• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.150.1-150.1
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• 2014

Showerhead is used as a main part in the semiconductor equipment. The face plate flatness should remain constant and the cleaning performance must be gained to keep the uniformity level of etching or deposition in chemical vapor deposition process. High operating temperature or long period of thermal loading could lead the showerhead to be deformed thermally. In some case, the thermal deformation appears very sensitive to showerhead performance. This paper describes the methods for robust design using computational fluid dynamics. To reveal the influence of the post distribution on flow pattern in the showerhead cavity, numerical simulation was performed for several post distributions. The flow structure appears similar to an impinging flow near a centered baffle in showerhead cavity. We took the structure as an index to estimate diffusion path. A robust design to reduce the thermal deformation of showerhead can be achieved using post number increase without ill effect on flow. To prevent the showerhead deformation by heat loading, its face plate thickness was determined additionally using numerical simulation. The face plate has thousands of impinging holes. The design key is to keep pressure drop distribution on the showerhead face plate with the holes. This study reads the methodology to apply to a showerhead hole design. A Hagen-Poiseuille equation gives the pressure drop in a fluid flowing through such hole. The assumptions of the equation are the fluid is viscous-incompressible and the flow is laminar fully developed in a through hole. An equation can be expressed with radius R and length L related to the volume flow rate Q from the Hagen-Poiseuille equation, $Q={\pi}R4{\Delta}p/8{\mu}L$, where ${\mu}$ is the viscosity and ${\Delta}p$ is the pressure drop. In present case, each hole has steps at both the inlet and the outlet, and the fluid appears compressible. So we simplify the equation as $Q=C(R,L){\Delta}p$. A series of performance curves for a through hole with geometric parameters were obtained using two-dimensional numerical simulation. We obtained a relation between the hole diameter and hole length from the test cases to determine hole diameter at fixed hole length. A numerical simulation has been performed as a tool for enhancing showerhead robust design from flow structure. Geometric parameters for the design were post distribution and face plate thickness. The reinforced showerhead has been installed and its effective deposition profile is being shown in factory.

• Journal of the Korean Electrochemical Society
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• v.14 no.3
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• pp.184-190
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• 2011

$LiMn_2O_4$ with mesoporous hollow sphere shape was synthesized by precipitation method with silica template. The synthesized $LiMn_2O_4$ has nanosized first particle and mesoporous hollow sphere shape. Silica template was removed by chemical etching method using NaOH solution. When the concentration of NaOH solution was increased, first particle size of manganese oxide was decrease and confirmed mesoporous hollow shpere shape. X-ray diffraction(XRD) patterns revealed that the synthesized samples has spinel structure with Fd3m space group. In case the ratio of silica and maganese salt increased, the size of first particles was decreased. The tetragoanal $LiMn_2O_4$ with micron size was synthesized at ratio of silica and manganese salt over 1 : 9. The prepared samples were assembled as cathode materials of Li-ion battery with 2032 type coin cell and their electrochemical properties are examined by charge-discharge and cyclic performance. Electrochemical measurements show that the nano-size particles had lower capacity than micron-size particles. But, cyclic performance of nano-size particles had better than that of micron-size particles.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.1
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• pp.6-13
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• 2012

HVOF thermal spray coating of 80%WC-CoFe powder is one of the most promising candidate for the replacement of the traditional hard chrome plating and hard ceramics coating because of the environmental problem of the very toxic $Cr^{6+}$ known as carcinogen by chrome plating and the brittleness of ceramics coatings. 80%WC-CoFe powder was coated by HVOF thermal spraying for the study of durability improvement of the high speed spindle such as air bearing spindle. The coating procedure was designed by the Taguchi program, including 4 parameters of hydrogen and oxygen flow rates, powder feed rate and spray distance. The surface properties of the 80%WC-CoFe powder coating were investigated roughness, hardness and porosity. The optimal condition for thermal spray has been ensured by the relationship between the spary parameters and the hardness of the coatings. The optimal coating process obtained by Taguchi program is the process of oxygen flow rate 34 FRM, hydrogen flow rate 57 FRM, powder feed rate 35 g/min and spray distance 8 inch. The coating cross-sectional structure was observed scanning electron microscope before chemical etching. Estimation of coating porosity was performed using metallugical image analysis. The Friction and wear behaviors of HVOF WC-CoFe coating prepared by OCP are investigated by reciprocating sliding wear test at $25^{\circ}C$ and $450^{\circ}C$. Friction coefficients (FC) of coating decreases as sliding surface temperature increases from $25^{\circ}C$ to $450^{\circ}C$.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.228-243
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• 1997

