• 전기전자학회논문지
• /
• 제17권3호
• /
• pp.241-247
• /
• 2013

This paper presents the design of a System on Programmable Chip (SoPC) based on Field Programmable Gate Array (FPGA) for speech recognition in which Mel-Frequency Cepstral Coefficients (MFCC) for speech feature extraction and Vector Quantization for recognition are used. The implementing process of the speech recognition system undergoes the following steps: feature extraction, training codebook, recognition. In the first step of feature extraction, the input voice data will be transformed into spectral components and extracted to get the main features by using MFCC algorithm. In the recognition step, the obtained spectral features from the first step will be processed and compared with the trained components. The Vector Quantization (VQ) is applied in this step. In our experiment, Altera's DE2 board with Cyclone II FPGA is used to implement the recognition system which can recognize 64 words. The execution speed of the blocks in the speech recognition system is surveyed by calculating the number of clock cycles while executing each block. The recognition accuracies are also measured in different parameters of the system. These results in execution speed and recognition accuracy could help the designer to choose the best configurations in speech recognition on SoPC.

• 한국생산제조학회지
• /
• 제26권1호
• /
• pp.66-73
• /
• 2017

This study attempted to design lights with Type II distribution suitable for LED street lights based on the regulations of street light distribution developed by the Illuminating Engineering Society of North America (IESNA). The shape of an asymmetric lens, different from that of a rotationally symmetric lens, cannot be generated using a simple mathematical formula. In the first trial, the outline of the lens was fixed and simulated to confirm the distribution type. Following ISENA regulations, some problems that occurred during simulations and repeating was be modified that process is how we detected errors. Through optical research and simulations, a lens conforming to the regulations of Type II very short, Type II short, and Type II medium distributions was developed. A prototype was developed using simulation data and it was subjected to distribution tests. The results show that it can compare with property of Type II distribution.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2008년도 추계학술대회논문집
• /
• pp.497-502
• /
• 2008

In this paper, we studied on an attenuation effect of automobile exhaust noise according to the direction of secondary sound source in duct ANC system. Automobile exhaust noise was recorded at 800rpm. 3500rpm and 5000rpm of a diesel engine. Directions of loudspeaker(second sound source) can be exchanged to $30^{\circ}$, $90^{\circ}$ and $150^{\circ}$ against the primary noise flow by acrylic ducts to be made for experimentation. DSP board with TMS320C6416 chip of Texas Instrument Co used to control adaptive ANC system. This ANC system is based on the single-channel FxLMS algorithm. In experiment result, when the loud speaker direction was $150^{\circ}$, the attenuation effect showed largely. In case of $90^{\circ}$ duct, the noise was a little increased. In case of $30^{\circ}$ duct, the noise was a little increased or decreased according to the frequency range and the sound pressure(dB) of exhaust noise to comply with engine rpm.

• Journal of Advanced Marine Engineering and Technology
• /
• 제38권9호
• /
• pp.1125-1130
• /
• 2014

본 논문에서는 디지털 신호처리 기술에 기반하여 주변잡음에 강건한 선박용 음향수신장치를 제안한다. 원하지 않는 주변 잡음을 억제하기 위하여 70Hz-820Hz의 통과대역을 갖는 디지털 대역통과 필터를 적용한다. 4개의 마이크로폰으로부터 입력된 음향 신호들이 디지털 대역통과 필터를 거친 후 8 방향의 방향 탐지가 가능한 방향 탐지 알고리즘을 제안한다. 또한, DSP 칩과 오디오 코덱을 이용한 프로토타입 시스템을 구현하여 본 알고리즘의 동작을 테스트한다.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제13권2호
• /
• pp.109-116
• /
• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• 한국전자파학회논문지
• /
• 제11권1호
• /
• pp.55-62
• /
• 2000

본 논문에서는 휴대전화 단말기(핸드폰) 안테나를 co-planar 급전 구조의 회로기판상에 표면장착 가능한 칩형태로 설계 하였다. 설계된 안테나는 유전체 세락믹 ($\varepsilon_{\tau}$=23)을 적층하여 직육면체 형태($7.5mm\times4.5mm\times0.4mm$)로 만들고 그 표면에 $\lambda$/4 파장 모노폴 방사소자를 헬리컬 구조로 형성시켜 제작되었다. 제특성 측정 결과 반사 손실 27.36dB,-10dB 대역폭 76MHz(3.97%), H면 평균이득-9.43dBd로 일반적인 모노폴 안테나 방사 특성을 나타내었다.

