Enhancement of Heat Transfer from an Air-Cooled 3-Dimensional Module by means of Heat Spreading in the Board (기판의 열확산에 의한 3차원 공랭모듈로부터의 열전달촉진에 관한 연구)
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- Transactions of the Korean Society of Mechanical Engineers B
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- v.26 no.7
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- pp.1022-1030
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- 2002