The changes of microstructures, morphology of sclerotic dentin and bonding aspects generated by an adhesive resin was investigated. Incisors and premolars showing natural cervical abrasions were collected and conditioned with 10 % phosphoric acid or 10 % maleic acid. The sclerotic dentin specimens were then rinsed and blot-dried and applied with dentin adhesive (All Bond 2) to the conditioned dentin surface. To examine the morphologic change of the sclerotic dentin specimen after etching and bonding procedure, the treated specimens were examined by SEM. To analyze the chemical composition of sclerotic dentin and crystals occluding dentinal tubules, the sclerotic dentin specimen was powdered and examined with X-ray Diffractometer. To investigate the Ca/P weight percent ratio within the dentinal tubules, the sclerotic dentin specimen was fractured perpendicularly to the long axis of the tooth from the center of cervical abrasion lesion and then examined with EDX(Energy Dispersive X-ray) microanalyzer. The results were as follows : 1. The increased width of peritubular dentin and the depositions of the irregular amorphous materials within the dentinal tubules were showed in the sclerotic dentin specimens. 2. After the treatment of sclerotic dentin specimen with 10 % phosphoric acid or 10 % maleic acid, the lateral side of tubules rather than cross-sectional tubule openings was showed exclusively at the incisal and gingival incline of the specimens. 3. After the treatment of sclerotic dentin specimen with 10 % phosphoric acid or 10 % maleic acid, the hybrid layer was not formed evidently and the resin tag was not formed or shortly penetrated into the tubules with the thinner diameter. 4. According to the results of XRD analysis of the sclerotic dentin specimen, Hydroxyapatite and Octacalcium phosphate were predominent, however, Whitlockite crystals were rare. 5. The mean Ca/P weight percent ratio analysed from 5 fractured sclerotic dentin specimens was $2.322{\pm}0.170$ at the intertubular dentin, $1.826{\pm}0.051$ within the dentinal tubule.

• Korean Journal of Optics and Photonics
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• v.3 no.4
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• pp.258-265
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• 1992

A low loss optical waveguide of $P_{2}O_{5}-SiO_{2}$on Si substrate is produced by using the chemical vapour deposition method of $SiO_2$ thin films used in Si technology. Propagation loss of the waveguide layer was 1.65 dB/cm as produced and reduced down to 0.1 dB/cm after heat treatment at $1100^{\circ}C$. By using laser lithography and reactive ion etching method $P_{2}O_{5}-SiO_{2}$ waveguide was produced and subsequently annealed at $1100^{\circ}C$.As a result of this annealing the shape of the waveguide core was changed from rectangular to semi-circular form, and the propagation loss was reduced as down to 0.03 dB/cm at 0.6328$\mu$m and 0.04dB/cm at 1.53$\mu$m. We think that the mechanism of the reduction in propagation loss during the heat treatment is the following: 1) The hydrogen bonding in waveguide layer, which causes absorption loss, is dissociated and diffused out. 2) The roughness of the interface and the micro-structure of the waveguide layer is removed. 3) The irregularities in the cross-sectional shape of the waveguide which was induced during the lithographic process were disappeared by flowing of the waveguide core.

• Journal of rehabilitation welfare engineering & assistive technology
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• v.11 no.2
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• pp.133-141
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• 2017

The hybrid acoustic sensor for implantable hearing aid has the structure in which a sound pressure based acoustic sensor (ECM) and a vibration based acceleration sensor are combined. This sensor combines the low frequency sensitivity of an acoustic sensor with the high frequency sensitivity of an acceleration sensor, allowing the acquisition of a wide range of sound from low to high frequency. In this paper, an acceleration sensor for use in a hybrid acoustic sensor has been proposed. The acceleration sensor captures the vibration of the tympanic membrane generated by the acoustic signal. The size of the proposed acceleration sensor was determined to diameter of 3.2 mm considering the anatomical structure of the tympanic membrane and the standard of ECM. In order to make the hybrid acoustic sensor have high sensitivity and wide bandwidth characteristics, the aim of the resonance frequency of the acceleration sensor is to be generated at about 3.5 kHz. The membrane of the acceleration sensor derives geometric structure through mathematical model and finite element analysis. Based on the analysis results, the membrane was implemented through a chemical etching process. In order to verify the frequency characteristics of the implemented membrane, vibration measurement experiment using external force was performed. The experiment results showed mechanical resonance of the membrane occurred at 3.4 kHz. Therefore, it is considered that the proposed acceleration sensor can be utilized for a hybrid acoustic sensor.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.149-158
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• 2005

