• 한국표면공학회지
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• 제50권3호
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.

• 대한의용생체공학회:의공학회지
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• 제31권4호
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• pp.292-301
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• 2010

To restore visual sensation of blind patients, we have proposed a fully implantable retinal prosthesis comprising an three dimensionally (3D) stacked retinal chip for transforming optical signal to electrical signal, a flexible cable with stimulus electrode array for stimulating retina cells, and coupling coils for power transmission. The 3D stacked retinal chip is consisted of several LSI chips such as photodetector, signal processing circuit, and stimulus current generator. They are vertically stacked and electrically connected using 3D integration technology. Our retinal prosthesis has a small size and lightweight with high resolution, therefore it could increase the patients` quality of life (QOL). For realizing the fully implantable retinal prosthesis, we developed a retinal prosthesis module comprising a retinal prosthesis chip and a flexible cable with stimulus electrode array for generating optimal stimulus current. In this study, we used a 2D retinal chip as a prototype retinal prosthesis chip. We fabricated the polymide-based flexible cable of $20{\mu}m$ thickness where 16 channels Pt stimulus electrode array was formed in the cable. Pt electrode has an impedance of $9.9k{\Omega}$ at 400Hz frequency. The retinal prosthesis chip was mounted on the flexible cable by an epoxy and electrically connected by Au wire. The retinal prosthesis chip was cappted by a silicone to pretect from corrosive environments in an eyeball. Then, the fabricated retinal prosthesis module was implanted into an eyeball of a rabbit. We successfully recorded electrically evoked potential (EEP) elicited from the rabbit brain by the current stimulation supplied from the implanted retinal prosthesis module. EEP amplitude was increased linearly with illumination intensity and irradiation time of incident light. The retinal prosthesis chip was well functioned after implanting into the eyeball of the rabbit.

• Journal of Welding and Joining
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• 제26권3호
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• KSBB Journal
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• 제18권5호
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• pp.429-433
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• 2003

LAL 측정용 chip을 제작하기 위해서 우선 시료의 부피 감소에 대한 비탁법과 비색법을 비교하였다. 비색법은 낮은 부피에서 높은 감도를 보여 주었으며 시료의 부피와 무관하게 같은 endotoxin의 농도에서는 같은 흡광도를 보인다는 결론을 얻었다. Endotoxin의 농도에 따른 표준곡선을 end point법과 kinetic point법을 비교한 결과 대한약전의 기준에 적합한 kinetic point법이 적합하였다. 이러한 기초 실험결과를 통해 PDMS LOC를 제작하여 LAL 시험을 수행하였다. LOC를 이용하여 더 짧은 시간과 더 작은 시료로 시험이 가능하도록 하였다. 특히 PDMS LOC는 복잡한 channel을 쉽게 만들 수 있을 뿐 아니라 mold를 이용하여 상용화를 위한 대량 생산이 가능하다. 따라서 PDMS를 이용한 LOC의 제작과 실험을 통해 기존의 수작업의 LAL 시험을 LOC를 이용한 다중시료 측정과 자동화의 가능성을 제시하였다.

• 한국정밀공학회지
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• 제1권2호
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• pp.24-32
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• 1984

The object of the study is to discuss the effect of magic ink as a surface active substance on the mechanism of chip formation in oblique cutting. The Rehbinder effect has been known as a phenomenon that the mechanical strength reduces when the metal is coated with some surface active substances. In order to interpret these surface effects defined by Rehbinder, the influence on the shear strength of shear plane by coating surface active substances, cutting force by the depth of cut, surface roughness and hardness ratio were observed. The results are as follows: 1. By coating the magic ink on free surface of the forming chip, the effective shear angle increases, and the cuttinbg force and the deformed chip thickness decreases. 2. With the large inclination angle the effective shear angle increases, and the specific cutting force and the friction angle decrease. 3. Cutting of the coated surface improves the surface roughness and the hardness ratio drops, which means another Rehbinder effect.

• 한국생산제조학회지
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• 제8권3호
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• pp.83-91
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• 1999

In this paper, we suggest a virtual machining system that can simulate cutting forces of ball end milling at the stage of part design. Cutting forces, here, are estimated from the machanistic model that uses the concept of specific cutting farce coefficient. To this end, we need undeformed chip thickness which is used for calculating chip load. It is derived from the Z-map data of a CAD model. That is, chip load is the height difference between the cutting tool and the workpiece at an arbitrary position. The tool contact point is referred from the cutter location data. On the other hand, the workpiece height is acquired from the Z-map model of a CAD data. From the experimental verification, we can simulate machining process effectively to the slot and the side cutting of ball end mill.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 춘계학술대회 논문집
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• pp.942-946
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• 1997

In this research,we suggest a virtual machining system that can simulate sutting forces at the stage of design. Cutting forces,here, are modeled form the machanistic model of the ball end milling. To this end, we need undeformed chip thickness which is used for calculating chip load. It is derived form the z-map data of a CAD model. That is, chip load is the height difference between the cutting tool contact point and the workpiece at arbitrary position. The tool contact point is referred from the cutter location. Form the experimental verification, we can simulate machining process effectively to the slot and the side cutting of ball end mill.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.223-228
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• 2003

In end milling processes, characterized by use of rotating tools, the underformed chip thickness varies periodically with the phase change of tool. In current study, as a new approach to analyse shear behaviors In the shear plane and chip-tool friction behavior chip-tool contact region during an end milling process. In this approach, an up-end milling process is transformed into an equivalent oblique cutting process. Experimental investigations for two sets of cutting tests i.e.. up-end milling and the equivalent oblique cutting test were performed to verify the presented model.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국정밀공학회지
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• 제2권2호
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• pp.69-75
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• 1985

The object of this study is to discuss the effect of cutting fluid on the mechanism of chip formation in orthogonal cutting. Rehbinder effect has been known as a phenomenon, the reduction of mechanical strength, when the metal is exposed in a polar organic environment or the surface of metal is coated with some polar organic substances. About the cause of Rehbinder effect there have been many different ideas by Rehbinder, Merchant, Shaw, Sakakida and etc. In this report, the effects of surface active medium (magic ink) upon the mechanism of chip formation on the orthogonal cutting of copper and the mechanical properties of the work material are experimentally discussed with constant rake angle. Under the condition of polar organic environment the experimental results are as follows; 1) The chip thickness becomes thinner and slip line pitch on the free surface of chip becomes smaller than that of dried cutting area. 2) The order of alternation of cutting ratio was changed. 3) The friction angle on the tool face is not affected by the depth of cut. 4) The cutting force and shear strain on the shear plane decrease remarkably, therefore the work material must be embrittled under polar organic environment.