• 한국전기전자재료학회논문지
• /
• 제31권6호
• /
• pp.433-436
• /
• 2018

A total internal reflection (TIR) linear lens of size $190(W){\times}5(D){\times}2.1(H)mm^3$ has a directivity of $25^{\circ}$ and was made of a polydimethysiloxane (PDMS) silicone resin with a refractive index of 1.4 and a transmittance of 93% at 365 nm UV wavelength. A light source with a size of $190{\times}25.5mm^2$ was fabricated by installing a TIR linear lens on a chip on board (COB) type LED module mounted with a $1.1{\times}1.1mm^2$ size UV LED. The optical characteristics of the light source showed a maximum irradiation density of $3,840mW/cm^2$ at a working distance of 5 mm and a high uniformity of 91.6% over a $150{\times}25mm^2$ irradiation area. The thermal characteristics of the light source were measured at a supply current of 500 mA. The saturation temperature was reached after 30 min of operation, and measured to be $95^{\circ}C$.

• 한국광학회지
• /
• 제16권4호
• /
• pp.345-353
• /
• 2005

포토 다이오드(photodiode) 조정 방식을 이용해서, 비전 시스템을 장착한 고가의 정밀 자동 조립조정 장비 없이 홀로그램 픽업 모듈을 제작하는 새로운 방법을 제안하였다. 저가격화를 위해서 리드 프레임형의 반도체 레이저와 COB(Chip on Board)형의 포토 다이오드를 사용했고, 초점 에러 신호(focus error, FES) 검출방법은 스팟 사이즈 검출법(spot size detection, SSD), 트랙 에러 신호(tracking error, TES) 검출방법은 삼빔법(3 beam method)을 이용했다. 이를 만족하는 픽업 홀로그램 모듈 광학계를 설계하고, 조립조정 프로세스 수립 및 시스템을 제작하였으며, 조립된 홀로그램 모듈을 이용하여 CD에서 데이터를 검출하는 실험을 통해 제안된 포토 다이오드 조정방식의 유용함을 입증하였다.

• 대한의용생체공학회:의공학회지
• /
• 제17권4호
• /
• pp.499-506
• /
• 1996

Blood flow velocimeter is an essential device to measure the blood flow in skin tissue. In this study, we developed a high-speed LDV(laser Doppler Velocimeter) that has real time processing capability using a DSP(digital signal processing) chip and is able to continuously measure information about blood-flow based on a noninvasive method using self-mixing type laser diode. This LDV system has a simpler structure than any other typical blood flow velocimeter and is composed of new self-mixing probe, stabilizer circuits DSP board, and interf'ace boule We measured velocity of speaker-unit by operational frequencies to identify Doppler effect of this system, performed clinical experiment on bare finger tip and compared it with a commercial euipment BPM403A(USA).

• 한국컴퓨터정보학회논문지
• /
• 제23권1호
• /
• pp.33-39
• /
• 2018

In this paper, We studied the possibility of SoC(System On Chip) design using infrared image processing IP(Intellectual Property). And, we studied NUC(Non Uniformity Correction), BPR(Bad Pixel Recovery), and CEM(Contrast Enhancement) processing, the infrared image processing algorithm implemented by IP. We showed the logic and timing diagram implemented through the hardware block designed based on each algorithm. Each algorithm was coded as RTL(Register Transfer Level) using Verilog HDL(Hardware Description Language), ALTERA QUARTUS synthesis, and programed in FPGA(Field Programmable Gated Array). In addition, we have verified that the image data is processed at each algorithm without any problems by integrating the infrared image processing algorithm. Particularly, using the directly manufactured electronic board, Processor, SRAM, and FLASH are interconnected and tested and the verification result is presented so that the SoC type can be realized later. The infrared image processing IP proposed and verified in this study is expected to be of high value in the future SoC semiconductor fabrication. In addition, we have laid the basis for future application in the camera SoC industry.