• 한국재료학회지
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• 제5권2호
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• pp.151-156
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• 1995

$(Ba, Sr)TiO_{3}$계에 저융점의 Glass물질을 첨가하여 저온소결이 가능하며, 고유전율을 갖는 유전체 재료를 제조하여, 그 특성을 조사하였다. 본 연구에서는 고유전율의 $(Ba, Sr)TiO_{3}$계에 PbO함량이 서로 다른 Glass물질을 첨가하여 조성변화에 따른 저온소결거동 및 유전특성을 조사하였으며, 적층형 세라믹 Capacitor(MLCC)에 응용하기 위하여 다양한 조성으로 제조하였다. $PbO-ZnO-B_{2}O_{2}$계 Glass 성분을 첨가하여 소결온도를 $1350^{\circ}C$에서 $1050^{\circ}C$까지 낮출수 있었으며, 4wt% glass 첨가로 $1150^{\circ}C$ 이하에서 2시간 소결한 저온소결용 재료는 실온에서 8000정도의 높은 비유전율과 0.005의 낮은 유전손실 그리고 광역온도범위에서 유전상수의 안정성을 가진 우수한 특성을 나타내며, 입자크기가 1~3 $\mu$m 정도로 치밀한 미세구조를 가지고 있다. 본 연구의 저온소결용 유전체 재료는 Z5U 규격을 만족시키고 기존의 $BaTiO_{3}$계 재료에 비해 낮은 소결온도를 가지므로 MLCC에 응용시 내부전극으로 Ag-Pd alloy 사용이 가능한 것으로 밝혀졌다.

• 한국세라믹학회지
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• 제44권10호
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• pp.548-553
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• 2007

Ceramic green sheets consisting Bi-based glass frit were fabricated for an application to PDP transparent dielectric front panel. The dispersion condition of the slurry for tape casting was pre-examined, and two kinds of hinder and plasticizer were used in the non-aqueous slurry system. In the fabrication process for the frit film, the properties such as dry and firing shrinkage, elongation, and transmittance were examined at the condition of various mixing ratio of plasticizers. In the mixing ratio of polyethylene glycol to dibutyl phthalate of 3:5wt%, a good adhesion, elongation and transmittance were observed at the firing temperature of $580^{\circ}C$. The photograph for the cross section of the interface was also showed a dense microstructure.

• 한국세라믹학회지
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• 제36권5호
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• pp.490-496
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• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.

• 한국세라믹학회지
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• 제32권5호
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• pp.601-607
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• 1995

The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2004년도 추계총회 및 연구발표회 초록집
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• pp.94.2-94.2
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• 2004

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2004년도 춘계총회 및 연구발표회 초록집
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• pp.47.1-47.1
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• 2004

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.73.2-73
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• 2000

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.75.2-75
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• 2000

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.35-35
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• 2002

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.29.1-29
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• 2002