• 제목/요약/키워드: Characteristics of PB

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무연 도금 솔더의 특성 연구: Sn-Cu 및 Sn-Pb 범프의 비교 (Study on the Characteristics of Electroplated Solder: Comparison of Sn-Cu and Sn-Pb Bumps)

  • 정석원;정재필
    • 한국표면공학회지
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    • 제36권5호
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    • pp.386-392
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    • 2003
  • The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

전해도금에 의해 제조된 플립칩 솔더 범프의 특성 (Characteristics of Sn-Pb Electroplating and Bump Formation for Flip Chip Fabrication)

  • 황현;홍순민;강춘식;정재필
    • Journal of Welding and Joining
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    • 제19권5호
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    • pp.520-525
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    • 2001
  • The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

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Entropy, enthalpy, and gibbs free energy variations of 133Cs via CO2-activated carbon filter and ferric ferrocyanide hybrid composites

  • Lee, Joon Hyuk;Suh, Dong Hack
    • Nuclear Engineering and Technology
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    • 제53권11호
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    • pp.3711-3716
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    • 2021
  • The addition of ferric ferrocyanide (Prussian blue; PB) to adsorbents could enhance the adsorption performance of 133Cs. Toward this goal, we present a heterogeneously integrated carbonaceous material platform consisting of PB in direct contact with CO2-activated carbon filters (PB-CACF). The resulted sample retains 24.39% more PB than vice versa probed by the ultraviolet-visible spectrometer. We leverage this effect to capture 133Cs in the aqueous environment via the increase in ionic strength and micropores. We note that the amount of PB was likely to be the key factor for 133Cs adsorption compared with specific surface characteristics. The revealed adsorption capacity of PB-CACF was 21.69% higher than the bare support. The adsorption characteristics were feasible and spontaneous. Positive values of 𝜟Ho and 𝜟So show the endothermic nature and increased randomness. Based on the concept of capturing hazardous materials via hazardous materials, our work will be of interest within the relevant academia for collecting radionuclides in a sufficient manner.

화산재에 의한 수용액의 납 이온 흡착특성 (Adsorption characteristics of lead ion in aqueous solution by volcanic ash)

  • 김미연;소명기;김영관
    • 상하수도학회지
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    • 제25권3호
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    • pp.359-366
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    • 2011
  • The feasibility of using volcanic ash for lead ion removal from wastewater was evaluated. The adsorption experiments were carried out in batch tests using volcanic ash that was treated with either NaOH or HCl prior to the use. Volcanic ash dose, temperature and initial Pb(II) concentration were chosen as 3 operational variables for a $2^3$ factorial design. Ash dose and concentration were found to be significant factors affecting Pb(II) adsorption. The removal of Pb(II) was enhanced with increasing volcanic ash dose and with decreasing the initial Pb(II) concentration. Pb(II) adsorption on the volcanic ash surface was spontaneous reaction and favored at high temperatures. Calculation of Gibb's free energy indicated that the adsorption was endothermic reaction. The equilibrium parameters were determined by fitting the Langmuir and Freundlich isotherms, and Langmuir model better fitted to the data than Freundlich model. BTV(base-treated volcanic ash) showed the maximum adsorption capacity($Q_{max}$) of 47.39mg/g. A pseudo second-order kinetic model was fitted to the data and the calculated $q_e$ values from the kinetic model were found close to the values obtained from the equilibrium experiments. The results of this study provided useful information about the adsorption characteristics of volcanic ash for Pb(II) removal from aqueous solution.

A:V Ratio 변화에 따른 Sn-37Pb, Sn-4.0Ag-0.5Cu Solder 접합부의 특성 연구 (A Study on Characteristics of Sn-37Pb and Sn-4.0Ag-0.5Cu Solder Joints as Various A:V Ratio)

  • 한현주;임석준;문정탁;이진
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.67-73
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    • 2001
  • To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

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PZT 세라믹의 전기광학적 특성에 관한 연구 (Study for Electro-optic Properties of PZT Ceramics)

  • 김시중;김건;안병준
    • 대한화학회지
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    • 제36권1호
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    • pp.51-56
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    • 1992
  • 페로브스카이트구조를 갖는 $Pb(Zr_{1-y}Ti_y)O_3$ (PZT)계의 $Pb^{2+}$ 위치에 $Nd^{3+}$ 이온을 치환시키면서 그 결정구조와 결합특성을 X-선 회절분석법 및 적외선 분광광도법으로 알아보았으며, 이런 구조변화가 (Pb1-xNdx)(Zr1-yTiy)O3 (PNZT)계의 전기적 및 광학적 특성에 미치는 영향에 대하여 조사하였다. $Pb^{2+}$ 이온이 $Nd^{3+}$ 이온으로 치환될수록 정방성이 감소하며, 8${\sim}$12 mol% 치환되었을 때 입방정계의 구조이다. 결정내의 결합강도는 입방정게의 구조일 때 가장 강하고 높은 투광도를 나타냈으며, PNZT계 화합물이 투광도를 나타내는 것은 전자의 전하-이동 전이에 의한 것으로 생각된다.