This paper describes design, fabrication, and application of the silicon based temperature controllable micro reactor. In order to achieve fast temperature variation and low energy consumption, reaction chamber of the micro reactor was thermally isolated by etching the highly conductive silicon around the reaction chamber. Compared with the model not having thermally isolated structure, the thermally isolated micro reactor showed enhanced thermal performances such as fast temperature variation and low energy consumption. The performance enhancements of the micro reactor due to etched holes were verified by thermal experiment and numerical analysis. Regarding to 42 percents reduction of the thermal mass achieved by the etched holes, approximately 4 times faster thermal variation and 5 times smaller energy consumption were acquired. The total size of the fabricated micro reactor was $37{\times}30{\times}1mm^{3}$. Microchannel and reaction chamber were formed on the silicon substrate. The openings of channel and chamber were covered by the glass substrate. The Pt electrodes for heater and sensor are fabricated on the backside of silicon substrate below the reaction chamber. The dimension of channel cross section was $200{\times}100{\mu}m^{2}$. The volume of reaction chamber was $4{\mu}l$. The temperature of the micro reactor was controlled and measured simultaneously with NI DAQ PCI-MIO-16E-l board and LabVIEW program. Finally, the fabricated micro reactor and the temperature control system were applied to the thermal denaturation and the trypsin digestion of protein. BSA(bovine serum albumin) was chosen for the test sample. It was successfully shown that BSA was successfully denatured at $75^{\circ}C$ for 1 min and digested by trypsin at $37^{\circ}C$ for 10 min.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Korean Journal of Metals and Materials
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• v.48 no.5
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• pp.456-461
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• 2010

We investigated the In-based ohmic contacts on Nitrogen-face (N-face) n-type GaN, as well as Ga-face n-type GaN, for InGaN-based vertical Light Emitting Diodes (LEDs). For this purpose, we fabricated Circular Transfer Length Method (CTLM) patterns on the N-face n-GaN that were prepared by using a laser-lift off method, as well as on the Ga-face n-GaN that were prepared by using a dry etching method. Then, In/transparent conducting oxide (TCO) and In/TiW schemes were deposited on the CTLM in order for low resistance ohmic contacts to form. The In/TCO scheme on the Ga-face n-GaN showed high specific contact resistance, while the minimum specific contact resistance was only 3${\times}$10$^{-2}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$, which can be attributed to the high sheet resistance of the TCO layer. In contrast, the In/TiW scheme on the Ga-face n-GaN produced low specific contact resistance of 2.1${\times}$10$^{5}$ $\Omega$-cm$^{2}$ after annealing at 500${^{\circ}C}$ for 1 min. In addition, the In/TiW scheme on the N-face n-GaN also resulted in a low specific contact resistance of 2.2${\times}$10$^{-4}$ $\Omega$-cm$^{2}$ after annealing at 300${^{\circ}C}$. These results suggest that both the Ga-face n-GaN and N-face n-GaN.

• Korean Chemical Engineering Research
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• v.52 no.3
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• pp.382-387
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• 2014

The PC/ABS blends were manufactured with high shear rate processing. Changes of the blend morphology were analyzed according to the screw speed and processing time. To find optimal conditions of the high shear rate processing of the PC/ABS blend, blend morphology and size of the dispersed phase, ABS, were observed with a SEM. Also, tensile properties of the PC/ABS blends were measured to investigate the effect of the high shear rate process with the screw speed of 500 rpm to 3000 rpm for processing times of 10s to 40s. Especially, to observe the dispersed phase of the PC/ABS blend clearly, fracture surfaces of the PC/ABS blend were etched with chromic acid solution. As screw speed and processing time increase, dispersed phase size of the PC/ABS blend decreases and mechanical properties of the blend decrease as well. Especially, at screw speed over than 1000 rpm of high shear rate processing, mechanical properties of the PC/ABS blends decrease drastically due to the degradation of the blend during the high shear rate processing. Consequently, the optimal condition of screw speed of the high shear processing of the PC/ABS blend is set at 1000rpm, in this study. Under optimal condition, the PC/ABS blend has relatively high mechanical properties with the relatively stable micro-structure having nanometer scale dispersed phase.