design shows that thermal comfort analysis is sitting environment, thermal performance analysis of Korean traditional building structures., and evaluation of building environmental load have been performed. However research works to improve the performance of mechanical system design and construction technology were seemed to be insufficient.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.2217-2224
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• 2014

This paper deals with system development which measures 12 channel ECG using medical analog front end(AFE) and discriminates arrythmia through signal analysis. Recently, occurrences of cardiac arrest have been increased. So the need of system that diagnoses an arrythmia which results in cardiac arrest is increasing. There are some drawbacks of conventional 12 channel ECG system that it occupies bulk and consists of complicated circuit. To improve those, we made up the system composed of medical AFE, algorithm for discriminating arrythmia and DSP for signal processing. This system can be monitored 12 channel ECG waveforms and the discriminant analysis result of arrhythmia through 7" LCD and received the input through touch pannel. In this study, we conducted normal operation test about output signal of ECG simulator(normal/abnormal ECG signal) to verify the implemented system and performance evaluation of the optimization process for applying arrhythmia algorithm to an embedded environment.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.239-245
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• 2016

In this study, a 12 V PWM boost converter was designed with the optimal values of the external components of the power stage was well as the compensation stage for smart electronic applications powered by a battery device. The 12 V boost PWM converter consisted of several passive elements, such as a resistor, inductor and capacitor with a diode, power MOS switch and control IC chip for the control PWM signal. The devices of the power stage and compensation stage were designed to maintain stable operation under a range of load conditions as well as achieving the highest power efficiency. The results of this study were first verified by a simulation in SPICE from calculations of the values of major external elements comprising the converter. The design was also implemented on the prototype PCBboard using commercial IC LM3481 from Texas Instruments, which has a nominal output voltage of 12 V. The output voltage, ripple voltage, and load regulation with the line regulation were measured using a digital oscilloscope, DMM tester, and DC power supply. By configuring the converter under the same conditions as in the circuit simulation, the experimental results matched the simulation results.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.188.2-188.2
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• 2015

The presence of the conduction interface in epitaxial $LaAlO_3/SrTiO_3$ thin films has opened up challenging applications which can be expanded to next-generation nano-electronics. The metallic conduction path is associated with two adjacent insulating materials. Such device structure is applicable to frequency-dependent impedance spectroscopy. Impedance spectroscopy allows for simultaneous measurement of resistivity and dielectric constants, systematic identification of the underlying electrical origins, and the estimation of the electrical homogeneity in the corresponding electrical origins. Such unique capability is combined with the intentional control on the interface composition composed of $SrTiO_3$ and $CaTiO_3$, which can be denoted by $SrxCa1-_xTiO_3$. The underlying $Sr_xCa1-_xTiO_3$ interface was deposited using pulsed-laser deposition, followed by the epitaxial $LaAlO_3$ thin films. The platinum electrodes were constructed using metal shadow masks, in order to accommodate 2-point electrode configuration. Impedance spectroscopy was performed as the function of the relative ratio of Sr to Ca. The respective impedance spectra were analyzed in terms of the equivalent circuit models. Furthermore, the impedance spectra were monitored as a function of temperature. The ac-based characterization in the 2-dimensional conduction path supplements the dc-based electrical analysis. The artificial manipulation of the interface composition will be discussed towards the electrical application of 2-dimensional materials to the semiconductor devices in replacement for the current Si-based devices.