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V2O5가 Pb(Sb1/2Nb1/2)O3-Pb(Ni1/3Nb2/3)O3-Pb(Zr, Ti)O3세라믹스의 유전 및 압전특성에 미치는 영향 (The Effect of V2O5 on the Dielectric and Piezoelectric Characteristics of Pb(Sb1/2Nb1/2)O3-Pb(Ni1/3Nb2/3)O3-Pb(Zr, Ti)O3Ceramics)

  • 류주현;남승현;이수호
    • 한국전기전자재료학회논문지
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    • 제16권8호
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    • pp.676-680
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    • 2003
  • In this study, to develop the low temperature sintering ceramics for piezoelectric transformer, PSN-PNN-PZT system ceramics were manufactured as a function of V$_2$O$_{5}$ addition, that is the low melting point oxide. Its dielectric and piezoelectric characteristics were investigated. With increasing the amount of V$_2$O$_{5}$ addition, electromechanical coupling factor(kp) and mechanical quality factor(Qm) were decreased. For piezoelectric transformer application, the 0.1wt% V$_2$O$_{5}$ added specimen sintered at 1,00$0^{\circ}C$ showed the proper value of $\varepsilon$r=1,590, kp=0.51 and Qm=748.m=748.

Adaptor용 압전트랜스포머조성 Pb(Sb1/2Nb1/2)-Pb(Ni1/3Nb2/3)O3-Pb(Zr1Ti)O3세라믹스의 전기적 특성 (Electrical Characteristics of Piezoelectric Transformer Composition Pb(Sb1/2Nb1/2)-Pb(Ni1/3Nb2/3)O3-Pb(Zr1Ti)O3 Ceramics for Adaptor)

  • 윤광희;오동언;류주현
    • 한국전기전자재료학회논문지
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    • 제15권6호
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    • pp.499-503
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    • 2002
  • In this study, to develop the high power piezoelectric transformer for adaptor, PSN-PNN-PZT system ceramics were formulated as a function of $MnO_2$ addition and its dielectric and piezoelectric characteristics were investigated. Multi-layer piezoelectric transformer using an excellent composition was also fabricated and its electrical properties evaluated. The composition ceramics added to 0.5wt%$MnO_2$ showed the maximum value of $k_p=0.61$ and $Q_m=1.321$. As the output power of piezoelectric transformer is increased, its temperature rise increased. At the fixed 18W output power, the transformer was stably operated.

경상분지 동남부 연 · 아연광상에 대한 납 동위원소 연구 (Lead Isotope Study on Lead-Zinc Ore Deposits in the Eastern and Southern Parts of the Gyeongsang Basin)

  • 장병욱;장호완;정창식
    • 자원환경지질
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    • 제28권1호
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    • pp.19-24
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    • 1995
  • 경상분지의 동부와 남부에 분포하는 연 아연광상에서 산출되는 방연석의 납 동위원소 비로부터 광상을 형성한 납이 어떤 기원물질로부터 유래하였는가를 연구하고, 이를 태백산 광화대 내 일부광상들의 납 동위원소 비와 비교 연구하였다. 경상분지내 연 아연광상들의 보통납(common lead) 의 동위원소 비는 $^{206}Pb/^{204}Pb=18.156{\sim}18.377$, $^{207}Pb/^{204}Pb=15.482{\sim}15.638$, $^{208}Pb/^{204}Pb=37.953{\sim}38.605$로서 매우 제한된 영역의 변화를 보인다. 또한 납 동위원소 비들은 광상 납 성장곡선(Cumming과 Richards, 1975)과 평균지각 납 진화곡선(Stacey 와 Kramer, 1975) 의 선상 혹은 하부에 점시 되어 맨틀성분의 개입이 많음을 지시하는 반면, 태백산 광화대의 경우는 진화곡선 상부에 점시 되어 지각 물질의 개입이 많음을 나타내었다. Plumbotectonics Model IV (Zartman과 Haines, 1988)에서는 경상분지의 납들은 대부분 맨틀과 조산대 사이의 영역에, 태백산 광화대의 자료들은 대부분 상부지각선의 선 상이나 그 상부에 점시 된다. 위와같은 납 동위원소 조성이 보여주는 특징과 더불어 경상분지 보통납의 동위원소 비들이 나타내는 선형관계는 낮은 U/Pb와 Th/U의 비를 갖는 기원물질 혹은 결핍맨틀(depleted mantle) 물질과 기반암과 같은 지각 물질간의 혼염에 의한 혼합 아이소크론(mixing isochron)으로 추정된다.

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Corrosion Characteristics of HT-9 in 500℃ and 650℃ Pb-Bi Liquid Metal

  • Song, T.Y.;Cho, C.H.
    • Corrosion Science and Technology
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    • 제5권3호
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    • pp.94-98
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    • 2006
  • The next generation nuclear power reactor will use Pb-Bi as the cooling material. The steel structure materials such as HT-9 used in the reactor suffer from corrosion when they are exposed to high temperature Pb-Bi. Therefore corrosion should be prevented to use Pb-Bi as the coolant material without any safety problem. One method is to control the oxygen content in Pb-Bi. An appropriate amount of oxygen in Pb-Bi can produce a thin oxide layer on steel, and this layer protects the steel from corrosion attack. Since the required oxygen content in Pb-Bi is in the range of $10^{-5}$ to $10^{-7}$ wt%, this small oxygen content can be controlled by flowing a mixture of hydrogen gas and water vapor. The stagnant corrosion test of HT-9 samples was performed by controlling the oxygen content up to 2,000 hours. The corrosion behavior of HT-9 was analyzed at the temperatures of $500^{\circ}C$ and $650^{\circ}C$ with a reduced condition and a oxygen content of $10^{-6}$ wt%.