• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.6
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• pp.114-120
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• 2001

It is necessary to develop a new metal cutting technology which does not use cutting fluid, since cutting fluid can have undesirable effect on workers's health and working environment. For this to be possible, it is necessary to replace the conventional method of using cutting fluid, whose basic functions are removing chip and heat, and providing lubrication between tool and chip. In this work, cooled air is utilized in order to replace cutting fluid. Experiments were carried out while cutting workpiece with HSS flat endmill under a variety of supply conditions for cooled air. Also the performance characteristics of the air cooling system. which was built for the experiments, were carefully analyzed. For the reliable operation of air cooling system. moisture contained in the cooled air had to be removed before being supplied to the workpiece and tools. It was found that depending on the amount of its flow rate the temperature of cooled air changes at the time of injection from the nozzle. The flow rate of cooled air also plays an important role in removing the accumulated chip on the workpiece. After comparing the flank wear for the three cases of using cooled air, cutting fluid, and pure dry technique, it was demonstrated that the level of flank wear was similar for the cases of cooled air and cutting fluid. The pure dry technique, however, showed higher level of flank wear than cooled air.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.7
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• pp.354-360
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• 2008

Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System (OS) and existing hardware support.

• Journal of IKEEE
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• v.23 no.1
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• pp.295-301
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• 2019

A heater in a portable real-time polymerase chain reaction(PCR) system is one of the important factors for controlling the PCR thermocycle precisely. Since heaters are integrated on a small-sized PCR chip for rapid heating and fabricated by semiconductor processes, the cost of producing PCR chips is high. Here, we propose to use chip resistors as an inexpensive and accurate temperature control method. The temperature distribution was simulated using one or two chip resistors on a real-time PCR chip and the PCR chip with uniform temperature distribution was fabricated. The temperature rise and fall rates were $18^{\circ}C/s$ and $3^{\circ}C/s$, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.8
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• pp.667-673
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• 2003

Recent trends in the electronic equipment indicate that the power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the electronic devices. The aim of the present study is to investigate the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices. The influence of the structure of the pin-fin assembly on heat transfer is investigated by porous medium model. The results are compared with the experimental data or correlations of several researchers for the heat transfer coefficients for the channel flow with pin-fin arrays. Finally, the effects of design parameters such as the pin-fin diameter and the spacing are examined.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.2
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• pp.224-235
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• 1999

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1241-1246
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• 2004

The heat flux on a chip is rapidly increasing with decreasing the size of one. It is necessary to properly cool the high heat flux chip. One of the promising cooling methods is to apply CPL heat pipes with porous materials, for example PVA, polyethylene, and powder sintered metal plate and with microchannels in the evaporator. A small scale CPL heat pipe with PVA as wick was designed and manufactured. Since the height difference between the evaporator and the condenser is a crucial parameter in the CPL heat pipes, the performance of the heat pipes depending on the parameter was investigated. The parameter is higher the performance is better. However, the improvement rate of the performance does not increase the increase rate of the height. In addition to, the parameter effect depending on heat input was investigated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.315-320
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• 2004

Cutting fluid usually has been used in order to improve machinability, tool life, surface quality. However, problems such as pollution, costs of chip and fluid treatment caused. In this paper, compressed chilly air was used to machine aircraft parts and investigate possibility and advantage of that. The experiments were carried out in various cutting environments, such as wet and compressed chilly air. With respect to the cutting environment, compressed chilly air gave advantages such as decrease of pollution and easy chip treatment.

• Journal of Chest Surgery
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• v.21 no.2
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• pp.231-239
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• 1988

Currently numerous methods are in use for myocardial hypothermia as a myocardial preservation modality for cardiac operation. During cardiac ischemia after crystalloid cardioplegia[4C GIK solution], topical cold saline[Group I, a=9], topical ice slush[Group II, n=9] and topical ice chip[Group III, a=10] have been compared for myocardial surface cooling in the isolated rat heart model of cardiopulmonary bypass. During postischemic period, hemodynamic functions[aortic flow, coronary flow, peak aortic pressure and heart rate], biochemical enzymatic activities and cellular injuries with electron microscope were evaluated in this isolated rat heart perfusion model. Postischemic aortic flow, cardiac output and peak aortic pressure in Group I and Group II recovered better than Group III.[p< 0.05] Postischemic creatine kinase and lactate dehydrogenase leakages in Group II and Group III increased more than Group l and postischemic mitochondrial swelling in Group III was more severe than Group I, and Group II.[p< 0.05] These results suggest that topical cold saline was the better method than topical ice slush or topical ice chip as a myocardial preservation modality in the isolated rat heart model of cardiopulmonary bypass.

• Food Science and Preservation
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• v.11 no.2
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• pp.250-256
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• 2004

The objectives of this study were to develop a new commercial grain cooler suited to domestic weather and post-harvesting conditions for paddy, and to evaluate the performance. A prototype grain cooler capable of cooling paddy of 200 tons within 24 hours was developed. The grain cooler was designed to control the refrigeration capacity from 0 to 100% by controlling the capacity of compressor with unloading solenoid valve and by changing the flow rates of hot refrigerant gas flowing into reheater and evaporator from compressor. And a controller with one chip microprocessor was developed to control temperature and relative humidity of cooling air. The maximum cooling capacity of the grain cooler was 35,284㎉/hr at condensing/evaporating pressure of 16.5/3.6 kgf/$\textrm{cm}^2$. Maximum flow rate of cooling air was 120 ㎥/min at static pressure of 279 mmAq. The total maximum required power was 22.8㎾, and total required energy was saved from 26.7 to 33.3% of maximum power depending on operating conditions. The coefficient of performance of refrigeration devices and total coefficient of performance of the grain cooler were 4.71 and 1.8, respectively.