• International Journal of Precision Engineering and Manufacturing
• /
• v.9 no.2
• /
• pp.8-10
• /
• 2008

Chemical mechanical polishing (CMP) is a very precise planarization technique where a wafer is polished by a slurry-coated pad. A slurry is dropped on the rotating pad surface and is supplied between the wafer and the pad. This research aims at reducing the slurry consumption and removing waste particles quickly from the wafer. To study the roles of grooves, slurry flows were simulated using the volume of fluid method (two-phase model for air and slurry) for pads with no grooves, and for pads with circular grooves.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.11a
• /
• pp.49-49
• /
• 2007

최근 반도체 소자의 고집적화와 나노 (nano) 크기의 회로 선폭으로 인해 기존에 사용되었던 텅스텐이나 알루미늄 금속배선보다, 낮은 전기저항과 높은 electro-migration resistance가 필요한 Cu 금속배선이 주목받게 되었다. 하지만, Cu CMP 공정 시 높은 압력으로 인하여 low-k 유전체막의 손상과 디싱과 에로젼 현상으로 인한 문제점이 발생하게 되었다. 본 논문에서는, $KNO_3$ 전해액의 농도가 Cu 표면에 미치는 영향을 알아보기 위해 Tafel Curve와 CV (cyclic voltammograms)법을 사용하여 전기화학적 특징을 알아보았고 scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray Diffraction (XRD) 분석을 통해 금속표면을 비교 분석하였다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2002.05a
• /
• pp.56-56
• /
• 2002

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.145-146
• /
• 2012

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2004.11a
• /
• pp.330-330
• /
• 2004

• Proceedings of the Korean Vacuum Society Conference
• /
• 1997.02a
• /
• pp.213-214
• /
• 1997

• Proceedings of the KIEE Conference
• /
• 2005.11a
• /
• pp.151-153
• /
• 2005

Indium tin oxide (ITO) thin film was polished by chemical mechanical polishing (CMP) by the change of process parameters for the improvement of electrical and optical properties of ITO thin film. Light transparent efficiency of ITO thin film was improved after CMP process at the optimized process parameters compared to that before CMP process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.354-355
• /
• 2005

Indium tin oxide (ITO) thin film was polished by chemical mechanical polishing (CMP) by the change of process parameters for the improvement of electrical and optical properties of ITO thin film. Light transparent efficiency of ITO thin film was improved after CMP process at the optimized process parameters compared to that before CMP process.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.149-149
• /
• 2004

반도체 산업이 급속하게 발전함에 따라 고집적, 대용량이 요구되고 있으며, 이에 따라 선폭의 미세화, 웨이퍼 크기의 증가, 패턴의 다층화가 필수적인 조건으로 대두되고 있다. 이러한 요구를 만족시키기 위해서는 고정도의 표면상태와 칩과 웨이퍼 전면에서의 균일한 가공이 필요하다. 따라서 화학 기계적 연마를 통한 안정하고 고성능의 평탄화는 고집적 소자형성에 있어서 핵심 기술이 되고 있다.(중략)

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2003.11a
• /
• pp.402-402
• /
• 2003