• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.29-33
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• 2017

This paper presents a development of vision aligner with three channels for the wafer and plate bonding machine in manufacturing of LED. The developed vision aligner consists of three cameras and performs wafer alignment of rotation and translation, flipped wafer detection, and UV Tape detection on the target wafer and plate. Normally the process step of wafer bonding is not defined by standards in semiconductor's manufacturing which steps are used depends on the wafer types so, a lot of processing steps has many unexpected problems by the workers and environment of manufacturing such as the above mentioned. For the mass production, the machine operation related to production time and worker's safety so the operation process should be operated at one time with considering of unexpected problem. The developed system solved the 4 kinds of unexpected problems and it will apply on the massproduction environment.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2017.06a
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• pp.46-48
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• 2017

본 논문에서는 ATSC 3.0 시스템의 고품질 서비스를 위한 채널 본딩 (channel bonding) 송수신기 구조를 제시하고 성능을 확인한다. 채널 본딩은 ATSC 3.0 시스템의 물리 계층 규격에서 두 개 이상의 주파수 대역을 묶어서 더 많은 데이터를 동시에 전송할 수 있다. 시뮬레이션 결과는 채널 본딩을 사용하여 단일 채널을 사용하는 시스템에 비해 데이터율을 최대 2 배 증대시킬 수 있음을 보여준다.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.215-220
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• 2008

A microchannel PCHE is manufactured by the two technologies of micro photo-etching and diffusion bonding. In this paper, heat transfer and pressure drop characteristics by applying various configuration for the flow channel in the microchannel PCHE is experimentally investigated. The flow channel configurations are designed three types such as straight, wavy and offset strip channels. The performance experiment of each configuration is performed for Reynolds numbers in ranges of $100{\sim}700$ under various flow conditions for the hot side and the Reynolds number of cold side is fixed at 350. The inlet temperatures of the hot side and cold side are conducted as $40^{\circ}C$ and $20^{\circ}C$, respectively. The heat transfer performance of wavy channel, which was similar to that of offset strip channel, was much higher than that of straight channel. The effectiveness of wavy channel and offset strip channel was evaluated as about $0.5{\sim}0.9$. The pressure drop of wavy channel was highest among configurations and that of offset strip channel was lower than that of straight channel because the round curved surface of each strip edge was reduced the pressure loss.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1140-1144
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• 2005

A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.10a
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• pp.77-80
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• 2008

본 논문에서는 채널 결합 기법을 고려하여 DOCSIS 3.0 망에서 상향스트림 스케줄러를 설계하고 스케줄링 알고리즘을 제안하였다. 본 논문에서 제안하는 스케줄러는 Bonding Process Module, QoS Service Classifier, Upstream Scheduler, Framing Module 등으로 구성된다. 결합 채널에 대한 대역을 할당하기 위해 균등요구대역 할당알고리즘, 현재 요구대역할당을 고려한 요구대역 할당알고리즘, 이전 MAP의 대역 할당 정보를 고려한 요구대역 할당알고리즘을 제안하였다. 제안한 스케줄러 및 스케줄링 알고리즘의 성능을 비교평가하기 위해 OPNET 기반의 DOCSIS 3.0 시뮬레이션 모델을 개발하고, 시뮬레이션을 수행하였다. 성능평가 결과 CM에서 큐잉 지연과 CMTS에서 데이터 수신량 관점에서 균등요구할당 알고리즘이 우수한 성능을 나타냄을 확인할 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.78-83
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• 1998

A small size cartrideg for FET type electrolyte sensor is designed and faricated with much simplified process by using micromachining tenchiques such as silicon etching andglass bonding. Size of the whole cartideg is 2.4cm*2.5cm, and the dead volume of a micro flow-channel in the cartrideg is only 8.5.mu.l. The photosensitive polymer(THB 30) is used to define a micropool and to encapsulate the sensor surface for standardizationof electrolyte sensors. To miniaturize micro flow-channel conventional reference electrode(Ag/AgCl) a differential amplification is introduced using REFET and quasi reference electrode. Refet was fabricated using photosensitive polymer(OMR 83). The fabricated cartridge with built-in pH-ISFET showed good operational characteristics such as linearity and high sensitivity (55.4mV/pH) in a wide pH range(pH2-pH12).

• Journal of Distribution Science
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• v.15 no.11
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• pp.31-39
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• 2017

Purpose - This research aims to examine the influence of social capital formed on SNS on SNS users' life satisfaction. This research divides social capital into bridging and bonding social capital based on Social Capital Theory and suggests that each type of social capital will have a positive impact on SNS users' life satisfaction. In addition, this research suggests the self-construal of SNS users as a moderating variable based on Self-Construal Theory. Research design, data, and methodology - To test the hypotheses presented, an online survey was conducted with adult participants. An online research company was hired to conduct an online survey; survey participants were volunteer adult participants residing in Korea. And data was analyzed using SPSS. Results - Analysis results showed that the impact of bonding social capital on life satisfaction was not statistically different between SNS users of differing self-construals(independent vs. interdependent self-construal). However, this study also determined that the impact of bridging social capital on life satisfaction was greater for SNS users with an interdependent self-construal as opposed to those with an independent self-construal. Conclusions - The results of this study expand the scope of available research on social capital formed on SNS and provide practical implications for SNS providers.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.1894-1899
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• 2007

This paper presents the thermal characteristics for micro heat exchanger with different micro-channel shapes. The shapes of micro-channel has been manufactured sheet metal by chemical etching for the I shape of straight channel and V and W shapes of chevron feature and fabricated micro plated heat exchangers using the vacuum brazing of bonding technology. The experimental study has been performed on heat transfer and pressure drop characteristics with various Reynolds number for water to water at the counter flows. The average heat transfer rate of V and W shapes has been showed about 1.5${\sim}$1.6 times large than those of I shape. For the comparison of Nusselt number, it is known that the convective heat transfer of V and W shapes represent more effect than I shape. The pressure drops of V and W shapes are about 1.2${\sim}$1.7 times lager than those of I shape.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.123-126
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• 2006

In this study, bottom-up type powder processing and top-down type SPD (severe plastic deformation) approaches were combined in order to achieve full density of carbon nanotube (CNT)/metal matrix composites with superior mechanical properties by improved particle bonding and least grain growth, which were considered as a bottle neck of the bottom-up method using the conventional powder metallurgy of compaction and sintering. ECAP (equal channel angular pressing), the most promising method in SPD, was used for the CNT/Cu powder consolidation. The powder ECAP processing with 1, 2, 4 and 8 route C passes was conducted at room temperature.