• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1069-1077
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• 2011

In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.239-245
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• 2016

In this study, a 12 V PWM boost converter was designed with the optimal values of the external components of the power stage was well as the compensation stage for smart electronic applications powered by a battery device. The 12 V boost PWM converter consisted of several passive elements, such as a resistor, inductor and capacitor with a diode, power MOS switch and control IC chip for the control PWM signal. The devices of the power stage and compensation stage were designed to maintain stable operation under a range of load conditions as well as achieving the highest power efficiency. The results of this study were first verified by a simulation in SPICE from calculations of the values of major external elements comprising the converter. The design was also implemented on the prototype PCBboard using commercial IC LM3481 from Texas Instruments, which has a nominal output voltage of 12 V. The output voltage, ripple voltage, and load regulation with the line regulation were measured using a digital oscilloscope, DMM tester, and DC power supply. By configuring the converter under the same conditions as in the circuit simulation, the experimental results matched the simulation results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.12
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• pp.1350-1359
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• 2008

This paper presents a wideband doubly balanced resistive mixer fabricated using $0.5{\mu}m$ GaAs p-HEMT process. Three baluns are employed in the mixer. LO and RF baluns operating over an 8 to 20 GHz range were implemented with Marchand baluns. In order to reduce chip size, the Marchand baluns were realized by the meandering multicoupled line and inductor lines were inserted to compensate for the meandering effect. IF balun was implemented through a DC-coupled differential amplifier. The size of IF balun is $0.3{\times}0.5\;mm^2$ and the measured amplitude and phase unbalances were less than 1 dB and $5^{\circ}$, respectively from DC to 7 GHz. The mixer is $1.7{\times}1.8\;mm^2$ in size, has a conversion loss of 5 to 11 dB, and an output third order intercept(OIP3) of +10 to +15 dBm at 16 dBm LO power for the operating bandwidth.