• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.14-20
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• 2023

The electrostatic chuck is a technology that uses electroadhesion to attach objects and is widely used in semiconductor and display processes. This research conducted Maxwell by varying parameters to examine the distribution and variations of chucking force in a bipolar-type ESC. The parameters that were changed include the material properties of the dielectric layer and attachment substrate, applied voltage to the electrode, and the gap and width between the electrodes. The analysis results showed that as the relative permittivity of the dielectric layer and substrate increased, the chucking force also increased, with the relative permittivity of the substrate having a greater impact on the chucking force. And increasing the applied voltage led to an increase in both the chucking force and its rate of change. Lastly, as the gap between the electrodes increased, the chucking force rapidly decreased until a certain distance, after which the decrease became less significant. On the contrary, increasing the electrode width resulted in a rapid increase in the chucking force until a certain width, beyond which the increase became less pronounced, eventually converging to a chucking force of 1700 Pa. This paper is expected to have high potential for the development and research of ESC for OLED deposition.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.135-142
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• 1998

The performances of cutting process is mostly affected by the characteristics of closed loop system constructed with machine tool structure, work piece and tools. The chucking system is very important component in this system to hold work piece correctly in various static and dynamic load condition. Therefore, chucking force and accuracy must be considered carefully, from these reason, this paper describes the stability of chucking system which preserve high stiffness and accuracy of machine tool system.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.12-18
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• 2024

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.5
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• pp.462-468
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• 2009

In this study, a workpiece-chucking device that generates a chucking force from a shape memory alloy is introduced. This paper first presents train procedure to transform a commercial one-way shape memory alloy into a two-way shape memory alloy, which makes unclamping mechanism of the chucking device simpler than that using the one-way shape memory alloy Second, it describes a conceptual design of the workpiece-chucking device using the two-way type shape memory alloy. Third, it presents a prototype and its chucking characteristics, such as time-response of clamping/unclamping operations and a relationship between temperatures and chucking forces. Finally, it describes a mill-machining test conducted with the prototype. The results confirm that the proposed workpiece-chucking device is feasible for micro machine-tools.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.1
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• pp.15-22
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• 2002

This paper introduces a compensating system for machining error, which is resulted from chucking with separated jaws. In machining the chucked cylindrical workpiece, the deterioration of machining accuracy, such as out-of-roundness is inevitable due to the variation of the radial compliance of the chuck workpiece system which is caused by the position of jaws with respect to the direction of the applied force. To compensate the chucking compliance induced error, firstly roundness profile of workpiece due to chucking compliance after machining needs to be predicted. Then using this predicted profile, the compensated tool feed trajectory can be generated. And by synchronizing the cutting tool feed system with workpiece rotation, the chucking compliance induced error can be compensated. To satisfy the condition that the cutting tool feed system must provide high speed and high position accuracy, brushless linear DC motor is used. In this study, firstly through the force-deflection experiment in workpiece chucked lathe, the variation of radial compliance of chuck workpiece system is obtained. Secondly using the mathematical equation and cutting experiment result, the predicted profile of workpiece and its compensation tool trajectory are generated. Thirdly the configuration of compensation system using linear motor is introduced, and to improve the system performance, PID controller is designed. Finally the tracking performance of system is examined by experiment. Through the real cutting experiment, roundness is significantly improved.

• Journal of the Korean Society for Precision Engineering
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• v.8 no.4
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• pp.126-136
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• 1991

In order to reduce the possibilities of personnel injuries and damages to machines and to obtaim higher efficiency and machining accuracy in the manufacturing system, the chucking technology has recentry become important. The chucking technology of work greatly affects both the grometrical accuracy and fonctional performance of the workpiece. In this study, the dynamic gripping force of a 3-jaw power chuck is investigated on the factors of the shape of jaw and the shape of workpiece. From this investigation, the following observations are obtained. 1) The higher stiffness of workpiece is, the higher decrease of dynamic gripping force is. 2) The nearer to the root of jaw is, the higher decrease of dynamic gripping force is. 3) The centrifugal force of affectting the decrease of dynamic gripping force has to be considered in the centrifugal force of affecting jaw.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.5
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• pp.90-95
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• 1999

Chucking for workpieces is very important for productivity and efficiency in lathe operations. In point of productivity top jaws of the chuck should be changed as quickly as possible in order to reduce idle times wherever workpieces are regripped. A quick change power chuck which can change top jaws quickly by using a jaw change handle without any assembly/disassembly processes of screws is analyzed for this study. strength and stiffness of top jaws by centrifugal force are considered for the design. Structural analysis for the chuck is executed and the finite element method is introduced using MSC/NASTRAN software. Also, the performance of the chuck is evaluated by experiments.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.9-13
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• 2002

A polyimide-type electrostatic chuck (ESC) was fabricated for the application of holding 8-inch silicon wafers in the oxide etching equipment. For the fabrication of the unipolar ESC, core technologies such as coating of polyimide films and anodizing treatment of aluminum surface were developed. The polyimide films were prepared on top of thin coated copper substrates for the good electrical contacts, and the helium gas cooling technique was used for the temperature uniformity of the silicon wafers. The ESC was essentially working with an unipolar operation, which was easier to fabricate and operate compared to a bipolar operation. The chucking force of the ESC has been measured to be about 580 gf when the applied voltage was 1.5 kV, which was considered to be enough force to hold wafers during the dry etching processing. The employment of the ESC in etcher system could make 8% enhancement of the wafer processing yield.

• Journal of the Korean Magnetics Society
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• v.26 no.2
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• pp.55-61
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• 2016

This study proposes the design algorithm of an electromagnetic linear actuator with a divided coil excitation system, such as the colenoid (COL) system, using the equivalent magnetic circuit (EMC) method. Nowadays, the clamping device is used to hold workpiece in the electrically driven chucking system and is needed to produce a huge clamping force of 40 kN like hydraulic system. The design algorithm for electromagnetic linear actuator can be obtained using the EMC method. At first, the parameter map is used to decide the slot width ratio in the initial design. Next, to make the magnetic flux density uniform at each pole, the pole width is adjusted by the pole width adjusting algorithm with EMC. When the dimensions of the electromagnetic linear actuator are decided, the clamping force is calculated to check the desired clamping force. The design results show that it can be used to hold a workpiece firmly instead of using a hydraulic cylinder in a chucking system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.89-94
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• 2001

A cylindrical capacitance-type spindle displacement sensor was designed and tested in the hard turning as a way to develop a sensor that can estimate cutting forces without using a tool dynamometer. The displacement sensor was installed between the face of spindle cover and the chucking element, and measured pure radial motion of the spindle. Ceramic inserts and tool steel workpieceof 65 Rc were used during the hard turning tests. The signals from the sensor showed the same pattern of cutting force variations as those from the tool dynamometer. The research results showed that the developed sensor could be utilized as an effective and cheap on-line sensing device to estimate cutting forces.