• 제목/요약/키워드: Chucked-wafer flatness

검색결과 1건 처리시간 0.016초

웨이퍼 장착을 이용한 다이싱 척의 평탄도 평가 방법에 관한 연구 (A Study on the Flatness Evaluation Method of the Dicing Chuck using Chucked-wafer)

  • 육인수;이호철
    • 한국공작기계학회논문집
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    • 제17권3호
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    • pp.53-58
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    • 2008
  • This study was conducted to evaluate the flatness of the porous type of dicing chuck. Two measurement systems for a vacuum chuck with a porous type of ceramic plate were prepared using a digital indicator and a laser interferometer. 6 inch of silicon and glass wafer were also used. Vacuum pressure from 100mmHg to 700mmHg by 100mmHg was increased. From experiments, chucked-wafer flatness was converged to the dicing chuck flatness itself even though the repeatability of contact method using indicator was unstable. Finally, the chuck flatness was estimated below $2{\mu}m$ with peak-to valley value.