• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.7 no.2
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• pp.266-275
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• 1995

A numerical investigation on the conduction-natural convection-surface radiation conjugate heat transfer in the enclosure having substrate and chips has been performed. A 2-dimensional simulation model is developed by considering heat transfer by conduction, convection and radiation. The solutions to the equation of radiative transfer are obtained by the discrete ordinates method using S-4 quadrature. The effects of Rayleigh number and the substrate-fluid thermal conductivity ratio on the cooling of chip are analyzed. The result shows that radiation is the dominant heat transfer mode in the enclosure.

• Journal of computational fluids engineering
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• v.18 no.2
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• pp.9-16
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• 2013

The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2005.06a
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• pp.1113-1119
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• 2005

The power electric system is one of the most concerning factor for the reliability of the electric propulsion ship. operation in higher temperature decreases the device's reliability and power efficiency. the management of power loss and temperature of switching devices is indispensable for the reliability fo the power electric system. In this paper, IGBT chip of the switching devices is modeled and MIIR(Motor with Inverter Internal to Rotor)type of the propulsion motors is used. these parts interact with each other to calculate the loss and temperature of device. calculated Results is modeled and designed of the control and monitoring system for the electric propulsion system.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.7
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• pp.351-363
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• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• Journal of Power System Engineering
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• v.18 no.3
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• pp.87-92
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• 2014

This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.425-428
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• 2009

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.

• Journal of the Korea Institute of Military Science and Technology
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• v.5 no.2
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• pp.195-206
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• 2002

The conjugate heat transfer from the simulated module in a horizontal channel with the variation of inlet air temperature is experimentally investigated. The aim of this study is to estimate temperature difference between a module and inlet air. This study is performed with the variation of parameters that are inlet air temperature(Ti=25~$55^{\circ}C), thermal resistance( $R_c$=0.05, 4.11, 158 K/W), inlet air velocity(Vi=0.1~1.5m/s), and input power(Q=3, 7 W). The results show that the effect of inlet air temperature is little, at the case of using conductive board. And input power was most effective parameter on the temperature difference between module and Inlet air.

• Journal of Astronomy and Space Sciences
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• v.14 no.2
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• pp.259-268
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• 1997

We present the development process of a prototype CCD imaging system which is being built at Korea Astronomy Observatory(KAO) for astronomical applications. The CCD imaging system requires very low noise and high stability characteristics and is widely used for astronomical purposes from infrared to ultraviolet wavelength regions. However its system design, particularly for the controller design technique, as heart of the system, is not secured in Korea so far. The prototype electronics developed in this study consists of a signal chip controller which was implemented in an EPLD(Erasable Programable Logic Device) and an analog driver, a video processor with a LN2 cooling cryostat. A PC system was employed to control the whole system and to store the image data considering compatibility of the system. We have successfully obtained the first image in the laboratory with the prototype of this imaging system, and an image of the M15 at Sobaeksan Astronomy Observatory.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.8
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• pp.737-743
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• 2004

A fixed-tuned SIS(Superconductor-Insulator-Superconductor) mixer across 120∼180 GHz band has been developed. This mixer employs an SIS chip fabricated by Nobeyama radio observatory which consists of a series array of 6 Nb/Al-Al$_2$O$_3$/Nb junctions in a microstrip line on a fused quartz substrate. The SIS chip is placed at the center of the half-height waveguide mixer mount to have a good incoming signal coupling over the whole frequency band. No mechanical tuner was used in the SIS mixer and the RF signal and local oscillator power are injected to the mixer via a cooled cross-guide coupler. In order to prevent the IF signal loss, the If output impedance of the SIS mixer was matched to the 50 $\Omega$ input impedance of the IF chain. Measured double sideband noise temperatures of a receiver using the SIS mixer are 32∼131 K over 120∼180 GHz band. The developed SIS mixer is now in use for radio astronomical observations on the TRAO 14 m radio telescope.