• Journal of the Korean Society for Precision Engineering
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• v.25 no.6
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• pp.159-167
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• 2008

Cooling lubricants are used in machining operations in order to reduce friction at the tool-chip and tool-workpiece interfaces, cool both chip and tool, and remove chip. Furthermore, they influence a strong effect on the shearing mechanisms and, consequently, on the machined surface quality and tool wear. However, several researchers state that the costs related to cutting fluids is frequently higher than those related to cutting tools. Moreover, the cooling lubricants cause an increase in both worker's health and social problems related to their use and correct disposal. Therefore, many researchers have focused on the environmentally conscious machining technologies. One of the technologies is known as MQL(Minimum Quantity Lubrication) machining. In this paper, an experimental model to obtain the optimal cutting conditions in MQL turning was suggested, and the effects of cutting conditions on surface roughness and cutting force were analyzed. For these purposes, FFD (Fractional Factorial Design) and RSM (Response Surface Methods) were used for the experiment. Cutting force and surface roughness with different cutting conditions were measured through the external cylindrical turning of Al 6061 based on the experiment plan. The measured data were analyzed by regression analysis and verification experiments with random conditions were conducted to confirm the suggested experimental model.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• Journal of Mechanical Science and Technology
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• v.14 no.3
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• pp.350-357
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• 2000

Experiments were performed by using PF-5060 and water to investigate the influence of an aspect ratio of a horizontal rectangular channel on the cooling characteristics from an in-line $6{\times}1$ array of discrete heat sources which were flush mounted on the top wall of the channel. The experimental parameters were aspect ratio of rectangular channel, heat flux of simulated VLSI chip, and channel Reynolds number. The chip surface temperatures decreased with the aspect ratio at the first and sixth rows, and decreased more rapidly at a high heat flux than at a low heat flux. The measured friction factors at each aspect ratio for both water and PF-5060 gave a good agreement with the values predicted by the modified Blasius equation within ${\pm}7%$. The Nusselt number increased as the aspect ratio decreased, but the increasing rate of Nusselt number reduced as the aspect ratio decreased. A 5:1 rectangular channel yields the most efficient cooling performance when the heat transfer and pressure drop in the test section were considered simultaneously.

• Journal of the Korea Safety Management & Science
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• v.4 no.2
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• pp.237-249
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• 2002

A cutting fluid can improve machining quality and tool life by maintaining the tool toughness and by providing a lubrication effect to reduce the friction between the chip and tool interface. Although liquid nitrogen as an environmentally safe coolant has been widely recognized in cryogenic machining, its function as a lubricant is plausible due to its chemical inertness, physical volatility and low viscosity. Since a reduced friction is a direct witness of the lubrication effect from a tribological viewpoint, this paper presents an evaluation of the apparent friction coefficient on the tool-chip interface in cryogenic cutting operations to prove and characterize the lubricity of LN2 in cryogenic machining. The mathematical approaches have been formulated to derive the normal and frictional forces on the tool-chip interface for the oblique cutting tests.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.425-428
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.

• 한국전산유체공학회:학술대회논문집
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• 2011.05a
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• pp.117-123
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• 2011

The low electric power and high efficiency chips are required because of the appearance of smart phones. Also, high-capacity memory chips are needed. e-MMC(embedded Multi-Media Card) for this is defined by JEDEC(Joint Electron Device Engineering Council). The e-MMC memory for research and development is a memory mulit-chip module of 64GB using 16-multilayers of 4GB NAND-flash memory. And it has simplified the chip by using SIP technique. But mulit-chip module generates high heat by higher integration. According to the result of study, whenever semiconductor chip is about 10 $^{\circ}C$ higher than the design temperature it makes the life of the chip shorten more than 50%. Therefore, it is required that we solve the problem of heating value and make the efficiency of e-MMC improved. In this study, geometry of 16-multilayered structure is compared the temperature distribution of four different geometries along the numerical analysis. As a result, it is con finned that a multilayer structure of stair type is more efficient than a multilayer structure of vertical type because a multi-layer structure of stair type is about 9 $^{\circ}C$ lower than a multilayer structure of vertical type.

• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.936-946
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• 2005

The liquid nitrogen as an environmentally safe coolant has been widely recognized in cryo­genic machining, its function as a lubricant is plausible due to its chemical inertness, physical volatility and low viscosity. Since a reduced friction is a direct witness of the lubrication effect from a tribological viewpoint, this paper presents an evaluation of the apparent friction coefficient on the tool-chip interface in cryogenic cutting operations to prove and characterize the lubricity of LN2 in cryogenic machining. The cryogenic cutting technology used in this study is based on a cooling approach and liquid nitrogen delivery system which are intended to apply liquid nitrogen in well-controlled fine jets to selectively localized cutting zones and to penetrate liquid nitrogen to the tool-chip interface. It has been found that the apparent friction coefficient can be significantly reduced in cryogenic machining, depending on the approach of liquid nitrogen delivery.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.11
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• pp.3072-3083
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• 1995

The numerical simulation on the three-dimensional natural convection heat transfer in the enclosure with heat generating chip is performed, and the effects of convective heat loss and vents are also examined. The effects of the Rayleigh number and outer Nusselt number (Nu$_{0}$) on the maximum chip temperature and the fractions of heat loss from the hot surfaces are investigated. The results show that conduction through the substrate is dominant in heat dissipation. With the increase of Rayleigh number, heat dissipation through the chip surfaces increases and heat loss through the substrate decreases. Maximum dimensionless temperature with vents is found to decrease about 40% compared to the one without vents at Nu$_{0}$=0.l. It is also shown that effects of size and location of the vents are negligible.ble.

• Journal of the Korea Safety Management & Science
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• v.4 no.2
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• pp.223-235
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• 2002

This paper presents some indirect physical evidences indicating that reduced friction occurs in an economical cryogenic machining process, in which LN2 is applied selectively in well-controlled jets to the localized cutting zone. These evidences include cutting force components, tool wear rate and chip morphology. LN2 reduced the tool wear rate to a great extent and elongated the tool life up to four times compared to emulsion cooling. The friction reduction was further reflected in larger shear angle and less secondary deformation in the chip microstructures. This study also found that the effectiveness of LN2 lubrication depends on the approach how LN2 is applied.