• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.22-27
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• 1993

The finite element method is applied to analyze the mechanism of metal cutting. This paper introduces some effects, such constitutive deformation laws of workpiece material, friction of tool-chip contact interfaces, tool rake angles and also simulate the cutting process, chip formation and geometry, tool-chip contact, reaction force of tool, cutting temperature. Under the usual [lane strain assumption, quasi-static analysis were performed with variation of tool-chip interface friction coefficients and rake angles. In this analysis, various cutting speeds and depth of cut are adopted. Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction forces on tool. Cutting temperature and Thermal behavior. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Journal of the Korean Society for Precision Engineering
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• v.6 no.1
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• pp.45-51
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• 1989

In metal cutting various types of chips are produced in consequence of cutting conditions. According to the type of chips the cutting mechanism is to be changed. Most of the cutting theory is based on the continuous chip because of its convenient analysis, but the occurrence of the saw-toothed chip depends upon the workpiece and/or the cutting conditions, one of which is titanium alloy used widely. Nowadays titanium alloys are used widely with the rapid development of aerospace structural engineering application, whereas the theory of cutting mechanism has not been established yet, and the formatting process has not been understood satisfactorily, either. Unfortunately several misconceptions, conflicting statements and statements needing further clarifi- cation are also found. In this paper an attempt is made to clarify the formation process of saw-toothed chips which are to be produced during the orthogonal cutting process of titanium alloys. They were machined at low speed to avoid the rapid tool wear. We observed the SEM-photographs of chips taken at the quick-st- opping device. It is hoped that a rational model of the mechanics of cyclic chip formation can be developed. The results obtained are as follows. 1. When a saw- toothed chip is formed, the shear band begins at the primary shear zone and trans- fers to the free surface, so that a segment is produced and it is completed by upsetting between the formatting segment and the formatted segment. 2. As the rake angle or the clearance angle increases in the machining of the titanium alloy, the chip approaches to that of the continous type. 3. When the rake angle and the clearance angle are increased the shear energy and the unit friction energy decrease, which shows the same aspect as that of the continuous chip.

• Journal of the Korean Society for Precision Engineering
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• v.1 no.2
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• pp.24-32
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• 1984

The object of the study is to discuss the effect of magic ink as a surface active substance on the mechanism of chip formation in oblique cutting. The Rehbinder effect has been known as a phenomenon that the mechanical strength reduces when the metal is coated with some surface active substances. In order to interpret these surface effects defined by Rehbinder, the influence on the shear strength of shear plane by coating surface active substances, cutting force by the depth of cut, surface roughness and hardness ratio were observed. The results are as follows: 1. By coating the magic ink on free surface of the forming chip, the effective shear angle increases, and the cuttinbg force and the deformed chip thickness decreases. 2. With the large inclination angle the effective shear angle increases, and the specific cutting force and the friction angle decrease. 3. Cutting of the coated surface improves the surface roughness and the hardness ratio drops, which means another Rehbinder effect.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.78-82
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• 2001

This paper presents the numerical analysis and experimental verification to know the metal cutting burr formation mechanism in face milling operation. Finite element method are applied to predict the 2-D burr formation process prediction. Face milling process are adjusted to analyze the characteristics of burr shapes according to various cutting conditions. The cutting parameters were investigated with cutting speed, feed rate, depth of cut. Through a few experiments, various burr types are classified according to its shape and properties.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1768-1771
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• 2003

Hard turning replaces grinding for finishing process with expectations of higher productivity and demanded surface quality. Especially for the surface roughness as surface quality demanded in finishing process of hard turning, know-how of machining characteristics of hardened materials by cutting force analysis should be accumulated in company with achievement of precision of elements and high stiffness design technology in hard turning. Considering chip formation mechanism of hardened materials, adequate cutting conditions are selected for machining experiments and cutting forces are measured according to cutting conditions. Increase of cutting forces especially thrust force and increase of dynamic instability could occur in hard turning. Analysis of dynamic characteristics of the cutting forces is executed to investigate relation between dynamic instability and surface roughness in hard turning. Investigation on effects of relative motion of machining system generated by vibration due to dynamic instability shows that ultimate surface roughness could be predicted considering relative motion of machining system with geometrical surface roughness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.29-35
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• 2006

Various types of elliptical motions are generated by PZT mechanism which is composed of two parallel piezoelectric actuators. Elliptical vibration cutting(EVC) is obtained by attaching single crystal diamond cutting tool to the mechanism, and V-grooving for Brass and Aluminum is carried out by applying the EVC. It is experimentally observed that the cutting force in the process of the EVC reduces compared to the ordinary non-vibration cutting, which is due to the decrease of undeformed chip thickness and frictional force between the tool and chip. Ultrasonic elliptical vibration cutting(UEVC) suppresses burr formation and decreases cutting force still more, so UEVC makes it possible to enhance the shape accuracy of machined surface.

• Korean Journal of Materials Research
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• v.16 no.2
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• pp.99-105
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• 2006

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

• Journal of the Korean Ceramic Society
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• v.29 no.12
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• pp.956-962
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• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.83-88
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• 1993

Recently, the analysis of microcutting with submicrometer depth of cut is tried to get a more high quality surface product, but to get a valuable result another method instead of conventional finite element method must be considered because finite elment method is impossible for a very small focused region and mesh size. As the altermative method, Molecular Dynamics or Statics is suggested and acceoted in the field of microcutting, indentation and crack propagation. In this paper using Molecuar Dynamics simulation, the phenomena of microcutting with subnanometer chip thickness is studied and the cutting mechanism for tool edge configuration is evaluated. As the result of simulation the atomistic chip formation is achieved.